摘要:
A semiconductor chip is provided which includes active and inactive IP cores. The spaces on the metal layer associated with the inactive IP cores includes voltage contrast inspection structures. The voltage contrast inspection structures serve to provide improved planarization of the metal layer and provided improved inspection capabilities.
摘要:
A positive photoresist bead is removed from an edge surface of a substrate by exposing the photoresist bead with light from an exposing source along a plurality of non-parallel paths approximately normal to the surface of the photoresist bead. The light may be simultaneously directed by a light guide along the non-parallel paths, or a mount may support the light guide adjacent the bead to move the light guide to various positions to direct the light along the non-parallel paths. Alternatively, plural light sources direct light to the bead along non-parallel paths. In any case, the exposed photoresist bead is then removed with a solvent.
摘要:
A method of interactive feedback in semiconductor processing is provided which compensates for lithographic proximity effects, reactive ion etch loading effects, electromigration and stress due to layering.
摘要:
An embodiment of the present invention provides a method to utilize data from many different die sizes and products so that highly detailed wafer profiles can be generated that have an improved signal to noise ratio and spatial resolution. Instead of being limited to single die size like normal wafer maps, this method takes advantage of multiple die sizes and their variation in placement on the wafer to increase the information available about the wafer patterns.
摘要:
A semiconductor chip is provided which includes active and inactive IP cores. The spaces on the metal layer associated with the inactive IP cores includes voltage contrast inspection structures. The voltage contrast inspection structures serve to provide improved planarization of the metal layer and provided improved inspection capabilities.
摘要:
An apparatus includes an edge expose unit for exposing an annular area in an edge exclusion zone of a wafer to radiation having a wavelength suitable for removing a film from the wafer in the annular area and a radiation modulator coupled to the edge expose unit for modulating the radiation to pattern the film in the annular area.
摘要:
A method includes steps of: (a) providing a wafer on which a film has been deposited; (b) exposing an annular area in an edge exclusion zone of the wafer to radiation having a wavelength suitable for patterning the film in the annular area; and (c) modulating the radiation while exposing the annular area to form a pattern in the film in the annular area.
摘要:
A method of determining a cost effective number of corrective tests to perform on a process experiencing process excursions. A test cost for each corrective test is determined, and a total test cost for each of an incremental number of corrective tests is calculated. An effect of each corrective test on a reduction in the process excursions is determined, as is also the lost revenue for each process excursion. A reduction in the lost revenue for each of the incremental number of corrective tests is calculated, based at least in part on the effect of each corrective test on the reduction in process excursions and the revenue lost for each process excursion. An overall cost for each of the incremental number of corrective tests is calculated, based at least in part on a sum of the total test cost and the reduction in the lost revenue for each of the incremental number of corrective tests. A minimum value of the overall costs is found, and that incremental number of corrective tests that is associated with the minimum value of the overall costs is selected as the cost effective number of corrective tests to perform.
摘要:
A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.
摘要:
A method of mapping logic failures in an integrated circuit die includes steps of: (a) generating a navigation map of test paths for an integrated circuit die; (b) selecting a grid spacing to define a grid map of cell locations from the navigation map for each of the test paths; and (c) calculating a value for each of the cell locations wherein the value is representative of the difference between a total number of the test paths intersecting each of the cell locations and a failed number of the test paths intersecting each of the cell locations.