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    FLEXIBLE ENCAPSULATING MATERIAL, PROCESS FOR PREPARING THE SAME AND ENCAPSULATING METHOD USING THE SAME
    21.
    发明申请
    FLEXIBLE ENCAPSULATING MATERIAL, PROCESS FOR PREPARING THE SAME AND ENCAPSULATING METHOD USING THE SAME 审中-公开

    公开(公告)号：US20200181445A1

    公开(公告)日：2020-06-11

    申请号：US16691618

    申请日：2019-11-22

    Applicant: eChem Solutions Corp.

    Inventor： Zong-Hao Tang ,  Hsin-Jen Chen

    IPC: C09D163/00 ,  C08G59/24 ,  C08G59/42 ,  C08G59/68 ,  H01L51/52 ,  H01L51/00

    Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.

    POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNED POLYIMIDE LAYER
    22.
    发明申请
    POSITIVE PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNED POLYIMIDE LAYER 审中-公开

    公开(公告)号：US20200089114A1

    公开(公告)日：2020-03-19

    申请号：US16517666

    申请日：2019-07-22

    Applicant: ECHEM SOLUTIONS CORP.

    Inventor： Ting-Wei Chang ,  Ming-Che CHUNG

    IPC: G03F7/039 ,  G03F7/004

    Abstract: The present invention provides a positive photoresist composition comprising a cresol-type novolac resin, a diazonaphthoquinone-based sensitizer and an organic solvent; based on the cresol-type novolac resin with a total amount of 100 parts by weight, the amount of the diazonaphthoquinone-based sensitizer ranges from 40 parts to 60 parts by weight, the amount of the free cresol in the cresol-type novolac resin is lower than 2 parts by weight, and the alkaline dissolution rate (ADR) of the cresol-type novolac resin in an aqueous solution of 3.5 wt % to 7 wt % tetramethylammonium hydroxide is lower than 285 Å/s. The positive photoresist composition has excellent chemical resistance to the polyimide stripper, and can specifically improve the protective ability of the photoresist layer to the low-dielectric polyimide layer, thereby optimizing the manufacturing process and quality of the patterned polyimide layer.

    Photosensitive insulated resin composition and method of producing insulated film thereof
    24.
    发明授权
    Photosensitive insulated resin composition and method of producing insulated film thereof 有权
    光敏绝缘树脂组合物及其绝缘膜的制造方法

    公开(公告)号：US09529260B1

    公开(公告)日：2016-12-27

    申请号：US15099493

    申请日：2016-04-14

    Applicant: eChem Solutions Corp.

    Inventor： Che Wei Chang ,  Ming Che Chung

    IPC: G03F7/023 ,  G03F7/40 ,  G03F7/022 ,  G03F7/038 ,  G03F7/16

    CPC classification number: G03F7/0226 ,  G03F7/0048 ,  G03F7/022 ,  G03F7/0233 ,  G03F7/038 ,  G03F7/40

    Abstract: The present invention provides a photosensitive insulated resin composition and method of producing an insulated film thereof. The photosensitive insulated resin composition, which comprises the following components, can be evenly coated on a surface step of a substrate in order to form a fully covered insulate film. an alkali soluble resin containing a phenolic group; a quinone diazide-group-containing compound; a crosslinking agent; a high-boiling-point solvent having a boiling point of over or equal to 130° C.; and a low-boiling-point solvent having a boiling point of equal to or lower than 130° C., wherein a difference of the boiling points of the two high-boiling-point solvent and the low-boiling-point solvent is in a range of 30° C.˜100° C., and a ratio of the high-boiling-point solvent to the low-boiling-point solvent in weight is in a range of 8:92˜40:60.

