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公开(公告)号：US11926556B2
公开(公告)日：2024-03-12
申请号：US16843377
申请日：2020-04-08
Applicant: Corning Incorporated
Inventor： Jaymin Amin , Robert Randall Hancock, Jr. , Raymond Chih Chung Hsiao , Yuhui Jin , Aize Li , Jared Hilliard Seaman
CPC classification number: C03C15/00 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/091 , C03C23/0075 , C03C23/0085
Abstract: A glass substrate comprises: a first surface with surface features having an average width, an average height, a ratio of the average height to the average width of from about 0.04 to about 0.24, and the first surface has a haze value of 3% to 40%. The glass substrate can be transparent to electromagnetic radiation in the visible spectrum. The glass substrate can have a composition of: 61-75 mol. % SiO2; 7-15 mol. % Al2O3; 0-12 mol. % B2O3; 9-21 mol. % Na2O; 0-4 mol. % K2O; 0-7 mol. % MgO; and 0-3 mol. % CaO. The first surface can have an average surface roughness Ra of from 10 nm to 1,000 nm. The first surface can have an average characteristic largest feature size of from 200 nm to 50 μm. The ratio of the average height to the average width can be from 0.06 to about 0.08.
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公开(公告)号：US20230364606A1
公开(公告)日：2023-11-16
申请号：US18226855
申请日：2023-07-27
Applicant: CORNING INCORPORATED
Inventor： Ye Fang , Jin Su Kim , Aize Li
IPC: B01L3/00
CPC classification number: B01L3/502715 , B01L3/502707 , B01L2300/12 , B01L2300/161 , B01L2300/168 , B01L2200/12 , B01L2200/027
Abstract: A method for manufacturing a microfluidic device includes depositing a bonding layer on a surface of a second glass layer of a glass substrate having a first glass layer and the second glass layer fused to the first glass layer, such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel in the glass substrate; and bonding a cover to the glass substrate with the bonding layer.
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公开(公告)号：US20230133219A1
公开(公告)日：2023-05-04
申请号：US17980955
申请日：2022-11-04
Applicant: Corning Incorporated
Inventor： Qiang Fu , Aize Li , Charisse Marye Spier
IPC: C03C3/087
Abstract: A silicate-based glass composition includes 15-65 wt. % SiO2, 15-50 wt. % CaO, 1-30 wt. % P2O5, and 1-20 wt. % ZrO2, such that the composition has a hydrolytic resistance of glass grains (HGB) of at most 3, when measured by International Organization for Standardization section 719 (ISO 719), and forms a bioactive crystalline phase in simulated body fluid.
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公开(公告)号：US20230060615A1
公开(公告)日：2023-03-02
申请号：US17462873
申请日：2021-08-31
Applicant: Corning Incorporated
Inventor： Robert Randall Hancock, JR. , Yuhui Jin , Aize Li
Abstract: A textured glass article includes: a body comprising an aluminosilicate glass comprising greater than or equal to 16 wt % Al2O3, the body having at least a first surface; a plurality of dendritic surface features extending from the first surface, each of the plurality of dendritic surface features comprising a base on the first surface and a surface feature size at the base greater than or equal to 10 μm and less than or equal to 350 μm; and a transmittance haze greater than or equal to 50%.
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公开(公告)号：US11527452B2
公开(公告)日：2022-12-13
申请号：US17743643
申请日：2022-05-13
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
IPC: H01L23/495 , H01L23/13 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498 , B32B17/06 , C03C23/00
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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Patent Agency Ranking
公开(公告)号：US20220371939A1
公开(公告)日：2022-11-24
申请号：US17743703
申请日：2022-05-13
Applicant: Corning Incorporated
Inventor： Robert Randall Hancock, JR. , Aize Li , Liying Zhang
Abstract: A borosilicate-based composition, including: 50-85 mol. % SiO2, 10-40 mol. % B2O3, >0-5 mol. % SnO2, and >0-20 mol. % of at least one alkali oxide selected from Li2O, Na2O, K2O, Rb2O, and Cs2O, such that the composition has a Young's Modulus less than 64 GPa.
