Composition for removing a polymeric contaminant and method of removing a polymeric contaminant using the same
    21.
    发明授权
    Composition for removing a polymeric contaminant and method of removing a polymeric contaminant using the same 有权
    用于除去聚合物污染物的组合物和使用其的去除聚合物污染物的方法

    公开(公告)号:US07795198B2

    公开(公告)日:2010-09-14

    申请号:US11840165

    申请日:2007-08-16

    IPC分类号: H01L21/02

    摘要: In a composition for removing a polymeric contaminant that may remain on an apparatus for manufacturing a semiconductor device and a method of removing a polymeric contaminant using the composition, the composition includes from about 5 to 10 percent by weight of a fluoride salt, from about 5 to 15 percent by weight of an acid or a salt thereof, and from about 75 to 90 percent by weight of an aqueous solution of glycol. The composition can effectively remove the polymeric contaminant from the apparatus within a relatively short period of time, and suppress damages to parts of the apparatus.

    摘要翻译: 在用于除去可能保留在用于制造半导体器件的装置上的聚合物污染物的组合物和使用该组合物去除聚合物污染物的方法中,该组合物包含约5-10重量%的氟化物盐,约5重量% 至15重量%的酸或其盐,和约75至90重量%的乙二醇水溶液。 组合物可以在相对短的时间内有效地从设备中除去聚合物污染物,并且抑制对装置的部件的损坏。

    COMPOSITION FOR REMOVING A POLYMERIC CONTAMINANT AND METHOD OF REMOVING A POLYMERIC CONTAMINANT USING THE SAME
    24.
    发明申请
    COMPOSITION FOR REMOVING A POLYMERIC CONTAMINANT AND METHOD OF REMOVING A POLYMERIC CONTAMINANT USING THE SAME 有权
    用于除去聚合物污染物的组合物及其使用该聚合物的聚合物污染物的方法

    公开(公告)号:US20080051313A1

    公开(公告)日:2008-02-28

    申请号:US11840165

    申请日:2007-08-16

    IPC分类号: C11D3/20

    摘要: In a composition for removing a polymeric contaminant that may remain on an apparatus for manufacturing a semiconductor device and a method of removing a polymeric contaminant using the composition, the composition includes from about 5 to 10 percent by weight of a fluoride salt, from about 5 to 15 percent by weight of an acid or a salt thereof, and from about 75 to 90 percent by weight of an aqueous solution of glycol. The composition can effectively remove the polymeric contaminant from the apparatus within a relatively short period of time, and suppress damages to parts of the apparatus.

    摘要翻译: 在用于除去可能保留在用于制造半导体器件的装置上的聚合物污染物的组合物中,以及使用该组合物除去聚合物污染物的方法,该组合物包括约5至10重量%的氟化物盐,约5至10重量% 至15重量%的酸或其盐,和约75至90重量%的乙二醇水溶液。 组合物可以在相对短的时间内有效地从设备中除去聚合物污染物,并且抑制对装置的部件的损坏。