HEAT TRANSFER STRUCTURE
    21.
    发明申请
    HEAT TRANSFER STRUCTURE 有权
    热传递结构

    公开(公告)号:US20150092351A1

    公开(公告)日:2015-04-02

    申请号:US14077550

    申请日:2013-11-12

    申请人: APPLE INC.

    IPC分类号: H05K7/20 F28F21/06 F28F21/02

    摘要: An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.

    摘要翻译: 电子设备可以包括位于产生热量的第一部件和散发热量的第二部件之间的传热结构。 传热结构将热量从第一部件传递到第二部件。 传热结构可以包括传热构件,其包括附接到至少一个柔性层的导热层和由传热构件的形状产生的至少一个可变形区域。

    Multi-transducer tactile user interface for electronic devices

    公开(公告)号:US10664053B2

    公开(公告)日:2020-05-26

    申请号:US15273668

    申请日:2016-09-22

    申请人: Apple Inc.

    IPC分类号: G06F3/01 G06F3/044 G06F1/16

    摘要: Systems and methods for providing localized tactile output and systems and methods for obtaining localized physical characteristic information are disclosed. An electronic device can include a friction transducer configured to augment and/or detect friction between a surface of an electronic device and an object in contact with that electronic device. The electronic device may also include a force transducer configured to detect the force with which an object contacts a display. The force transducer may also provide mechanical output. The electronic device can also include a thermal transducer to augment and/or detect the temperature of various locations on a display.

    Multi-layer transparent structures for electronic device housings

    公开(公告)号:US10574800B2

    公开(公告)日:2020-02-25

    申请号:US16429583

    申请日:2019-06-03

    申请人: Apple Inc.

    摘要: Transparent structures for portions of electronic device housings are disclosed. The transparent structures are formed from multiple layers of transparent (optically clear) materials. The multiple layers can include at least an outer glass layer and one or more other transparent layers that can be either glass or polymer layers. The multiple layers can be bonded together with one or more lamination layers. Accordingly, multi-layer transparent structures that are formed from multiple layers bonded together are able to be not only thin but also sufficiently strong and resistant to damage. The multi-layer transparent structures are well suited for use in consumer products, such as consumer electronic devices (e.g., portable electronic devices).

    Optical connector
    30.
    发明授权
    Optical connector 有权
    光连接器

    公开(公告)号:US09453976B2

    公开(公告)日:2016-09-27

    申请号:US14597995

    申请日:2015-01-15

    申请人: APPLE INC.

    IPC分类号: H04B10/00 G02B6/42 H04B10/80

    摘要: An electronic device having an optical connector that provides and/or receives optical signals through openings or perforations formed at an external surface of the electronic device. These openings can serve as the interface of the optical connector through which the electronic device can engage in one-way or two-way communication with corresponding optical connectors of other electronic devices. These openings can be sized such that they are not visible or not easily visible with the naked human eye. As such, these openings can be too small for communicating with corresponding optical connectors using any single one of these openings. But light that is collectively transmitted through or received through a group of these openings can provide optical signals that can be used to communicate with corresponding optical connectors using optical signals.

    摘要翻译: 一种具有光学连接器的电子设备,其通过形成在电子设备的外表面处的开口或穿孔提供和/或接收光信号。 这些开口可以用作光学连接器的接口,电子设备可以通过该接口与其它电子设备的相应光学连接器进行单向或双向通信。 这些开口的大小可以使其不可见或不容易用肉眼看到。 因此,这些开口可能太小,以便使用这些开口中的任何一个与相应的光学连接器连通。 但是通过一组这些开口集体传输或接收的光可以提供可用于使用光信号与对应的光连接器进行通信的光信号。