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27 条记录 (耗时 0.034 秒)

    Light emitting diode substrate assembly
    1.
    发明申请
    Light emitting diode substrate assembly 失效
    发光二极管基板组件

    公开(公告)号：US20110128731A1

    公开(公告)日：2011-06-02

    申请号：US12591765

    申请日：2009-12-01

    申请人： Shun-Tian Lin ,  Chao-Tung Chung

    发明人： Shun-Tian Lin ,  Chao-Tung Chung

    IPC分类号： F21V1/00 ,  B21D53/02

    CPC分类号： H05K1/021 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80 ,  Y10T29/4935 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A light emitting diode substrate assembly has a metal substrate, a circuit board, multiple chip strings, an annular wall and an encapsulant. The circuit board is mounted on the top surface of the substrate and has multiple through holes and multiple current conducting lines. The chip strings are mounted on the substrate and respectively in the through hole in the circuit board. Each chip string has at least one light emitting diode chip connected electrically to two corresponding current conducting lines on the circuit board with bonding wires. Accordingly, the heat generating during the operation of the chips can be efficiently dissipated from the substrate.

    摘要翻译： 发光二极管基板组件具有金属基板，电路板，多个芯片串，环形壁和密封剂。 电路板安装在基板的顶表面上，并具有多个通孔和多条电流导线。 芯片串安装在基板上，分别安装在电路板的通孔中。 每个芯片串具有至少一个发光二极管芯片，其电连接到具有接合线的电路板上的两个对应的电流导线。 因此，能够有效地从基板散失芯片运转时的发热。

    LIGHT EMITTING DIODE PACKAGE
    4.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 审中-公开
    发光二极管封装

    公开(公告)号：US20080290363A1

    公开(公告)日：2008-11-27

    申请号：US12056290

    申请日：2008-03-27

    申请人： Shun-Tian Lin ,  Jyun-Wei Huang

    发明人： Shun-Tian Lin ,  Jyun-Wei Huang

    IPC分类号： H01L33/00

    CPC分类号： H01L33/64 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A light emitting diode (LED) package including a heat dissipation base, an electrical insulating layer, a circuit layer, and an LED chip is provided. The electrical insulating layer is disposed on the heat dissipation base. The circuit layer is disposed on the electrical insulating layer. The circuit layer has a receiving hole extending and passing through the electrical insulating layer for exposing a portion of the heat dissipation base. The LED chip is disposed on the heat dissipation base exposed by the receiving hole and is electrically connected to the circuit layer.

    摘要翻译： 提供了包括散热基座，电绝缘层，电路层和LED芯片的发光二极管（LED）封装。 电绝缘层设置在散热基底上。 电路层设置在电绝缘层上。 电路层具有延伸并穿过电绝缘层的接收孔，用于暴露一部分散热基底。 LED芯片设置在由接收孔露出的散热基底上，并与电路层电连接。

    Manufacturing method for a permeable die steel
    5.
    发明申请
    Manufacturing method for a permeable die steel 审中-公开
    可渗透模具钢的制造方法

    公开(公告)号：US20070134123A1

    公开(公告)日：2007-06-14

    申请号：US11296446

    申请日：2005-12-08

    申请人： Tien-Yin Chan ,  Shun-Tian Lin ,  Chin-Sheng Lee

    发明人： Tien-Yin Chan ,  Shun-Tian Lin ,  Chin-Sheng Lee

    IPC分类号： B22F3/10

    CPC分类号： B22F3/1103 ,  B22F2998/10 ,  B22F3/1258

    摘要： A manufacturing method for a permeable die steel stacks and fixes a plurality of fixing blocks to form a molded die having an emplacing space which contains and fixes a plurality of polymeric wires. A metallic powder and an adhesive are installed in the emplacing space to form a green type, and to completely enclose the polymeric wires, after being mixed together. Next, the green type is heated up to totally vaporize the polymeric wires and is then cooled down, so as to constitute a metallic product having breathing holes, for serving as a die steel.

    摘要翻译： 可渗透模具钢的制造方法堆叠并固定多个固定块以形成具有包含并固定多个聚合物线的放置空间的模制模具。 金属粉末和粘合剂安装在放置空间中以形成绿色类型，并且在混合在一起之后完全包围聚合物线。 接下来，将绿色类型加热，使聚合物线完全汽化，然后冷却，以形成具有呼吸孔的金属制品，用作模具钢。

    SOC for integrating micro-antenna
    7.
    发明授权
    SOC for integrating micro-antenna 失效
    用于集成微型天线的SOC

