公开(公告)号：US11295891B2

公开(公告)日：2022-04-05

申请号：US16162660

申请日：2018-10-17

Applicant: ANALOG DEVICES, INC.

Inventor： Vikram Venkatadri ,  David Frank Bolognia ,  Kelvin Po Leung Pun ,  Chee Wah Cheung

IPC: H01F27/30 ,  H01F27/24 ,  H01F27/32 ,  H01F27/29 ,  H01F27/28

Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding. The alignment structure can include an adhesive. The adhesive can be disposed in the recess electrically connecting the first and second portions to define at least one winding. The coil structure can include a solder joint. The solder joint can be disposed between the plurality of contacts and the corresponding plurality of edge contacts making electrical connections between the first and second portions to define at least one winding such that the solder joint is exposed on the first portion.

公开(公告)号：US20200322469A1

公开(公告)日：2020-10-08

申请号：US16305019

申请日：2017-05-25

Applicant: Analog Devices, Inc.

Inventor： J. Brian HARRINGTON ,  David F. Bolognia ,  Alain Valentin GUERY ,  Vikram Venkatadri ,  Hari Chauhan ,  Evgueni IVANOV ,  Carlos R. Calvo

IPC: H04M1/21 ,  H04M1/725 ,  H04B10/40

Abstract: According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

公开(公告)号：US20200185346A1

公开(公告)日：2020-06-11

申请号：US16705123

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Santosh Anil Kudtarkar

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L27/146 ,  H01L23/552

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.

公开(公告)号：US20190273280A1

公开(公告)日：2019-09-05

申请号：US15909849

申请日：2018-03-01

Applicant: ANALOG DEVICES, INC.

Inventor： Kelvin Po Leung Pun ,  Vikram Venkatadri ,  David Frank Bolognia ,  Chee Wah Cheung

IPC: H01M10/04 ,  H01M4/66 ,  H01M4/04 ,  H01M10/0585 ,  H01M2/20

Abstract: A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

公开(公告)号：US20170352469A1

公开(公告)日：2017-12-07

申请号：US15174477

申请日：2016-06-06

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Vikram Venkatadri

IPC: H01F27/28 ,  H01F41/10 ,  H01F41/04 ,  H05K3/30 ,  H01F27/29

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F27/2895 ,  H01F27/292 ,  H01F27/306 ,  H01F41/041 ,  H01F41/10 ,  H05K3/303

Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

公开(公告)号：US20170040275A1

公开(公告)日：2017-02-09

申请号：US14821228

申请日：2015-08-07

Applicant: ANALOG DEVICES, INC.

Inventor： Vikram Venkatadri

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/293 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/0603 ,  H01L2224/06153 ,  H01L2224/06155 ,  H01L2224/0616 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2924/351 ,  H01L2224/05599 ,  H01L2924/014

Abstract: Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.

Abstract translation: 集成电路管芯提供具有多个不同尺寸的开口的钝化层，露出用于结合的接合焊盘。 接合焊盘的尺寸以至少部分地补偿接合期间的应力（例如倒装芯片热压接合）由于接合焊盘的不对称分布而变化。

公开(公告)号：US20170025463A1

公开(公告)日：2017-01-26

申请号：US14805835

申请日：2015-07-22

Applicant: ANALOG DEVICES, INC.

Inventor： David Frank Bolognia ,  Vikram Venkatadri

IPC: H01L27/146 ,  H01L31/024

CPC classification number: H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14661 ,  H01L31/0203 ,  H01L31/024 ,  Y10T29/49126

Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

Abstract translation: 本文公开了紧凑型传感器模块的各种实施例。 传感器模块可以包括加强件和缠绕在加强件侧面的传感器基底。 传感器芯片可以安装在传感器基板上。 处理器基板可以耦合到传感器基板。 处理器管芯可以安装在处理器基板上并且可以与传感器管芯电连通。

公开(公告)号：US20150076628A1

公开(公告)日：2015-03-19

申请号：US14028856

申请日：2013-09-17

Applicant: Analog Devices, Inc.

Inventor： David Bolognia ,  Vikram Venkatadri

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0074 ,  B81B7/0058 ,  B81B7/008 ,  B81B2201/0257 ,  B81C1/00309 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15151 ,  H01L2924/16152 ,  H04R1/04 ,  H04R1/406 ,  H04R25/405 ,  H01L2924/00014

Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.

Abstract translation: 集成器件封装包括具有第一开口的壳体和与壳体的内部体积流体连通的第二开口。 封装衬底具有第一端口和第二端口。 第一器件裸片安装到第一端口上的衬底上。 第二器件裸片通过第二端口安装到衬底上。 衬底被耦合到壳体以覆盖第一和第二开口，使得第一器件管芯通过第一开口设置在内部容积内，并且第二器件管芯通过第二开口设置在内部容积内。