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    Non-Planar Display Backlight Structures
    21.
    发明申请
    Non-Planar Display Backlight Structures 审中-公开
    非平面显示背光结构

    公开(公告)号：US20150049285A1

    公开(公告)日：2015-02-19

    申请号：US13965965

    申请日：2013-08-13

    Applicant: Apple Inc.

    Inventor： Amy Qian ,  Jeremy C. Franklin ,  John Raff ,  Victor H. Yin ,  Wenyong Zhu

    IPC: F21V8/00 ,  G02F1/1335

    CPC classification number: G02B6/0073 ,  G02B6/0018 ,  G02B6/002 ,  G02B6/0065 ,  G02B6/0086 ,  G02F2001/133388

    Abstract: An electronic device may be provided with a display. The display may include display layers characterized by an active area and backlight structures that provide backlight to the active area. To accommodate components such as a button, an edge portion of a light guide plate in the backlight structures that does not overlap the active area is bent out of the plane of the light guide plate. The bent edge portion of the light guide plate may be formed by molding clear plastic in a die or by bending a flexible sheet of clear polymer. Flared structures may be formed on the flexible sheet of clear polymer to help guide light from light-emitting diodes into the flexible sheet of clear polymer. The flared structures may be formed by applying resin coating layers to the flexible sheet of clear polymer.

    Abstract translation: 电子设备可以设置有显示器。 显示器可以包括以有源区域为特征的显示层和向有源区域提供背光的背光结构。 为了容纳诸如按钮的部件，背光结构中不与有源区域重叠的导光板的边缘部分弯曲到导光板的平面之外。 导光板的弯曲边缘部分可以通过在模具中模制透明塑料或通过弯曲透明聚合物的柔性片而形成。 扩张结构可以形成在透明聚合物的柔性片上，以帮助将来自发光二极管的光引导到透明聚合物的柔性片中。 扩张结构可以通过将树脂涂层施加到透明聚合物的柔性片上而形成。

    Electronic Devices With Flexible Displays
    22.
    发明申请
    Electronic Devices With Flexible Displays 有权

    公开(公告)号：US20250028364A1

    公开(公告)日：2025-01-23

    申请号：US18762440

    申请日：2024-07-02

    Applicant: Apple Inc.

    Inventor： Wenyong Zhu ,  ByoungSuk Kim ,  Hao Chen ,  Sijun Niu ,  Wei Lv ,  Han-Chieh Chang ,  Zhen Zhang

    IPC: G06F1/16 ,  G01L1/22

    Abstract: An electronic device may have a hinge that allows the device to be flexed about a bend axis. A display may span the bend axis. The device may have a stainless steel and/or carbon fiber reinforced polymer layer with slots. The slots may overlap the bend axis. The slots may have at least one property that varies in a non-linear manner as a function of position on the layer. The device may include an adhesive layer with a cutout that overlaps the slots. An interface that defines the cutout may have a plurality of recesses with varying depths. A flexible printed circuit may be attached to an edge of the display panel. The display cover layer may overlap a bonding region between the flexible printed circuit and the edge of the display panel. A UV-curable gap filler may be interposed between the flexible printed circuit and the display cover layer.

    Display system and rigid flex PCB with flip chip bonded inside cavity
    24.
    发明授权
    Display system and rigid flex PCB with flip chip bonded inside cavity 有权

    公开(公告)号：US11129284B2

    公开(公告)日：2021-09-21

    申请号：US16912522

    申请日：2020-06-25

    Applicant: Apple Inc.

    Inventor： Adam Adjiwibawa ,  Shaowei Qin ,  Victor H. Yin ,  Wenyong Zhu ,  Steven M. Scardato

    IPC: H05K1/00 ,  H05K3/46

    Abstract: A rigid flex printed circuit board (PCB), method of manufacture, and display system incorporating the same are described. In an embodiment, a rigid flex PCB includes a flexible area extending from an adjacent routing area that is thicker than the flexible area. A flexible inner core spans the flexible area and the adjacent routing area. Outer stack-up layers are on the flexible inner core in the adjacent routing area. A cavity is formed in the outer stack-up layers in the routing area and exposes the flexible inner core. In an embodiment, a display system including such a circuit board may include an electronic component mounted on the flexible inner core within the cavity, and a distal end of the flexible area is bonded to a display panel.

