公开(公告)号：US20250153280A1

公开(公告)日：2025-05-15

申请号：US19019729

申请日：2025-01-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Rahul Raut ,  Nirmalya Kumar Chaki ,  Bawa Singh ,  Ranjit Pandher ,  Siuli Sarkar

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/362 ,  B23K101/42 ,  B23K103/08

Abstract: A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.

公开(公告)号：US12233483B2

公开(公告)日：2025-02-25

申请号：US17286704

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Rahul Raut ,  Nirmalyakumar Chaki ,  Bawa Singh ,  Ranjit Pandher ,  Siuli Sarkar

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/362 ,  C22C12/00 ,  B23K101/42 ,  B23K103/08

Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：US11090768B2

公开(公告)日：2021-08-17

申请号：US14698450

申请日：2015-04-28

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K1/00 ,  B23K1/19 ,  C22C13/00 ,  C22C13/02 ,  B23K35/26 ,  H05K3/34 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K1/20 ,  B23K103/12

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

公开(公告)号：US20190262951A1

公开(公告)日：2019-08-29

申请号：US16404909

申请日：2019-05-07

Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Siuli Sarkar ,  Sujatha Chegudi ,  Anil K. N. Kumar ,  Kamanio Chattopadhyay ,  Dominic Lodge ,  Morgana de Avila Ribas

IPC: B23K35/26 ,  B23K35/02 ,  B23K1/005 ,  B23K1/002 ,  C22C13/02 ,  C22C12/00

Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.

公开(公告)号：US10259980B2

公开(公告)日：2019-04-16

申请号：US14438888

申请日：2013-10-29

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: B22F1/00 ,  B22F1/02 ,  C01G5/00 ,  C09C1/62 ,  C09C3/08 ,  C09K5/14 ,  B82Y30/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20180056455A1

公开(公告)日：2018-03-01

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: B23K35/36 ,  C08K5/549 ,  C08K3/04 ,  B23K35/02 ,  H01L23/00 ,  H01L23/29

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.