公开(公告)号：US10586718B2

公开(公告)日：2020-03-10

申请号：US15335059

申请日：2016-10-26

Applicant: Applied Materials, Inc.

Inventor： Vladimir Knyazik ,  Shahid Rauf ,  Stephen Prouty ,  Roland Smith ,  Denis M. Koosau

IPC: H01L21/67 ,  F28F3/12 ,  F28D7/04 ,  F28D1/047

Abstract: Implementations described herein provide a cooling base and a substrate support assembly having the same. In one example, a cooling base is provided that includes a body coupled to a cap. A plurality cooling channels are disposed in the body and bounded on at least one side by the cap. The plurality cooling channels have a polar array of spirals.

公开(公告)号：US09050699B2

公开(公告)日：2015-06-09

申请号：US13893030

申请日：2013-05-13

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Gautam Shashank Dandavate ,  Denis M. Koosau

IPC: B24B5/00 ,  B24B37/30 ,  B24B41/06

CPC classification number: B24B37/30 ,  B24B41/06

Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

Abstract translation: 提供了一种用于化学机械抛光的方法和装置，更具体地涉及一种用于化学机械抛光的载体的方法和装置。 在一个实施例中，承载头组件包括用于向衬底提供支撑的基座组件，安装在基座组件上的柔性膜，该柔性膜具有大致圆形中心部分，下表面提供衬底安装表面，以及多个可独立加压的腔室 形成在基部组件和柔性膜之间，包括环形外室和非圆形内腔。

公开(公告)号：US12094752B2

公开(公告)日：2024-09-17

申请号：US17843652

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Michael R. Rice ,  Yogananda Sarode Vishwanath ,  Sunil Srinivasan ,  Rajinder Dhindsa ,  Steven E. Babayan ,  Olivier Luere ,  Denis M. Koosau ,  Imad Yousif

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/68735 ,  H01J37/32082 ,  H01J37/32091 ,  H01J37/32715 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/6831 ,  H01L21/68742 ,  H01J2237/334

Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.

公开(公告)号：US11043400B2

公开(公告)日：2021-06-22

申请号：US16222831

申请日：2018-12-17

Applicant: Applied Materials, Inc.

Inventor： Andreas Schmid ,  Denis M. Koosau

IPC: H01L21/67 ,  H01L21/3065 ,  H01L21/687 ,  C23C16/52 ,  H01J37/32

Abstract: Aspects of the present disclosure generally relate to methods and apparatuses for adjusting an edge ring position, and for removing or replacing one or more components of a process kit of a process chamber. The process kit includes one or more of an edge ring, a support ring, a sliding ring, and other consumable or degradable components.

公开(公告)号：US12009236B2

公开(公告)日：2024-06-11

申请号：US16391262

申请日：2019-04-22

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard M. Tedeschi ,  Daniel Sang Byun ,  Philip Allan Kraus ,  Phillip A. Criminale ,  Changhun Lee ,  Rajinder Dhindsa ,  Andreas Schmid ,  Denis M. Koosau

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H03K17/955

CPC classification number: H01L21/67259 ,  H01J37/32477 ,  H01J37/3288 ,  H01L22/12 ,  H03K17/955 ,  H01J2237/022

Abstract: The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.

公开(公告)号：US11668553B2

公开(公告)日：2023-06-06

申请号：US17161271

申请日：2021-01-28

Applicant: Applied Materials, Inc.