    Abstract translation: 本发明提供一种光敏绝缘树脂组合物及其绝缘膜的制造方法。 包含以下组分的光敏绝缘树脂组合物可以均匀地涂覆在基材的表面台阶上以形成完全覆盖的绝缘膜。 含有酚基的碱溶性树脂; 含醌二叠氮基的化合物; 交联剂; 沸点高于或等于130℃的高沸点溶剂; 和沸点等于或低于130℃的低沸点溶剂，其中两个高沸点溶剂和低沸点溶剂的沸点差为 范围为30℃〜100℃，高沸点溶剂与低沸点溶剂的重量比为8:92〜40:60。

    MASKING LAYER FORMED BY APPLYING DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITIONS ON PANEL STRUCTURE
    25.
    发明申请
    MASKING LAYER FORMED BY APPLYING DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITIONS ON PANEL STRUCTURE 有权
    通过在面板结构上应用可开发的感光树脂组合物形成的掩蔽层

    公开(公告)号：US20150047881A1

    公开(公告)日：2015-02-19

    申请号：US13965436

    申请日：2013-08-13

    Applicant: eChem Solutions Corp.

    Inventor： Shih-Peng Lin ,  Yu-cheng Lai ,  Hsin - Jen Cheng ,  Yan-fu Pan ,  Yi-Lun Chiu ,  Tsung-Mu Yang ,  Chen-Wen Chiu ,  Chia-Ling Luo

    IPC: H05K1/02

    CPC classification number: H05K1/0296 ,  G02F1/133512 ,  G02F2001/133331 ,  G02F2001/133388 ,  G03F7/0005 ,  G03F7/004 ,  G06F2203/04103

    Abstract: The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ≧3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer.

    Abstract translation: 本发明涉及一种掩模层。 通过在透明基板的周边区域上涂布白色感光性树脂组合物而制造的掩模层，显影白色感光性树脂组合物，得到图案化组合物层，在该固化的组合物层上涂布灰色感光性树脂组合物 并显影灰色感光性树脂组合物，使得灰色感光性树脂组合物固化，得到光密度（OD）≥3.5的掩模层。 掩模层适于在触摸面板或平板显示装置上使用。 当从外部观察时，掩蔽层显示出白色外观，并且用作设备周围区域周围的白色装饰。 掩模层还包括灰色子层，以掩蔽设置在掩模层下方的电路。

    Pipe connectable plastic bucket and method of using the same
    26.
    发明授权
    Pipe connectable plastic bucket and method of using the same 有权

    公开(公告)号：US11851236B2

    公开(公告)日：2023-12-26

    申请号：US17700544

    申请日：2022-03-22

    Applicant: eChem Solutions Corp.

    Inventor： Chen Ya Kao ,  Tz Jin Yang

    IPC: B65D8/02 ,  H01L21/67 ,  F16L37/56

    CPC classification number: B65D11/08 ,  F16L37/56 ,  H01L21/67017

    Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

    PIPE CONNECTABLE PLASTIC BUCKET AND METHOD OF USING THE SAME
    30.
    发明申请
    PIPE CONNECTABLE PLASTIC BUCKET AND METHOD OF USING THE SAME 有权

    公开(公告)号：US20220315278A1

    公开(公告)日：2022-10-06

    申请号：US17700544

    申请日：2022-03-22

    Applicant: eChem Solutions Corp.

    Inventor： CHEN YA KAO ,  TZ JIN YANG

    IPC: B65D8/02 ,  F16L37/56 ,  H01L21/67

    Abstract: A pipe connectable plastic bucket includes a bucket and at least two quick-connect devices. The bucket has a plurality of through holes for communication between the inside and the outside of the bucket. The at least two quick-connect devices respectively correspond to the plurality of through holes, and are disposed on the bucket. The at least two quick-connect devices are adapted to connect to pipes, and are used for allowing a fluid entering and exiting the bucket through the plurality of the through holes. The at least two quick-connect devices comprise a first quick-connect device for allowing the liquid to enter and to exit the bucket. The present invention also provides a method of using the pipe connectable plastic bucket.

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