Abstract:
A MOSFET device with a substrate covered with dielectric material with the device including a plurality of buried conductors capacitively coupled to a polysilicon electrode, made by:forming between regions containing MOSFET devices a region with a plurality of bit lines in the substrate by ion implantation through the gate oxide into the substrate in a predetermined pattern and,forming a polysilicon electrode on the dielectric material crossing over the bit lines.
Abstract:
An MOSFET device is fabricated with a plurality of conductors capacitively coupled to a first electrode, forming a mask on the surface of the first electrode exposing a predetermined zone of the first electrode, doping the first electrode through the mask, removing the mask from the surface of the first electrode, oxidizing the first electrode to form a layer of oxide over the first electrode with a thicker layer of oxide over the predetermined zone and a thinner layer of oxide elsewhere, forming at least one electrode over the first electrode on the thinner layer of oxide outside of the zone and forming at least one other electrode over the first electrode on the thicker layer of oxide inside the zone, whereby the one electrode and the other electrode have substantially different capacitive coupling to the electrode.
Abstract:
A method of forming an integrated circuit includes forming a gate structure over a substrate. Portions of the substrate are removed to form recesses adjacent to the gate structure. A dopant-rich layer having first type dopants is formed on a sidewall and a bottom of each of the recesses. A silicon-containing material structure is formed in each of the recesses. The silicon-containing material structure has second type dopants. The second type dopants are opposite to the first type dopants.
Abstract:
An embodiment is a semiconductor device. The semiconductor device comprises a substrate, an electrode over the substrate, and a piezoelectric layer disposed between the substrate and the electrode. The piezoelectric layer causes a strain in the substrate when an electric field is generated by the electrode.
Abstract:
A silicided gate for CMOS transistors and a method of manufacture is provided. A gate electrode is formed on a substrate. A first dielectric layer is formed over the gate electrode and the substrate, and a second dielectric layer is formed over the first dielectric layer. The second dielectric layer is etched to form spacers adjacent the gate electrode. A treatment is performed on the first dielectric layer over the gate electrode, wherein the treatment increases the effective etch rate of the first dielectric layer as compared to untreated portions of the first dielectric layer. An etching procedure is then performed to expose the surface of the gate electrode, the etching procedure recessing the liner along sidewalls of the gate electrode. Thereafter, a silicide procedure is performed to silicide at least a portion of the gate electrode.
Abstract:
A combinational gardening rack comprising several frames, several combining connectors and a hood; the major feature of the present invention is that the combining connectors have vertical and horizontal connecting holes with same diameter, the vertical connecting hole is hollow in center, a wedge stretches out from the bottom of the vertical connecting hole, a locking mechanism is on the wedge. While assembly based on the structure described above, users can apply the wedges and locking mechanisms to assemble the frames and the combining connectors together at any height on the vertical frames, such scheme can adjust the height between layers of the rack.
Abstract:
A transistor device having a strained channel and a method for forming the transistor device are disclosed. The transistor device includes a semiconductor region having a top surface. The transistor device includes a source region, a drain region, and a channel region in the semiconductor region. The channel region is between the source region and the drain region. The transistor device includes an oxide region within the channel region and a gate overlying the channel region. The oxide region is laterally spaced from the source and drain regions. The transistor device includes a gate dielectric between the gate and the channel region.
Abstract:
A horizontal surrounding gate MOSFET comprises a monolithic structure formed in an upper silicon layer of a semiconductor substrate which is essentially a silicon-on-insulator (SOI) wafer, the monolithic structure comprising a source and drain portion oppositely disposed on either end of a cylindrical channel region longitudinally disposed between the source and drain. The channel is covered with a gate dielectric and an annular gate electrode is formed circumferentially covering the channel.
Abstract:
A flat panel display includes a plurality of parallel row select lines and a plurality of column drive lines, with the row select lines and the column drive lines intersecting to define a matrix of pixel locations. Signals are provided to contact pads located on the periphery of the display and the signals flow over the row select lines and the column drive lines to thin film transistors located adjacent a pixel electrode at each of the pixel locations. The signals provided to each thin film transistor cause the transistor to charge a corresponding pixel electrode to control a pixel of the display. ESD protection for the display comprises a guard ring adjacent the contact pads. Capacitively coupled field effect transistors (CCFETs) connect the row select lines to the guard ring and connect the column drive lines to the guard ring. A CCFET is formed as a thin film transistor and typically has a floating gate capacitively coupled to the drain and source of the thin film transistor.
Abstract:
A rotary type swingable sprayer comprising a fixing tube head, a rotatable tube head, and a nozzle tube. The rotatable tube head is installed atop the fixing tube head, and the nozzle tube is installed atop the rotatable tube head. The lower end of the fixing tube head is connected with a water tube for guiding water. When water flows through the rotatable tube head, the rotatable tube head will swing nearly a full cycle repeatedly so as to drive the nozzle tube above to swing repeatedly. Thus, water is jetted out from the distal end of the nozzle tube. Therefore, water is sprayed out nearly through a full cycle in the whole area.