公开(公告)号：US10274834B2

公开(公告)日：2019-04-30

申请号：US15915674

申请日：2018-03-08

Applicant: ASML Netherlands B.V.

Inventor： Alexander Ypma ,  Jasper Menger ,  David Deckers ,  David Han ,  Adrianus Cornelis Matheus Koopman ,  Irina Lyulina ,  Scott Anderson Middlebrooks ,  Richard Johannes Franciscus Van Haren ,  Jochem Sebastiaan Wildenberg

IPC: G03F7/20 ,  G06F16/26 ,  G03F9/00

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US09971251B2

公开(公告)日：2018-05-15

申请号：US14905611

申请日：2014-08-06

Applicant: ASML Netherlands B.V.

Inventor： Emil Peter Schmitt-Weaver ,  Wolfgang Henke ,  Thomas Leo Maria Hoogenboom ,  Pavel Izikson ,  Paul Frank Luehrmann ,  Daan Maurits Slotboom ,  Jens Staecker ,  Alexander Ypma

IPC: G03B27/42 ,  G03F7/20

CPC classification number: G03F7/70516 ,  G03F7/70491 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633

Abstract: A lithography system configured to apply a pattern to a substrate, the system including a lithography apparatus configured to expose a layer of the substrate according to the pattern, and a machine learning controller configured to control the lithography system to optimize a property of the pattern, the machine learning controller configured to be trained on the basis of a property measured by a metrology unit configured to measure the property of the exposed pattern in the layer and/or a property associated with exposing the pattern onto the substrate, and to correct lithography system drift by adjusting one or more selected from: the lithography apparatus, a track unit configured to apply the layer on the substrate for lithographic exposure, and/or a control unit configured to control an automatic substrate flow among the track unit, the lithography apparatus, and the metrology unit.

公开(公告)号：US12254392B2

公开(公告)日：2025-03-18

申请号：US17423658

申请日：2019-12-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Faegheh Hasibi ,  Leon Paul Van Dijk ,  Maialen Larranaga ,  Alexander Ypma ,  Richard Johannes Franciscus Van Haren

IPC: G06F30/398 ,  G03F7/00 ,  G06F30/27 ,  G06N3/04 ,  G06F119/18 ,  G06N3/0464

Abstract: A method for predicting a property associated with a product unit. The method may include: obtaining a plurality of data sets, wherein each of the plurality of data sets includes data associated with a spatial distribution of a parameter across the product unit; representing each of the plurality of data sets as a multidimensional object; obtaining a convolutional neural network model trained with previously obtained multidimensional objects and properties of previous product units; and applying the convolutional neural network model to the plurality of multidimensional objects representing the plurality of data sets, to predict the property associated with the product unit.

公开(公告)号：US12204298B2

公开(公告)日：2025-01-21

申请号：US17801980

申请日：2021-02-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Carlo Lancia ,  Anjan Prasad Gantapara ,  Dirk-Jan Kernkamp ,  Seyed Iman Mossavat ,  Alexander Ypma

IPC: G05B13/04

Abstract: A method of tuning a prediction model relating to at least one particular configuration of a manufacturing device. The method includes obtaining a function including at least a first function of first prediction model parameters associated with the at least one particular configuration, and a second function of the first prediction model parameters and second prediction model parameters associated with configurations of the manufacturing device and/or related devices other than the at least one particular configuration. Values of the first prediction model parameters are obtained based on an optimization of the function, and a prediction model is tuned according to these values of the first prediction model parameters to obtain a tuned prediction mode.

公开(公告)号：US20240019788A1

公开(公告)日：2024-01-18

申请号：US18232570

申请日：2023-08-10

Applicant: ASML Netherlands B.V.

Inventor： Alexander Ypma ,  Jasper Menger ,  David Deckers ,  David Han ,  Adrianus Cornelis Matheus Koopman ,  Irina Lyulina ,  Scott Anderson Middlebrooks ,  Richard Johannes Franciscus Van Haren ,  Jochem Sebastiaan Wildenberg

IPC: G03F7/00

CPC classification number: G03F7/706837 ,  G03F7/70525 ,  G03F7/70616 ,  G06F16/26

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US11782349B2

公开(公告)日：2023-10-10

申请号：US18100662

申请日：2023-01-24

Applicant: ASML NETHERLANDS B.V.

