公开(公告)号：US08847757B2

公开(公告)日：2014-09-30

申请号：US12791258

申请日：2010-06-01

申请人： Eun Ji Kim ,  Byung Sung Kim ,  Myoung Ji Nam ,  Tae Ho Kang

发明人： Eun Ji Kim ,  Byung Sung Kim ,  Myoung Ji Nam ,  Tae Ho Kang

IPC分类号： G05B19/00 ,  G06F3/01 ,  H04M1/60 ,  H04M1/725

CPC分类号： G06F3/017 ,  H04M1/60 ,  H04M1/72522 ,  H04M1/72558 ,  H04M2250/12

摘要： A method for outputting data by using a proximity sensor in a mobile device is provided. The method includes emitting light in a proximity sensing mode and detecting light reflected by a gesture, processing a signal of the detected light, comparing the processed signal with a preset value, providing comparison data based on the compared signal with the preset value, and outputting data converted based on a result of analyzing the comparison data.

摘要翻译： 提供了一种通过使用移动设备中的接近传感器来输出数据的方法。 该方法包括以接近感测模式发射光并检测由手势反射的光，处理检测到的光的信号，将处理的信号与预设值进行比较，基于比较信号与预设值提供比较数据，并输出 基于分析比较数据的结果转换数据。

公开(公告)号：US20140084416A1

公开(公告)日：2014-03-27

申请号：US13943949

申请日：2013-07-17

申请人： Tae-Ho Kang

发明人： Tae-Ho Kang

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/50 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked package includes a first package substrate having a major surface that defines a horizontal plane, first pads on an upper portion of the first package substrate, a multilayer capacitor on the first pads, and a first semiconductor chip on the first package substrate. A second package substrate is provided on the first semiconductor package, and a second semiconductor chip is on the second package substrate. Conductive bumps are provided between the first package substrate and the second package substrate that are vertically aligned with the multilayer capacitor. Signal characteristics in the stacked package may be improved by the multilayer capacitor. Because the multilayer capacitor is formed in the stacked package it may provide for an increased degree of integration.

摘要翻译： 堆叠封装包括具有限定水平面的主表面的第一封装衬底，第一封装衬底的上部上的第一焊盘，第一焊盘上的多层电容器，以及第一封装衬底上的第一半导体芯片。 第二封装基板设置在第一半导体封装上，第二半导体芯片在第二封装基板上。 导电凸块设置在与多层电容器垂直对准的第一封装衬底和第二封装衬底之间。 堆叠封装中的信号特性可以通过层叠电容器来改善。 由于层叠电容器形成在堆叠封装中，所以可提供增加的集成度。

公开(公告)号：US08362624B2

公开(公告)日：2013-01-29

申请号：US13230052

申请日：2011-09-12

申请人： Tae-Ho Kang ,  Jin-Ho Kim ,  Bo-Seong Kim

发明人： Tae-Ho Kang ,  Jin-Ho Kim ,  Bo-Seong Kim

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L21/00

CPC分类号： H01L24/85 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/838 ,  H01L2224/85138 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided are a multi-chip package and a method of manufacturing the same, which can facilitate wire bonding even when an upper chip is larger than a lower chip or overhangs a lower chip. A multi-chip package includes a substrate having first and second bonding pads on a top surface thereof, a first chip connected to the first bonding pads on the substrate, an insulating layer formed on the substrate so as to surround lateral surfaces of the first chip, a set of openings formed in the insulating layer so as to expose the second bonding pads, and a second chip formed on the insulating layer and the first chip, the second chip having a larger area than the first chip and connected to the second bonding pads using wires that pass through the second openings.

摘要翻译： 提供一种多芯片封装及其制造方法，即使当上芯片大于下芯片或悬垂下芯片时，也可以促进引线键合。 一种多芯片封装，包括在其顶表面上具有第一和第二焊盘的基板，与基板上的第一焊盘连接的第一芯片，形成在基板上以围绕第一芯片的侧表面的绝缘层 ，形成在所述绝缘层中以露出所述第二接合焊盘的一组开口，以及形成在所述绝缘层和所述第一芯片上的第二芯片，所述第二芯片具有比所述第一芯片更大的面积并且连接到所述第二接合 垫使用穿过第二开口的线。

公开(公告)号：US5941163A

公开(公告)日：1999-08-24

申请号：US840156

申请日：1997-04-11

申请人： Young-Gon Park ,  Tae-Ho Kang ,  Dong-Sik Oh

发明人： Young-Gon Park ,  Tae-Ho Kang ,  Dong-Sik Oh

IPC分类号： G07F13/00 ,  A23F5/00 ,  A47J31/00 ,  A47J31/057 ,  A47J31/40 ,  A47J31/44 ,  A47J31/50 ,  G07F13/02 ,  G07F13/06 ,  A47J31/24

CPC分类号： G07F13/065 ,  A47J31/40 ,  A47J31/505

摘要： A brewed coffee vending machine with a coffee reheating device is disclosed. The brewed coffee vending machine includes a ground coffee bean receptacle, a hot water container, a brewing unit, an extractor, and a coffee reheating device that reheats the brewed coffee extracted by the extractor before it is dispensed to the consumer. The coffee reheating device comprises a case in which an electric heating line is embedded; a heating chamber installed inside the case; an intake nozzle installed on one side of the case through which the brewed coffee enters the heating chamber; and an outlet installed on another side of the case through which the reheated coffee exits the coffee reheating device.

摘要翻译： 公开了一种具有咖啡加热装置的冲泡咖啡自动售货机。 酿造的咖啡自动售货机包括研磨的咖啡豆容器，热水容器，冲泡单元，提取器和咖啡加热装置，其在被​​分配到消费者之前对由提取器提取的煮制咖啡进行再加热。 咖啡再加热装置包括嵌入电热线的壳体; 安装在壳体内的加热室; 安装在壳体的一侧的进气喷嘴，冲煮的咖啡通过该进气喷嘴进入加热室; 以及安装在壳体另一侧的出口，再加热的咖啡通过该出口离开咖啡再加热装置。