Gas decomposition reactor feedback control using raman spectrometry

    公开(公告)号:US10207236B2

    公开(公告)日:2019-02-19

    申请号:US15044734

    申请日:2016-02-16

    Abstract: A gas decomposition reactor for the decomposition of a gas into a mixture of solid and gaseous by-products is disclosed. The gas decomposition reactor includes a reactor vessel, a Raman spectrometer, and a processor. The reactor vessel has an inlet for receiving inlet gas and an exhaust outlet for releasing exhaust gas. The Raman spectrometer is connected with the exhaust outlet for determining a chemical conversion within the reactor chamber and generating a corresponding signal. The processor is connected with the Raman spectrometer to receive the signal from the Raman spectrometer. The processor is capable of comparing the signal with a set of values and calculating differences between the signal and the set of values. The processor is connected with the inlet to regulate a flow of the inlet gas.

    TEXTURING RIBBONS FOR PHOTOVOLTAIC MODULE PRODUCTION

    公开(公告)号:US20180026151A1

    公开(公告)日:2018-01-25

    申请号:US15540842

    申请日:2016-01-05

    Abstract: A method for texturing a photovoltaic module ribbon on a photovoltaic cell including a plurality of first electrodes on a first side and a plurality of second electrodes on a second side, and coupling a first photovoltaic module ribbon to the plurality of first electrodes. The method also includes positioning the photovoltaic cell on a textured base having a texture embodied thereon, where the first photovoltaic module ribbon is substantially contacting the texture. The method further includes coupling a second photovoltaic module ribbon to the plurality of second electrodes, and transferring the texture of the textured base to the first ribbon using heat energy released when the second photovoltaic module ribbon is coupled to the plurality of second electrodes.

    Systems and methods for manufacturing diamond coated wires

    公开(公告)号:US09873159B2

    公开(公告)日:2018-01-23

    申请号:US14983954

    申请日:2015-12-30

    CPC classification number: B23D65/00 B23D61/185 B28D5/045

    Abstract: A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

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