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公开(公告)号：US11485677B2
公开(公告)日：2022-11-01
申请号：US16912601
申请日：2020-06-25
Applicant: Corning Incorporated
Inventor： Gilbert Alexander Castillo , Melanie Lian Geiger , Yuhui Jin , Aize Li , Ying Zhang
Abstract: A method is described herein of making a textured glass article where the method includes: providing a glass substrate having an initial primary surface and an opposing primary surface; disposing a protective coating on at least one of the initial primary surface or the opposing primary surface; and etching the glass substrate with a hydrofluoric acid-free etchant having a pH of about 7 or less to form a leached layer in the glass substrate.
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公开(公告)号：US10894739B2
公开(公告)日：2021-01-19
申请号：US15356785
申请日：2016-11-21
Applicant: CORNING INCORPORATED
Abstract: Methods of etching an inorganic layer on a glass substrate are described, the methods comprising contacting the glass substrate including an inorganic layer with an etching solution comprising a polar organic solvent and an etchant, wherein the inorganic layer is removed at an inorganic layer etching rate and the glass substrate is etched as a glass etching rate.
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公开(公告)号：US10253550B1
公开(公告)日：2019-04-09
申请号：US15336879
申请日：2016-10-28
Applicant: Corning Incorporated
Inventor： Jin Su Kim , Aize Li , Timothy James Orsley
Abstract: A vacuum insulated glass unit includes a first and a second glass pane and a pane bonding layer. The first and second glass panes each include a vacuum chamber side opposite an outer side. The vacuum chamber side of the first glass pane includes an etched interior surface, a glass pane periphery having a periphery surface, and a plurality of glass spacers each having an end surface. The pane bonding layer is positioned between and engaged with the periphery surface of the glass pane periphery of the first glass pane and the second glass pane and couples the first glass pane to the second glass pane. Each end surface of the plurality of glass spacers and the periphery surface of the glass pane periphery are offset from the etched interior surface such that a vacuum chamber is disposed between the first and the second glass panes.
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公开(公告)号：US20160313494A1
公开(公告)日：2016-10-27
申请号：US15105025
申请日：2014-12-17
Applicant: Corning Incorporated
Inventor： James Patrick Hamilton , Karl William Koch , Aize Li , Jonathan Michael Mis , Daniel Aloysius Nolan , Vasudha Ravichandran , Ioannis Georgios Roudas , Nicholas James Smith , Christine Coulter Wolcott , Ruchirej Yongsunthon
CPC classification number: G02B6/0036 , C03C15/00 , C03C17/32 , C03C2218/119 , G02B1/118 , G02B5/0221 , G02B5/0278 , G02B5/0294 , G02B6/0061 , G02B6/0065 , G02B6/0068
Abstract: A substrate with a textured surface is disclosed. The substrate may be, for example, a light emitter comprising a light guide, for example a backlight element for use in a display device, wherein a surface of the light guide, for example a glass substrate, is configured to have a textured surface with a predetermined RMS roughness and a predetermined correlation length of the texture. A plurality of light scatter supressing features can be provided on the textured surface. Textured surfaces disclosed herein may be effective to reduce electrostatic charging of the substrate surface. Methods of producing the textured surface are also disclosed.
Abstract translation: 公开了具有织构表面的基底。 衬底可以是例如包括光导的光发射器，例如用于显示装置的背光元件，其中光导的表面，例如玻璃衬底，被配置为具有带纹理的表面， 纹理的预定RMS粗糙度和预定的相关长度。 在纹理表面上可以提供多个光散射抑制特征。 本文公开的纹理表面可以有效地减少基底表面的静电充电。 还公开了生产纹理表面的方法。
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