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公开(公告)号：US11162007B2
公开(公告)日：2021-11-02
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US11139089B2
公开(公告)日：2021-10-05
申请号：US16887455
申请日：2020-05-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Bawa Singh , Ravi Bhatkal , Siuli Sarkar , Anubhav Rustogi
IPC: H01B1/22 , H05K1/09 , B22F1/00 , B22F1/02 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/362 , H05K3/12 , H05K1/18
Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
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公开(公告)号：US20210249376A1
公开(公告)日：2021-08-12
申请号：US17245397
申请日：2021-04-30
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
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公开(公告)号：US10998284B2
公开(公告)日：2021-05-04
申请号：US15302827
申请日：2015-04-10
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Shamik Ghoshal , Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Anubhav Rustogi
IPC: H01L23/00 , B22F1/00 , B23K35/02 , B22F7/04 , H01B1/22 , B22F1/02 , B23K1/00 , B23K35/30 , B23K35/36 , B23K35/365 , B23K101/40 , B23K103/00 , H05K3/32 , H01L25/00 , H01L51/52
Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.
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公开(公告)号：US10682732B2
公开(公告)日：2020-06-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
IPC: C09J163/00 , C08L63/00 , C08K3/00 , C08K3/04 , C08K3/34 , C08K5/54 , C08K9/00 , B23K35/36 , B23K1/00 , B23K35/02 , H01L23/29 , H01L23/00 , C08K5/00 , C08K3/013 , B23K1/20 , C08K7/02 , B23K35/00 , C08K5/549 , B32B27/38 , B23K101/42
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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Patent Agency Ranking
公开(公告)号：US20190255662A1
公开(公告)日：2019-08-22
申请号：US16404959
申请日：2019-05-07
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Ranjit Pandher , Bawa Singh , Siuli Sarkar , Sujatha Chegudi , Anil K. N. Kumar , Kamanio Chattopadhyay , Dominic Lodge , Morgana de Avila Ribas
Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
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公开(公告)号：US20190143461A9
公开(公告)日：2019-05-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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公开(公告)号：US11830640B2
公开(公告)日：2023-11-28
申请号：US17382980
申请日：2021-07-22
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Bawa Singh , Ravi Bhatkal , Siuli Sarkar , Anubhav Rustogi
IPC: H01B1/22 , H05K1/09 , B22F1/17 , B22F1/052 , B22F1/068 , B22F1/107 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/362 , H05K3/12 , H05K1/18
CPC classification number: H01B1/22 , B22F1/052 , B22F1/068 , B22F1/107 , B22F1/17 , B23K35/025 , B23K35/3006 , B23K35/362 , B23K35/3613 , H05K1/095 , H05K3/1216 , H05K3/1241 , B22F2301/255 , B22F2302/45 , B22F2304/10 , H05K1/189 , H05K2201/0133 , H05K2201/0203 , H05K2201/0245 , H05K2201/10106
Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
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公开(公告)号：US11624000B2
公开(公告)日：2023-04-11
申请号：US16616701
申请日：2018-05-22
Applicant: Alpha Assembly Solutions Inc. , MacDermid Autotype Limited
Inventor： Nirmalya Kumar Chaki , Chetan Pravinchandra Shah , Barun Das , Supriya Devarajan , Siuli Sarkar , Rahul Raut , Bawa Singh , Anubhav Rustogi , Anna Jane Harris , Keith Paul Parsons , Jeffrey William Braham
IPC: C09D11/52 , C09D11/033 , C09D11/037 , C09D11/104 , H01H13/704
Abstract: This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
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公开(公告)号：US10672531B2
公开(公告)日：2020-06-02
申请号：US15326224
申请日：2015-07-14
Applicant: Alpha Assembly Solutions Inc.
Inventor： Narahari Pujari , Bawa Singh , Ravi Bhatkal , Siuli Sarkar , Anubhav Rustogi
IPC: H01B1/22 , H05K1/09 , B22F1/00 , B22F1/02 , B23K35/02 , B23K35/30 , B23K35/36 , B23K35/362 , H05K3/12 , H05K1/18
Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
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