Inventor： Weitian Kou ,  Alexander Ypma ,  Marc Hauptmann ,  Michiel Kupers ,  Lydia Marianna Vergaij-Huizer ,  Erik Johannes Maria Wallerbos ,  Erik Henri Adriaan Delvigne ,  Willem Seine Christian Roelofs ,  Hakki Ergün Cekli ,  Stefan Cornelis Theodorus Van Der Sanden ,  Cédric Désiré Grouwstra ,  David Frans Simon Deckers ,  Manuel Giollo ,  Iryna Dovbush

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70508 ,  G03F7/705 ,  G03F7/70633

Abstract: A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

公开(公告)号：US11327407B2

公开(公告)日：2022-05-10

申请号：US17102850

申请日：2020-11-24

Applicant: ASML NETHERLANDS B.V.

Inventor： Weitian Kou ,  Alexander Ypma ,  Marc Hauptmann ,  Michiel Kupers ,  Lydia Marianna Vergaij-Huizer ,  Erik Johannes Maria Wallerbos ,  Erik Henri Adriaan Delvigne ,  Willem Seine Christian Roelofs ,  Hakki Ergün Cekli ,  Stefan Cornelis Theodorus Van Der Sanden ,  Cédric Désiré Grouwstra ,  David Frans Simon Deckers ,  Manuel Giollo ,  Iryna Dovbush

IPC: G03F7/20

Abstract: A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

公开(公告)号：US11320743B2

公开(公告)日：2022-05-03

申请号：US17044771

申请日：2019-03-04

Applicant: ASML NETHERLANDS B.V.

Inventor： Vahid Bastani ,  Alexander Ypma

IPC: G03F7/20

Abstract: A method of grouping data associated with substrates undergoing a process step of a manufacturing process is disclosed. The method includes obtaining first data associated with substrates before being subject to the process step and obtaining a plurality of sets of second data associated with substrates after being subject to the process step, each set of second data being associated with a different value of a characteristic of the first data. A distance metric is determined which describes a measure of distance between the sets of second data, and the second data is grouped based on a property of the distance metric.

公开(公告)号：US11099486B2

公开(公告)日：2021-08-24

申请号：US16477619

申请日：2017-12-13

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander Ypma ,  Dimitra Gkorou ,  Georgios Tsirogiannis ,  Thomas Leo Maria Hoogenboom ,  Richard Johannes Franciscus Van Haren

IPC: G03F7/20 ,  G05B19/418 ,  H01L21/66

Abstract: A technique to generate predicted data for control or monitoring of a production process to improve a parameter of interest. Context data associated with operation of the production process is obtained. Metrology/testing is performed on the product of the production process, thereby obtaining performance data. A context-to-performance model is provided to generate predicted performance data based on labeling of the context data with performance data. This is an instance of semi-supervised learning. The context-to-performance model may include the learner that performs semi-supervised labeling. The context-to-performance model is modified using prediction information related to quality of the context data and/or performance data. Prediction information may include relevance information relating to relevance of the obtained context data and/or obtained performance data to the parameter of interest. The prediction information may include model uncertainty information relating to uncertainty of the predicted performance data.

公开(公告)号：US10539882B2

公开(公告)日：2020-01-21

申请号：US16322148

申请日：2017-07-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Alexander Ypma ,  Adrianus Cornelis Matheus Koopman ,  Scott Anderson Middlebrooks

IPC: G03F7/20 ,  G06T7/00

Abstract: A diagnostic system implements a network including two or more sub-domains. Each sub-domain has diagnostic information extracted by analysis of object data, the object data representing one or more parameters measured in relation to a set of product units that have been subjected nominally to the same industrial process as one another. The network further has at least one probabilistic connection from a first variable in a first diagnostic sub-domain to a second variable in a second diagnostic sub-domain. Part of the second diagnostic information is thereby influenced probabilistically by knowledge within the first diagnostic information. Diagnostic information may include, for example, a spatial fingerprint observed in the object data, or inferred. The network may include connections within sub-domains. The network may form a directed acyclic graph, and used for Bayesian inference operations.