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    Electronic devices with flexible circuit light shields
    21.
    发明授权
    Electronic devices with flexible circuit light shields 有权

    公开(公告)号：US09928762B2

    公开(公告)日：2018-03-27

    申请号：US13770527

    申请日：2013-02-19

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Kevin D. Gibbs ,  Amy Qian ,  John Raff ,  Carl R. Peterson

    IPC: G09F13/04 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18

    CPC classification number: G09F13/0413 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10128

    Abstract: Electronic devices may include displays. A display may include backlight structures that generate light and display layers that generate images using the generated light. An electronic device may include an opaque flexible printed circuit that is wrapped around one or more edges of the backlight structures. The opaque flexible printed circuit may prevent light from the backlight structures from reaching other electronic components or escaping from the device. The opaque flexible printed circuit may include signal lines that communicate signals between a printed circuit board and the display. The opaque flexible printed circuit may be a layer of the printed circuit board that extends from an edge of the printed circuit board. The printed circuit board may include an additional flexible extended printed circuit layer that wraps around a surface of the printed circuit board and forms a portion of a conductive shield over that surface.

    Electronic devices with displays having attached optical films
    23.
    发明授权
    Electronic devices with displays having attached optical films 有权

    公开(公告)号：US09618689B2

    公开(公告)日：2017-04-11

    申请号：US13770817

    申请日：2013-02-19

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Kevin D. Gibbs ,  Amy Qian ,  John Raff

    IPC: G02F1/1335 ,  F21V8/00

    CPC classification number: G02B6/0088 ,  G02F1/133602

    Abstract: Electronic devices may include displays having backlight structures that include optical films. The optical films may help guide light from the backlight structures to display layers that generate display images using the light. The optical films may be attached together at one or more locations. The optical films may be attached to a structural member of the backlight structures. The structural member may be formed along each edge of the optical films and prevent the optical films from sliding within the display. Each optical film may be designed to expand to a common lateral size when the display is operated at a display operating temperature. The optical films may each include an elongated opening such as a slot through which a pin can be placed to partially constrain the movement of the optical films while allowing the optical films to expand or contract under changing thermal conditions in the display.

    Backlight structures and assemblies for electronic device displays
    24.
    发明授权
    Backlight structures and assemblies for electronic device displays 有权
    用于电子设备显示器的背光结构和组件

    公开(公告)号：US09116267B2

    公开(公告)日：2015-08-25

    申请号：US13771473

    申请日：2013-02-20

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Kevin D. Gibbs ,  Amy Qian ,  John Raff

    IPC: F21V8/00

    CPC classification number: G02B6/0031 ,  G02B6/0083 ,  G02B6/009 ,  G02B6/0091

    Abstract: Electronic devices may include displays. A display may include backlight components such as a light guide plate that distributes light from a light source across the display. The light source may include a plurality of light-emitting diodes mounted on a printed circuit substrate. A portion of the light guide plate may be attached to the printed circuit substrate using adhesive. The adhesive may be a supported adhesive that includes a lining of reflective material. A reflective coating such as a layer of white coverlay may be formed on the surface of the printed circuit substrate and may be configured to reflect light into the light guide plate. The reflective coating may serve as a solder mask. The printed circuit substrate may be attached to a metal display chassis using adhesive. A shim may be used to raise the height of the light source relative to the printed circuit substrate.

    Abstract translation: 电子设备可以包括显示器。 显示器可以包括诸如导光板的背光组件，其将来自光源的光分布在显示器上。 光源可以包括安装在印刷电路基板上的多个发光二极管。 可以使用粘合剂将导光板的一部分附着到印刷电路基板。 粘合剂可以是包括反射材料的衬里的支撑的粘合剂。 可以在印刷电路基板的表面上形成诸如白色覆盖层的反射涂层，并且可以被配置为将光反射到导光板中。 反射涂层可以用作焊接掩模。 印刷电路基板可以使用粘合剂附接到金属显示器底座。 可以使用垫片来提高光源相对于印刷电路基板的高度。

    Force and heat spreading PCB for LCD protection and interconnection
    25.
    发明授权
    Force and heat spreading PCB for LCD protection and interconnection 有权
    强力和散热PCB用于LCD保护和互连

    公开(公告)号：US08976527B2

    公开(公告)日：2015-03-10

    申请号：US13631973

    申请日：2012-09-29

    Applicant: Apple Inc.

    Inventor： Kevin D. Gibbs ,  Amy Qian ,  John Raff ,  Derek Wright

    IPC: H05K7/20 ,  H05K3/30

    CPC classification number: H05K1/0209 ,  H05K1/0215 ,  H05K1/181 ,  H05K3/4092 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y10T29/4913

    Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.

    Abstract translation: 所描述的实施例一般涉及显示组件的制造。 更具体地，讨论了用于显示组件的备用背板的使用。 通过使用印刷电路板（PCB）代替金属支架，可以通过施加配置成使印刷电路板上的热量扩展归一化的铜层，可以均匀地分布在衬底上。 可以基于测量或模拟的热图来配置铜层的构造，这些热图表示邻近的发热元件。 PCB还可以有利地用作布置在电子设备内的其它电气部件之间的互连层。

    Electronic devices with structural glass members
    27.
    发明授权
    Electronic devices with structural glass members 有权

    公开(公告)号：US11768517B2

    公开(公告)日：2023-09-26

    申请号：US17748958

    申请日：2022-05-19

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Fletcher R. Rothkopf ,  John P. Ternus ,  Kevin D. Gibbs

    IPC: G06F1/16

    CPC classification number: G06F1/1626

    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

    Electronic devices with structural glass members
    28.
    发明授权
    Electronic devices with structural glass members 有权

    公开(公告)号：US11340653B2

    公开(公告)日：2022-05-24

    申请号：US16886532

    申请日：2020-05-28

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Fletcher R. Rothkopf ,  John P. Ternus ,  Kevin D. Gibbs

    IPC: G06F1/16

    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

    ELECTRONIC DEVICES WITH STRUCTURAL GLASS MEMBERS
    30.
    发明申请
    ELECTRONIC DEVICES WITH STRUCTURAL GLASS MEMBERS 审中-公开

    公开(公告)号：US20180101196A1

    公开(公告)日：2018-04-12

    申请号：US15840913

    申请日：2017-12-13

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Fletcher R. Rothkopf ,  John P. Ternus ,  Kevin D. Gibbs

    IPC: G06F1/16

    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

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