    公开(公告)号：US07301461B2

    公开(公告)日：2007-11-27

    申请号：US11109624

    申请日：2005-04-20

    申请人： Chuan-Ling Hu ,  Shun-Tian Lin ,  Chang-Fa Yang

    发明人： Chuan-Ling Hu ,  Shun-Tian Lin ,  Chang-Fa Yang

    IPC分类号： G08B13/14

    CPC分类号： H01Q1/38 ,  H01Q23/00

    摘要： An integrating SOC capable of integrating a micro-antenna System on Chip (SOC) of integrating micro-antennas comprises an existing radio frequency model, a circuit board and an antenna element to a package of single SOC. The micro-antenna element is formed by using antenna radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths. Active or passive elements are selected to match up the antenna element and relative circuits, and arranges on the circuit board. Then by using embedding type injection molding or glue-filling modeling, the single SOC is finished by the package of a radio frequency model and an antenna element.

    摘要翻译： 能够集成微型天线的微型天线片上系统（SOC）的集成SOC包括现有的射频模型，电路板和天线元件到单个SOC的封装。 微型天线元件通过使用由单个馈送端或多个馈送端和多个弯曲路径组成的天线辐射导体路径形成。 选择有源或无源元件以匹配天线元件和相对电路，并布置在电路板上。 然后通过使用嵌入式注塑或灌胶建模，单个SOC由射频模型和天线元件的封装完成。

    Chip antenna
    9.
    发明授权
    Chip antenna 失效
    芯片天线

    公开(公告)号：US07212165B2

    公开(公告)日：2007-05-01

    申请号：US10960310

    申请日：2004-10-06

    申请人： Chang-Fa Yang ,  Jen-Hsun Li ,  Jing-Ming Chen ,  Jun-Hong Lin ,  Shun-Tian Lin

    发明人： Chang-Fa Yang ,  Jen-Hsun Li ,  Jing-Ming Chen ,  Jun-Hong Lin ,  Shun-Tian Lin

    IPC分类号： H01Q1/24

    CPC分类号： H01Q1/2283 ,  H01Q1/22 ,  H01Q1/38 ,  Y10T29/49016 ,  Y10T29/49018

    摘要： A chip antenna has an antenna body and a package. The antenna body has multiple meandered metal lines and is encapsulated with the package. The material of the package is a dielectric composite formed with polymers and ceramic powders, which has a dielectric constant designed for the antenna. The characteristics of the chip antenna are determined by the structures of the antenna body and the dielectric constant of the package. Thus, a requirement for tiny structures in antenna applications can be satisfied.

    摘要翻译： 芯片天线具有天线体和封装。 天线体具有多条蜿蜒的金属线，并用封装封装。 封装的材料是由聚合物和陶瓷粉末形成的电介质复合材料，其具有为天线设计的介电常数。 芯片天线的特性由天线体的结构和封装的介电常数决定。 因此，可以满足对天线应用中的微小结构的要求。

    LIGHT EMITTING DIODE LAMP
    10.
    发明申请
    LIGHT EMITTING DIODE LAMP 审中-公开
    发光二极管灯

    公开(公告)号：US20080291675A1

    公开(公告)日：2008-11-27

    申请号：US12053619

    申请日：2008-03-23

    申请人： Shun-Tian Lin ,  Jyun-Wei Huang

    发明人： Shun-Tian Lin ,  Jyun-Wei Huang

    IPC分类号： F21V7/00

    CPC分类号： F21V29/767 ,  F21K9/233 ,  F21K9/68 ,  F21V29/505 ,  F21V29/745 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting diode (LED) lamp including a substrate, a plurality of wire units, a plurality of LED chips, a lamp cap, and a control circuit module is provided. The substrate has a carrying portion and a ring frame connected to the periphery thereof. The carrying portion has a plurality of openings. The wire units are respectively disposed inside the openings. Each wire unit has a wire and an insulating material covering the periphery of the wire, such that the wire is electrically isolated from the substrate. The LED chips are disposed on the carrying portion, and each LED chip is electrically connected to the corresponding wires. The lamp, cap is disposed on the bottom of the substrate and has two power contacts. The control circuit module is disposed between the substrate and the lamp cap and electrically connected to wires and power contacts, to control operations of LED chips.

    摘要翻译： 提供了包括基板，多个线单元，多个LED芯片，灯头和控制电路模块的发光二极管（LED）灯。 基板具有连接到其周边的承载部分和环形框架。 承载部具有多个开口。 线单元分别设置在开口内。 每个线单元具有覆盖线的周边的线和绝缘材料，使得线与衬底电隔离。 LED芯片设置在承载部分上，并且每个LED芯片电连接到相应的导线。 灯泡盖设置在基板的底部，并具有两个电源触点。 控制电路模块设置在基板和灯帽之间，并电连接到电线和电源触点，以控制LED芯片的操作。