Display module and display device
    21.
    发明授权

    公开(公告)号:US12288516B2

    公开(公告)日:2025-04-29

    申请号:US18257385

    申请日:2022-06-24

    Abstract: A display module includes a display panel, at least one bonding circuit board, a plurality of chip-on-films, and a plurality of buffer devices. The at least one bonding circuit board each include first differential lines, and a first differential line includes a P-polarity differential sub-line and an N-polarity differential sub-line. An end of a chip-on-film is connected to the first differential line, and the other end of the chip-on-film is connected to the display panel. The buffer devices are arranged on the bonding circuit board, a buffer device is connected to ends, proximate to the chip-on-film, of the P-polarity differential sub-line and the N-polarity differential sub-line, and the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film.

    Pixel circuit, its driving method, OLED display panel and OLED display device

    公开(公告)号:US09898960B2

    公开(公告)日:2018-02-20

    申请号:US14646258

    申请日:2014-09-30

    Abstract: The present disclosure provides a pixel circuit, its driving method, an OLED display panel and an OLED display device. The pixel circuit includes row pixel units each including subpixel units. The row pixel unit includes an auxiliary compensating circuit, which is configured to generate a switching control signal inputted to a subpixel driving circuit according to a scanning signal from a gate driving circuit, and generate a compensating control signal inputted to the subpixel driving circuit according to a control signal from the gate driving circuit. The subpixel driving circuit is configured to receive a data voltage from a data line accordance to the switching control signal, control a driving transistor to drive an OLED to emit light according to the data voltage, and compensate for a threshold voltage of the driving transistor according to the compensating control signal when the driving transistor drives the OLED to emit light.

    Wiring structure of high frequency signal wires and PCB

    公开(公告)号:US09801267B2

    公开(公告)日:2017-10-24

    申请号:US15219935

    申请日:2016-07-26

    CPC classification number: H05K1/0237 H05K1/025 H05K1/0268

    Abstract: The present invention provides a wiring structure of high frequency signal wires and a PCB board including the wiring structure of high frequency signal wires. A test part is formed by extending a high frequency signal wire from a connection end connected with a solder pad, and a test window corresponding to a position of the test part is provided on a copper foil which covers the solder pad and the test part, to expose the high frequency signal wire, such that a high frequency signal transmitted via the high frequency signal wire can be directly tested at the test window. Thus, circular test points used in the prior art can be removed, to effectively solve the problem of insufficient space on a PCB; accordingly, lengths of the high frequency signal wires become more precise, so as to ensure a synchronization of transmission of the high frequency signal wires.

    Printed Circuit Board, Ball Grid Array Package and Wiring Method of Printed Circuit Board
    28.
    发明申请
    Printed Circuit Board, Ball Grid Array Package and Wiring Method of Printed Circuit Board 有权
    印刷电路板,球栅阵列封装和印刷电路板的布线方法

    公开(公告)号:US20160157346A1

    公开(公告)日:2016-06-02

    申请号:US14571621

    申请日:2014-12-16

    Inventor: Yue Wu

    Abstract: A printed circuit board, a ball grid array package and a wiring method of a printed circuit board are provided. The printed circuit board comprises: a substrate, the substrate including a plurality of insulating layers stacked and a plurality of conductive layers disposed between adjacent insulating layers; a plurality of pads, disposed in a two-dimensional matrix on a surface of the substrate; and a plurality of via holes, disposed corresponding to each pad and running through the substrate and the corresponding pad. The ball grid array package according to an embodiment of the invention comprises the above-described printed circuit board.

    Abstract translation: 提供印刷电路板,球栅阵列封装和印刷电路板的布线方法。 印刷电路板包括:基板,所述基板包括堆叠的多个绝缘层,以及设置在相邻绝缘层之间的多个导电层; 多个衬垫,设置在所述衬底的表面上的二维矩阵中; 以及多个通孔,对应于每个焊盘设置并穿过衬底和相应的焊盘。 根据本发明的实施例的球栅阵列封装包括上述印刷电路板。

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