公开(公告)号：US09437549B2

公开(公告)日：2016-09-06

申请号：US14808656

申请日：2015-07-24

Applicant: VIKING TECH CORPORATION

Inventor： Chien-Hung Ho ,  Chen-Shen Kuo ,  Chun-Chu Wu

IPC: H01L23/538 ,  H01L23/498 ,  H01L31/0203 ,  H01L21/48 ,  B28B11/08 ,  B23K26/38 ,  B24C1/04 ,  B23K26/40 ,  H01L33/64 ,  H01L23/24

CPC classification number: H01L23/5389 ,  B23K26/364 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/52 ,  B24C1/04 ,  B28B11/0863 ,  H01L21/4846 ,  H01L23/24 ,  H01L23/49838 ,  H01L23/49894 ,  H01L31/0203 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Abstract translation: 陶瓷基板的制造方法的特征在于，使用预成形的沟槽，图案化保护层和喷砂工序来制造陶瓷基板中的空腔并控制陶瓷基板的型腔尺寸和形状。 陶瓷基板与基底基板共同构成用于封装半导体芯片的封装基板。 上述制造方法可以降低制造成本并提高陶瓷基板的空腔的尺寸和形状的精度。 上述方法可以降低制造成本并提高陶瓷基板的形状和尺寸的精度。

公开(公告)号：US20150303362A1

公开(公告)日：2015-10-22

申请号：US14517781

申请日：2014-10-17

Applicant: Viking Tech Corporation

Inventor： Chien-Hung Ho ,  Chiu-Min Lee ,  Chen-Shen Kuo

IPC: H01L33/64 ,  H05K1/03 ,  H05K1/11 ,  H01L33/62

CPC classification number: H01L33/642 ,  H01L24/73 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/73257 ,  H01L2224/73265 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

Abstract translation: 提供一种陶瓷基板，包括：板，其具有与第一表面相对的第一表面和第二表面; 设置在第一表面上的第一电接触焊盘; 设置在第二表面上的第二电接触焊盘; 导电柱设置在所述板中并且连接所述第一表面和所述第二表面以电连接所述电接触焊盘和所述第二电接触焊盘; 设置在所述第一表面上的第一导热焊盘; 设置在所述第二表面上的第二导热焊盘; 以及设置在所述板中并且连接所述第一表面和所述第二表面以与所述第一导热焊盘和所述第二导热焊盘接触并耦合的导热柱，其中所述导热柱具有大于或等于宽度的宽度 的导电柱并且大于或等于300微米。