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27 条记录 (耗时 0.025 秒)

    LIGHT-EMITTING DIODE PACKAGE
    21.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE 有权
    发光二极管封装

    公开(公告)号：US20080290357A1

    公开(公告)日：2008-11-27

    申请号：US12057350

    申请日：2008-03-27

    申请人： Shun-Tian Lin ,  Jyun-Wei Huang

    发明人： Shun-Tian Lin ,  Jyun-Wei Huang

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/32 ,  H01L33/483 ,  H01L33/62 ,  H01L33/64 ,  H01L33/648 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

    摘要翻译： 提供了包括载体，一对导线单元，LED芯片和控制电路模块的发光二极管（LED）封装。 载体具有连接到承载部分的周边的承载部分和环形框架。 承载部具有圆顶状的上表面和一对通孔。 一对导线单元分别设置在通孔内，并且每个导线单元具有导电线和封装导线的绝缘材料。 LED芯片设置在载体的上表面上并与导线电连接。 控制电路模块设置在载体的底部并与导线电连接以控制LED芯片的操作。

    METHOD FOR FABRICATING ANTENNA UNITS
    24.
    发明申请
    METHOD FOR FABRICATING ANTENNA UNITS 审中-公开
    制作天线单元的方法

    公开(公告)号：US20080047130A1

    公开(公告)日：2008-02-28

    申请号：US11844362

    申请日：2007-08-24

    申请人： Shun-Tian Lin ,  Chao-Tsung Lin

    发明人： Shun-Tian Lin ,  Chao-Tsung Lin

    IPC分类号： H01P11/00

    CPC分类号： H05K3/041 ,  H05K1/165 ,  H05K2203/1545 ,  Y10T29/49016

    摘要： A method of fabricating antenna units is described, including providing a conductive material and a dielectric material, laminating the conductive material and the dielectric material, press-cutting the conductive material to form therein circuits of a plurality of antenna units, removing the conductive material other than the circuits to form a composite structure, and cutting the composite structure to obtain the antenna units. Before each antenna unit is obtained through cutting, a chip may be bonded onto the circuit thereof and then packaged so that an RFID tag is obtained after the cutting. The method allows the manufacturer to conduct a fabricating process in high efficiency, low cost and little pollution in a continuous manner, and also allows each antenna to have a full receiving performance due to the precision of the process.

    摘要翻译： 描述了制造天线单元的方法，包括提供导电材料和电介质材料，层叠导电材料和电介质材料，对导电材料进行加压切割以在多个天线单元中形成电路，除去其它导电材料 比电路形成复合结构，并切割复合结构以获得天线单元。 在通过切割获得每个天线单元之前，可以将芯片结合到其电路上，然后封装，使得在切割之后获得RFID标签。 该方法允许制造商以连续的方式以高效率，低成本和少污染的方式进行制造工艺，并且由于工艺的精度，每个天线都能够具有完全的接收性能。

    Light-emitting diode package
    25.
    发明授权
    Light-emitting diode package 有权
    发光二极管封装

    公开(公告)号：US07872279B2

    公开(公告)日：2011-01-18

    申请号：US12057350

    申请日：2008-03-27

    申请人： Shun-Tian Lin ,  Jyun-Wei Huang

    发明人： Shun-Tian Lin ,  Jyun-Wei Huang

    IPC分类号： H01L29/22

    CPC分类号： H01L25/0753 ,  H01L25/167 ,  H01L33/32 ,  H01L33/483 ,  H01L33/62 ,  H01L33/64 ,  H01L33/648 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light-emitting diode (LED) package including a carrier, a pair of conductive wire units, an LED chip, and a control circuit module is provided. The carrier has a carrying portion and a ring frame connected to the periphery of the carrying portion. The carrying portion has a dome-like upper surface and a pair of through holes. The pair of conductive wire units is disposed inside the through holes respectively, and each of the conductive wire units has a conductive wire and an insulating material encapsulating the conductive wire. The LED chip is disposed on the upper surface of the carrier and is electrically connected to the conductive wires. The control circuit module is disposed at a bottom of the carrier and is electrically connected to the conductive wires for controlling the operation of the LED chip.

    摘要翻译： 提供了包括载体，一对导线单元，LED芯片和控制电路模块的发光二极管（LED）封装。 载体具有连接到承载部分的周边的承载部分和环形框架。 承载部具有圆顶状的上表面和一对通孔。 一对导线单元分别设置在通孔内，并且每个导线单元具有导电线和封装导线的绝缘材料。 LED芯片设置在载体的上表面上并与导线电连接。 控制电路模块设置在载体的底部并与导线电连接以控制LED芯片的操作。

    Method for fabricating intricate parts with good soft magnetic properties
    27.
    发明授权
    Method for fabricating intricate parts with good soft magnetic properties 失效
    制造具有良好软磁特性的复杂零件的方法

    公开(公告)号：US5963771A

    公开(公告)日：1999-10-05

    申请号：US939621

    申请日：1997-09-29

    申请人： Tien-Yin Chan ,  Shun-Tian Lin

    发明人： Tien-Yin Chan ,  Shun-Tian Lin

    IPC分类号： B22F1/02 ,  B22F3/10 ,  B22F3/22 ,  H01F1/24

    CPC分类号： B22F3/225 ,  B22F1/025 ,  B22F3/1025 ,  H01F1/24 ,  B22F2998/00

    摘要： In the present invention, nickel and phosphorous are simultaneously plated onto the surface of iron powder, mixed iron and nickel powder, or iron-nickel pre-alloyed powder, to form iron-nickel-phosphorous ternary alloy powders with very uniform distribution of phosphorous, with concentrations ranging between 2.0 and 6.0 wt%. When mixed with an appropriate amount of organic binder, these powders may be used as raw materials for injection molding. Intricate parts thus formed can be sintered at relatively low temperatures to attain high sintered density, large grain size, and isotropic shrinkage. The sintered microstructure thus obtained is characterized by spheroidal grains embedded in continuous intergranular insulating phosphide phase. The magnetic properties of the resulting material are substantially improved as compared to those of powder processed products. By controlling the fractions of phosphorous and nickel in the final ternary alloy, products that are intended for use in alternating magnetic fields with different frequencies can be produced.

    摘要翻译： 在本发明中，将镍和磷同时镀在铁粉，混合铁和镍粉末或铁镍预合金粉末的表面上，形成铁分布非常均匀的铁 - 镍 - 磷三元合金粉末， 浓度范围为2.0至6.0重量％。 当与适量的有机粘合剂混合时，这些粉末可以用作注射成型的原料。 如此形成的复杂部件可以在相对较低的温度下烧结以获得高的烧结密度，大的晶粒尺寸和各向同性的收缩。 由此获得的烧结微结构的特征在于嵌入连续的晶间绝缘磷化物相中的球状晶粒。 与粉末处理产品相比，所得材料的磁性能显着提高。 通过控制最终三元合金中的磷和镍的分数，可以生产用于具有不同频率的交变磁场的产品。