SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD
    23.
    发明申请
    SURFACE MOUNT INTERCONNECTION SYSTEM FOR MODULAR CIRCUIT BOARD AND METHOD 审中-公开
    用于模块化电路板的表面安装互连系统和方法

    公开(公告)号:US20130335931A1

    公开(公告)日:2013-12-19

    申请号:US13524197

    申请日:2012-06-15

    IPC分类号: H01R12/73 H05K3/36 H01R12/79

    摘要: A surface mount interconnection system provides a method and apparatus for mounting an auxiliary printed circuit board assembly directly to a main printed circuit board assembly without the use of leaded surface mount devices. A linear array of spaced-apart solder pads is arranged on an exposed surface of the substrate of both assemblies, with at least one of solder pad arrays being located adjacent an edge of its associated substrate. A selected plurality of aligned cooperating pairs of solder pads are electrically and mechanically interconnected by a solder ball reflowed to form a joint there between. The solder balls comprise a high melting temperature inner core and a low melting temperature outer solder core.

    摘要翻译: 表面安装互连系统提供了一种用于将辅助印刷电路板组件直接安装到主印刷电路板组件而不使用有铅表面安装装置的方法和装置。 间隔开的焊盘的线性阵列布置在两个组件的衬底的暴露表面上,其中至少一个焊盘阵列位于其相关衬底的边缘附近。 所选择的多个对准的配对的焊盘对通过回流的焊球电连接和机械地互连,以在其间形成接头。 焊球包括高熔点内芯和低熔点外部焊料芯。

    RF/EMI SHIELD
    24.
    发明申请
    RF/EMI SHIELD 审中-公开
    RF / EMI屏蔽

    公开(公告)号:US20100182765A1

    公开(公告)日:2010-07-22

    申请号:US12356812

    申请日:2009-01-21

    IPC分类号: H05K9/00

    摘要: An RF/EMI shield has a planar conductive element and a plurality of solder spheres extending around the edges making electrical and mechanical contact with the conductive element to form a shield which can be soldered in a surface mount process directly over components needing shielding. The solder spheres have a diameter sufficient to provide the desired clearance between the shielding element and the component being shielded and a melting temperature equivalent to existing solder contacts to which the shield is bonded.

    摘要翻译: RF / EMI屏蔽件具有平面导电元件和围绕边缘延伸的多个焊球,其与导电元件电接触和机械接触以形成屏蔽件,该屏蔽件可以直接在需要屏蔽的部件上以表面安装工艺焊接。 焊球具有足以在屏蔽元件和被屏蔽的部件之间提供期望的间隙的直径以及与屏蔽件所接合的现有焊料触点相当的熔化温度。