    Electronic devices with backlit displays
    25.
    发明授权
    Electronic devices with backlit displays 有权

    公开(公告)号：US10571743B2

    公开(公告)日：2020-02-25

    申请号：US15688736

    申请日：2017-08-28

    Applicant: Apple Inc.

    Inventor： Byungsoo Ko ,  Daming Xu ,  Heesang Suh ,  Michael Tom ,  Shin-Ying Lu ,  Thomas Mueller ,  Wenyong Zhu ,  Victor H. Yin ,  Mookyung Son

    IPC: G02F1/1335 ,  F21V8/00

    Abstract: A display may have a backlight unit that provides backlight illumination. The backlight unit may include a light guide that distributes light through the display. Light-emitting diodes may emit light into the light guide. A reflector that is overlapped by the light guide may help reflect light upwards through an array of pixels. The backlight unit may have a chassis that receives the reflector, light guide, light-emitting diodes, and optical films such as diffusers and prism films. Optical and mechanical features in the backlight unit may enhance color and intensity uniformity for the backlight illumination and may help enhance durability.

    Electronic device having display with thin-film encapsulation
    26.
    发明授权
    Electronic device having display with thin-film encapsulation 有权

    公开(公告)号：US10483493B2

    公开(公告)日：2019-11-19

    申请号：US15864983

    申请日：2018-01-08

    Applicant: Apple Inc.

    Inventor： Daniel B. Sargent ,  John Raff ,  Li Zhang ,  Victor H. Yin ,  Wenyong Zhu

    IPC: H01L51/52 ,  H01L23/29 ,  H01L49/02 ,  H01L27/32 ,  H01L51/00 ,  G06F1/16 ,  H04N1/00 ,  H05K1/02

    Abstract: An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.

    Light-Emitting Diodes in Displays with Direct-lit Backlight Units
    28.
    发明申请
    Light-Emitting Diodes in Displays with Direct-lit Backlight Units 审中-公开

    公开(公告)号：US20190285942A1

    公开(公告)日：2019-09-19

    申请号：US16294727

    申请日：2019-03-06

    Applicant: Apple Inc.

    Inventor： Rong Liu ,  Edward H Kang ,  Jun Qi ,  Mookyung Son ,  Pee Khaim So ,  Victor H. Yin ,  Wei Lv ,  Wenyong Zhu ,  Zhenyue Luo ,  Xinyu Zhu ,  Ling Han ,  Hung Sheng Lin

    IPC: G02F1/1335 ,  H05K1/18 ,  H05K1/02 ,  H05K3/22 ,  H05K3/34

    Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a backlight unit. The backlight unit may include a printed circuit board, a plurality of light-emitting diodes mounted on the printed circuit board, at least one light spreading layer formed over the printed circuit board that spreads light received from the plurality of light-emitting diodes, a partially reflective layer formed over the at least one light spreading layer, a color conversion layer formed over the partially reflective layer, a collimating layer formed over the color conversion layer, a brightness enhancement film formed over the collimating layer, and a diffuser formed over the brightness enhancement film. The at least one light spreading layer may include two light spreading layers with elongated protrusions that are rotated relative to each other.

    Electronic Device Having Display With Thin-Film Encapsulation
    29.
    发明申请
    Electronic Device Having Display With Thin-Film Encapsulation 审中-公开

    公开(公告)号：US20190044093A1

    公开(公告)日：2019-02-07

    申请号：US15864983

    申请日：2018-01-08

    Applicant: Apple Inc.

    Inventor： Daniel B. Sargent ,  John Raff ,  Li Zhang ,  Victor H. Yin ,  Wenyong Zhu

    IPC: H01L51/52 ,  H01L27/32 ,  H01L23/29 ,  H01L49/02

    Abstract: An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.

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