Abstract:
A solvent-based two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component and a polyol component. One or both of the isocyanate component and polyol component comprises at least one butylene oxide-based polyol. The at least one butylene oxide-based polyol can be selected from the group consisting of a polybutylene oxide polyols, polybutylene oxide-propylene oxide copolymer polyols, polybutylene oxide-polyethylene oxide copolymer polyols, and combinations of two or more thereof. A method for forming a laminate is also disclosed. The method comprises forming an adhesive composition, the composition comprising at least one polyol comprising at least one butylene oxide-based polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate formed by this method is also disclosed.
Abstract:
A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000, wherein the first and second components are formulated to be applied to separate substrates before being brought together. Further, a method for forming a laminate is disclosed, the method comprising uniformly applying the isocyanate component to a first substrate, uniformly applying the polyol component to a second substrate, bringing the first and second substrates together, thereby mixing and reacting the isocyanate component and the polyol component to form an adhesive between the first and second substrates, and curing the adhesive to bond the first and second substrates. Still further, a laminate formed by the method is disclosed.
Abstract:
A composition comprising: (a) an epoxy resin composition comprising: (i) a first epoxy component comprising an epoxy resin having at least one oxazolidone ring structure; and (ii) a second epoxy component selected from the group consisting of a liquid epoxy resin, a divinylarene dioxide, and combinations thereof; (b) a core-shell rubber comprising a rubber particle core and a shell layer, and (c) a hardener, is disclosed.
Abstract:
A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000, wherein the first and second components are formulated to be applied to separate substrates before being brought together. Further, a method for forming a laminate is disclosed, the method comprising uniformly applying the isocyanate component to a first substrate, uniformly applying the polyol component to a second substrate, bringing the first and second substrates together, thereby mixing and reacting the isocyanate component and the polyol component to form an adhesive between the first and second substrates, and curing the adhesive to bond the first and second substrates. Still further, a laminate formed by the method is disclosed.
Abstract:
A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000. Further, a method for forming a laminate is disclosed, the method comprising forming a solventless adhesive composition comprising an amine-initiated polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. Still further, a laminate formed by the method is disclosed.
Abstract:
A two-component solventless adhesive composition is disclosed, the adhesive composition comprising an isocyanate component comprising at least one isocyanate, and a polyol component comprising at least one amine-initiated polyol having a functionality of from 3 to 8 and a hydroxyl number of from 20 to 1,000. Further, a method for forming a laminate is disclosed, the method comprising forming a solventless adhesive composition comprising an amine-initiated polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. Still further, a laminate formed by the method is disclosed.
Abstract:
A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i) and (ii) of one or more blocked diisocyanate, polyisocyanate or polyisocyanate prepolymer which contains a blocking agent and has a deblocking temperature of from 80 to 160° C., and (iii) one or more aromatic diamine curative. The reaction mixture has a gel time at 80° C. and a pressure of 101 kPa of from 2 to 15 minutes; the polyurethane reaction product has a residual blocking agent content of 2 wt. % or less; and the polishing layer exhibits a density of from 0.6 to 1.2 g/cm3.
Abstract:
Water-based adhesive composition are disclosed, the compositions comprising an acrylic dispersion, an epoxy-terminated polyester incorporated into the acrylic dispersion, and a water-dispersible isocyanate. Methods for laminating a first substrate to a second substrate are also disclosed, the methods comprising (a) providing an acrylic dispersion, (b) providing an epoxy-terminated polyester, (c) mixing the acrylic dispersion and the epoxy-terminated polyester, (d) mixing the mixture of (c) with a water-dispersible isocyanate to form an adhesive composition, (e) coating the adhesive composition of (d) on a surface of the first substrate, (f) drying the adhesive compositions on the first substrate to remove water, and (g) bringing the adhesive composition on the surface of the first substrate into contact with a surface of a second substrate, thereby laminating the first substrate to the second substrate. Laminates prepared comprising the water-based adhesives and according to the disclosed methods are also disclosed.
Abstract:
A two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component having an average molecular weight greater than 1,000 that comprises a polyester polyol that is the reaction product of a polyhydric alcohol and a polybasic acid. The NCO content of the isocyanate component is, optionally, between 3 and 9%. The isocyanate reactive component comprises a polyester polyol that accounts for 50 wt % or more of the isocyanate reactive component. The composition further comprises a polyol component comprising polyether polyols having an average molecular weight less than 1,500. The composition still further comprises an adhesion promoter. The average functionality of the adhesive composition is from 2 to 2.4. The adhesive composition provides for improved performance and processability. A method for forming a laminate is also disclosed. A laminate formed by this method is also disclosed.
Abstract:
A process comprising a) mixing i) an isocyanate reactive component that contains from 2 to 100 weight percent of an aminobenzoate terminated composition wherein the isocyanate reactive component does not contain a solvent; and ii) an isocyanate terminated component having an isocyanate functionality of from 2 to 6 wherein the isocyanate terminated component does not contain a solvent; at a stoichiometric ratio of NCO to reactive hydrogen in the range of from 0.9 to 2.5; to form an adhesive composition; b) applying the adhesive composition to a primary substrate; and c) laminating the primary substrate with a secondary film to form a laminate structure, is disclosed. The laminate structure can be used as a laminating adhesive.