公开(公告)号：US20200373194A1

公开(公告)日：2020-11-26

申请号：US16417369

申请日：2019-05-20

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/687 ,  H01L21/683 ,  H01L21/68

摘要： A process kit ring adaptor includes a rigid carrier. The rigid carrier includes an upper surface and a lower surface. The upper surface includes a first distal portion and a second distal portion to support a process kit ring. The lower surface includes a first region to interface with an end effector configured to support wafers and a solid planar central region to interface with a vacuum chuck.

公开(公告)号：US11842917B2

公开(公告)日：2023-12-12

申请号：US17216439

申请日：2021-03-29

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/68 ,  H01L21/687 ,  H01L21/683 ,  H01L21/677

CPC分类号： H01L21/68735 ,  H01L21/68 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01L21/677

摘要： A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US11646183B2

公开(公告)日：2023-05-09

申请号：US16825466

申请日：2020-03-20

申请人： Applied Materials, Inc.

发明人： Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC分类号： H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC分类号： H01J37/32798 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

摘要： Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

公开(公告)号：US11569114B2

公开(公告)日：2023-01-31

申请号：US17174591

申请日：2021-02-12

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Andreas Schmid ,  Stephen Donald Prouty ,  Andrew Antoine Noujaim

IPC分类号： B29C65/00 ,  H01L21/683 ,  H05K7/20 ,  B29C65/56 ,  B29C65/02 ,  B29C65/48

摘要： Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

公开(公告)号：US11075105B2

公开(公告)日：2021-07-27

申请号：US16103531

申请日：2018-08-14

申请人： Applied Materials, Inc.

发明人： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Prouty ,  Andreas Schmid

IPC分类号： H01L21/687 ,  C23C16/458 ,  H01J37/32 ,  H01L21/677 ,  H01L21/683

摘要： Aspects of the present disclosure generally relate to apparatuses and methods for edge ring replacement in processing chambers. In one aspect, a carrier for supporting an edge ring is disclosed. In other aspects, robot blades for supporting a carrier are disclosed. In another aspect, a support structure for supporting a carrier in a degassing chamber is disclosed. In another aspect, a method of transferring an edge ring on a carrier is disclosed.

公开(公告)号：US20210217650A1

公开(公告)日：2021-07-15

申请号：US17216439

申请日：2021-03-29

申请人： Applied Materials, Inc.

发明人： Leon Volfovski ,  Andreas Schmid ,  Denis Martin Koosau ,  Nicholas Michael Kopec ,  Steven Babayan ,  Douglas R. McAllister ,  Helder Lee ,  Jeffrey Hudgens ,  Damon K. Cox

IPC分类号： H01L21/687 ,  H01L21/68 ,  H01L21/683

摘要： A process kit ring adaptor includes one or more upper surfaces and one or more lower surfaces. The one or more upper surfaces are configured to support a process kit ring. The one or more lower surfaces are configured to interface with an end effector. The process kit ring adaptor supporting the process kit ring is configured to be transported on the end effector within a processing system.

公开(公告)号：US11043400B2

公开(公告)日：2021-06-22

申请号：US16222831

申请日：2018-12-17

申请人： Applied Materials, Inc.

发明人： Andreas Schmid ,  Denis M. Koosau

IPC分类号： H01L21/67 ,  H01L21/3065 ,  H01L21/687 ,  C23C16/52 ,  H01J37/32

摘要： Aspects of the present disclosure generally relate to methods and apparatuses for adjusting an edge ring position, and for removing or replacing one or more components of a process kit of a process chamber. The process kit includes one or more of an edge ring, a support ring, a sliding ring, and other consumable or degradable components.

公开(公告)号：US20210057256A1

公开(公告)日：2021-02-25

申请号：US16990839

申请日：2020-08-11

申请人： APPLIED MATERIALS, INC.

发明人： Nicholas Michael Bergantz ,  Andreas Schmid ,  Leon Volfovski ,  Sanggyum Kim ,  Damon Cox ,  Paul Wirth

IPC分类号： H01L21/68 ,  G01B11/27 ,  B25J11/00 ,  H01L21/67 ,  H01L21/687

摘要： A method for calibrating an aligner station of an electronics processing system is provided. A calibration is retrieved, by a first robot arm of a transfer chamber, from a processing chamber connected to the transfer chamber. The calibration object has a target orientation in the processing chamber. The calibration is placed, by the first robot art, in a load lock connected to the transfer chamber. The calibration is retrieved from the load lock by a second robot arm of a factory interface connected to the load lock. The calibration object is placed, by the second robot arm, at an aligner station housed in or connected to the factory interface. The calibration object has a first orientation at the aligner station. A difference is determined between the first orientation at the aligner station and an initial target orientation at the aligner station. The initial target orientation at the aligner station is associated with the target orientation in the processing chamber. A first characteristic error value associated with the processing chamber is determined based on the difference between the first orientation and the initial target orientation. The first characteristic error value is recorded in a storage medium. The aligner station is to use the first characteristic error value for alignment of objects to be placed in the processing chamber.