Inventor： Sathyendra Ghantasala ,  Leonid Dorf ,  Evgeny Kamenetskiy ,  Peter Muraoka ,  Denis M. Koosau ,  Rajinder Dhindsa ,  Andreas Schmid

IPC: G01B7/06 ,  H01L21/67 ,  H01J37/32 ,  H01L21/687

CPC classification number: G01B7/08 ,  H01J37/32642 ,  H01L21/67069 ,  H01L21/68721 ,  H01J2237/24564

Abstract: Disclosed herein is a method and apparatus for controlling surface characteristics by measuring capacitance of a process kit ring. The method includes interfacing a ring with a jig assembly for measuring capacitance in at least a first location of the ring. The ring has that includes a top surface, a bottom surface, and an inner surface opposite an outer surface. At least the bottom surface has an external coating placed thereon. The method further includes contacting a measuring device to the first location on the outer surface proximate the bottom surface. The measuring device contacts an opening in the external coating to the body. The measuring device contacts a first conductive member that is electrically coupled to the ring. A capacitance is measured on the measuring device. The capacitance across the top surface is measured.

公开(公告)号：US10991556B2

公开(公告)日：2021-04-27

申请号：US16716332

申请日：2019-12-16

Applicant: Applied Materials, Inc.

Inventor： Olivier Luere ,  Leonid Dorf ,  Sunil Srinivasan ,  Rajinder Dhindsa ,  James Rogers ,  Denis M. Koosau

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, an adjustable tuning ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The adjustable tuning ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the adjustable tuning ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the adjustable tuning ring. The actuating mechanism is configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component varies.

公开(公告)号：US11935773B2

公开(公告)日：2024-03-19

申请号：US16407520

申请日：2019-05-09

Applicant: Applied Materials, Inc.

Inventor： Andrew Myles ,  Denis M. Koosau ,  Peter Muraoka ,  Phillip A. Criminale

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/68 ,  H01J37/32642 ,  H01J37/3288 ,  H01J37/32908 ,  H01J37/32935 ,  H01J37/3299 ,  H01L21/681 ,  H01L21/68721 ,  H01L21/68735 ,  H01L21/68742

Abstract: Apparatus and methods for calibrating a height-adjustable edge ring are described herein. In one example, a calibration jig for positioning an edge ring relative to a reference surface is provided that includes a transparent plate, a plurality of sensors coupled to a first side of the transparent plate, and a plurality of contact pads coupled to an opposing second side of the transparent plate.

公开(公告)号：US10553404B2

公开(公告)日：2020-02-04

申请号：US15421726

申请日：2017-02-01

Applicant: Applied Materials, Inc.

Inventor： Olivier Luere ,  Leonid Dorf ,  Sunil Srinivasan ,  Rajinder Dhindsa ,  James Rogers ,  Denis M. Koosau

IPC: H01J37/32 ,  H01L21/687 ,  H01L21/683

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a ring having a first ring component and a second ring component, an adjustable tuning ring, and an actuating mechanism. The first ring component is interfaced with the second ring component such that the second ring component is movable relative to the first ring component forming a gap therebetween. The adjustable tuning ring is positioned beneath the ring and contacts a bottom surface of the second ring component. A top surface of the adjustable tuning ring contacts the second ring component. The actuating mechanism is interfaced with the bottom surface of the adjustable tuning ring. The actuating mechanism is configured to actuate the adjustable tuning ring such that the gap between the first ring component and the second ring component varies.

公开(公告)号：US10103010B2

公开(公告)日：2018-10-16

申请号：US15951540

申请日：2018-04-12

Applicant: Applied Materials, Inc.

Inventor： Olivier Luere ,  Leonid Dorf ,  Rajinder Dhindsa ,  Sunil Srinivasan ,  Denis M. Koosau ,  James Rogers

IPC: H01J37/32

Abstract: Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes a first ring having a top surface and a bottom surface, an adjustable tuning ring having a top surface and a bottom surface, and an actuating mechanism. The bottom surface is supported by a substrate support member. The bottom surface at least partially extends beneath a substrate supported by the substrate support member. The adjustable tuning ring is positioned beneath the first ring. The top surface of the adjustable tuning ring and the first ring define an adjustable gap. The actuating mechanism is interfaced with the bottom surface of the adjustable tuning ring. The actuating mechanism is configured to alter the adjustable gap defined between the bottom surface of the first ring and the top surface of the adjustable tuning ring.