公开(公告)号：US06362530B1

公开(公告)日：2002-03-26

申请号：US09056074

申请日：1998-04-06

申请人： Shaw Wei Lee ,  Hem P. Takiar

发明人： Shaw Wei Lee ,  Hem P. Takiar

IPC分类号： H01L2348

CPC分类号： H01L23/49816 ,  H01L23/057 ,  H01L23/3675 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of forming an integrated circuit package includes providing a flip chip integrating circuit die having a first plurality of contacts for electrically connecting the die to other elements. A second plurality of contacts for electrically connecting the integrated circuit package to external elements is also provided. A substrate for supporting the flip chip die and the second plurality of contacts is initially prepared. The substrate includes a connecting arrangement for electrically connecting the first plurality of contacts on the die to the second plurality of contacts. The method includes the step positioning the flip chip integrated circuit die and the second plurality of contacts on the substrate. With the flip chip die and the second plurality of contacts in position, both the first plurality of contacts on the flip chip die and the second plurality of contacts are simultaneously attached to the substrate thereby electrically connecting the die and the second plurality of contacts to the substrate. In one embodiment, a metal cap is attached to the integrated circuit package to cover and protect the die. In this embodiment, the metal cap may be used to provide a direct thermal path from the die to the external element to which the integrated circuit package is to the connected. An additional heat sink may also be attached to the package.

摘要翻译： 形成集成电路封装的方法包括提供具有第一多个触点的倒装芯片集成电路管芯，用于将管芯电连接到其它元件。 还提供了用于将集成电路封装电连接到外部元件的第二多个触点。 最初准备了用于支撑倒装芯片模具和第二多个触点的基板。 基板包括用于将模具上的第一多个触点电连接到第二多个触点的连接装置。 该方法包括将倒装芯片集成电路管芯和第二多个触点定位在衬底上的步骤。 通过倒装晶片管芯和第二组触头就位，倒装晶片管芯上的第一个多个触点和第二个多个触头都同时附着在基板上，从而将管芯和第二个多个触头电连接到 基质。 在一个实施例中，金属盖连接到集成电路封装以覆盖和保护管芯。 在该实施例中，金属盖可用于提供从模具到集成电路封装件所连接的外部元件的直接热路径。 附加的散热器也可以附接到包装上。

公开(公告)号：US06173490B1

公开(公告)日：2001-01-16

申请号：US08915352

申请日：1997-08-20

申请人： Shaw Wei Lee ,  Hem P. Takiar ,  Fred Drummond

发明人： Shaw Wei Lee ,  Hem P. Takiar ,  Fred Drummond

IPC分类号： H05K330

CPC分类号： H01L21/561 ,  B29C39/10 ,  B29C39/24 ,  H01L21/565 ,  H01L23/544 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2223/54486 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  Y10T29/49146 ,  Y10T29/49158 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method and an apparatus for forming a panel of packaged integrated circuits is disclosed. A substrate panel having an array of integrated circuits mounted thereon is placed in a mold having a molding chamber. The molding chamber has a multiplicity of adjacent package recesses flowably interconnected by way of a plurality of molding compound flowgates. Each package recess is suitable for receiving at least one associated integrated circuits. A molding compound is passed into the molding chamber by way of a mold gate such that at least some of the molding compound passes through a plurality of different package recesses by way of their associated flowgates. In one embodiment, the mold includes a mold body having a molding chamber with a plurality of ridges that define the multiplicity of package recesses within the molding chamber. The multiplicity of package recesses are flowably interconnected through flowgates formed by the ridges.

摘要翻译： 公开了一种用于形成封装集成电路板的方法和装置。 将具有安装在其上的集成电路阵列的基板面板放置在具有模制室的模具中。 模制室具有多个相邻的包装凹部，其可通过多个模塑复合流动臂可流动地相互连接。 每个封装凹槽适于接收至少一个相关联的集成电路。 模塑料通过模具浇口进入模制室，使得至少一些模塑料通过其相关的流动浇口穿过多个不同的包装凹槽。 在一个实施例中，模具包括具有模制室的模具主体，模制室具有限定模制室内的多个封装凹槽的多个脊。 包装凹槽的多个可通过由脊形成的流动闸流动地相互连接。

公开(公告)号：US6054338A

公开(公告)日：2000-04-25

申请号：US26781

申请日：1998-02-20

申请人： Shaw Wei Lee ,  Hem P. Takiar ,  Ranjan J. Mathew ,  Hee Jhin Kim

发明人： Shaw Wei Lee ,  Hem P. Takiar ,  Ranjan J. Mathew ,  Hee Jhin Kim

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/673 ,  H01L21/68 ,  H01L23/13 ,  H01L23/498 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/32 ,  H01L24/86 ,  H01L2221/68313 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： A panel of, for example, bismaleimide triazine (BT) or ceramic (Al.sub.2 O.sub.3) is chosen in size to be substantially filled with and taken up by end-result ball grid array (BGA) devices. The end-result devices are positioned closely together and take up substantially the entire area of the initial panel. Structural weakening is provided at appropriate places in the panel to allow the devices to be readily singulated.

摘要翻译： 选择例如双马来酰亚胺三嗪（BT）或陶瓷（Al 2 O 3）的面板大体上被最终结果的球栅阵列（BGA）装置充满和吸收。 最终结果设备紧密地放置在一起并占据初始面板的整个区域。 在面板中的适当位置提供结构弱化，以允许装置容易地分割。