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公开(公告)号：US06927343B2
公开(公告)日：2005-08-09
申请号：US10266866
申请日：2002-10-09
申请人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
发明人： Naoyuki Watanabe , Shigeyuki Maruyama , Kazuhiro Tashiro , Daisuke Koizumi , Takafumi Hashitani
CPC分类号： G01R1/07314 , G01R1/06716 , H01R12/52 , H01R12/714 , H01R13/24
摘要： A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.
摘要翻译： 接触器具有绝缘材料的薄膜基板和基板上的多个布线图案。 每个布线图案的第一端作为第一接触端子从基板的第一边缘延伸出来，并且每个布线图案的第二端作为第二接触端子从基板的第二边缘延伸出来，并且接触器的一部分 位于第一端部和第二端部之间的弹性体可以弹性变形。
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22.发明授权Tray in combination with electronic component attaching tool attached to the tray 失效托盘与附在托盘上的电子元件连接工具组合公开(公告)号：US08671557B2
公开(公告)日：2014-03-18
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。
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公开(公告)号：US08428651B2
公开(公告)日：2013-04-23
申请号：US12670304
申请日：2008-07-23
IPC分类号： H04M1/00
CPC分类号： H04B1/406 , H04B1/0483 , H04B1/18
摘要： A shared transmission/reception apparatus (OF-TRX) includes: a transmission/reception processor section (TRX-B) for a mobile communication system B configured to perform frequency conversion processing on a transmission baseband signal for the mobile communication system B outputted from a signal converter section (E/O), and to output a transmission radio frequency signal for the mobile communication system B; a power level adjuster section (VA) configured to adjust a power level of a transmission radio frequency signal for a mobile communication system A inputted from a transmission/reception processor section (TRX-A) for the mobile communication system A; a combiner section (COM) configured to generate a transmission radio frequency signal by combining the transmission radio frequency signal for the mobile communication system A outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the mobile communication system B outputted from the transmission/reception processor section (TRX-B) for the mobile communication system B; and a common amplifier section (PA) configured to amplify a power level of the transmission radio frequency signal outputted from the combiner section (COM) at a predetermined amplification rate, and to output the resultant signal.
摘要翻译： 共享发送接收装置（OF-TRX）包括：移动通信系统B的发送接收处理部（TRX-B），被配置为对从移动通信系统B输出的移动通信系统B的发送基带信号进行变频处理 信号转换部（E / O），输出移动通信系统B的发送射频信号; 功率电平调整部（VA），被配置为调整从用于移动通信系统A的发送/接收处理器部分（TRX-A）输入的移动通信系统A的发送射频信号的功率电平; 配置为通过组合从功率电平调节器部分（VA）输出的移动通信系统A的发送射频信号和输出的移动通信系统B的发送射频信号来生成发送射频信号的组合器部分（COM） 来自用于移动通信系统B的发送/接收处理器部分（TRX-B）; 以及公共放大器部（PA），被配置为以预定的放大率放大从组合器部（COM）输出的发送射频信号的功率电平，并输出所得到的信号。
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公开(公告)号：US06410354B1
公开(公告)日：2002-06-25
申请号：US09906675
申请日：2001-07-18
IPC分类号： H01L2100
CPC分类号： G01R31/2891 , G01R1/07314
摘要： A semiconductor substrate test device includes a contactor having contact electrodes to be connected with terminals formed on a semiconductor substrate, and a drag supply part supplying a drag to prevent a deformation of the contactor caused by a contact force resulting from contacts of the contact electrodes with the terminals.
摘要翻译： 半导体衬底测试装置包括具有与半导体衬底上形成的端子连接的接触电极的接触器，以及阻力供应部分，用于阻止接触器由接触电极的接触引起的接触力引起的变形， 终端。
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25.发明授权Probe card and method of testing wafer having a plurality of semiconductor devices 有权探针卡和测试具有多个半导体器件的晶片的方法公开(公告)号：US06563330B1
公开(公告)日：2003-05-13
申请号：US09540870
申请日：2000-03-31
申请人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
发明人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05568 , H01L2224/05569 , H01L2224/05573 , H01L2224/11 , H05K3/326
摘要： A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material according to the present invention. An electrode pitch of the contact electrodes is expanded by the first wiring.
摘要翻译： 一种用于测试形成多个半导体芯片的晶片的探针卡，所述探针卡包括基板和多层基板。 探针卡还可以包括柔性基底。 在其中一个芯片上与电极相对设置的接触电极设置在柔性基板的上方或下方，或者可以设置在多层基板上的弹性材料上。 第一布线具有连接到接触电极的第一部分，从第一部分的电平延伸到较低电平的多层基板的电平转换部分，以及连接到电平转换部分的端部处的连接端子 多层基板上的内部端子。 多层基板中的第二布线将内部端子连接到多层基板的外围的外部端子。 电路板上的第三个接线将多层基板上的外部端子连接到电路板上的外部连接端子。 在晶片测试期间施加的温度负载导致的内部端子的位移由第一布线的电平转换部分补偿。 涉及探针卡上的接触电极和芯片上的电极之间的接触的不均匀性由根据本发明的接触电极和/或弹性材料补偿。 接触电极的电极间距由第一布线扩大。
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公开(公告)号：US08213992B2
公开(公告)日：2012-07-03
申请号：US12670339
申请日：2008-07-23
IPC分类号： H04M1/00
CPC分类号： H04B1/0067 , H03F3/24 , H04B1/0483 , H04B2001/0408 , H04W88/08
摘要： A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency conversion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the transmission radio frequency signal outputted from the combiner section (COM) at a predetermined amplification rate, and to output the resultant signal.
摘要翻译： 共享AMP包括：用于第二移动通信系统的发送/接收处理器部分（TRX-B），被配置为对移动通信系统B的输入的发送基带信号执行频率转换处理，并且输出用于 第二移动通信系统; 功率电平调整部（VA），被配置为调整用于第一移动通信系统的输入的发送射频信号的功率电平; 通过组合从功率电平调节部（VA）输出的第一移动通信系统的发送射频信号和第二移动通信系统的发送射频信号，构成为生成发送射频信号的组合器部（COM） 从第二移动通信系统的发送/接收处理器部分（TRX-B）输出; 以及公共放大器部（PA），被配置为以预定的放大率放大从组合器部（COM）输出的发送射频信号的功率电平，并输出所得到的信号。
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27.发明申请METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL 失效连接电子元件和电子元器件连接工具的方法公开(公告)号：US20120005883A1
公开(公告)日：2012-01-12
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。
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28.发明授权公开(公告)号：US07977961B2
公开(公告)日：2011-07-12
申请号：US12358522
申请日：2009-01-23
申请人： Daisuke Koizumi , Naohito Kohashi , Yuji Akasaki
发明人： Daisuke Koizumi , Naohito Kohashi , Yuji Akasaki
IPC分类号： G01R31/00
CPC分类号： G01R31/2863 , G01R31/2865
摘要： A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.
摘要翻译： 用于电子部件的测试装置的部件包括测试板; 投影电极，设置在测试板的主表面上; 所述定位部设置在所述测试板的主表面上，所述定位部被配置为定位所述电子部件; 以及按压部，被构造成按压由所述定位部定位的所述电子部件，并且使所述电子部件的引导部与所述突起电极接触，使得所述引线部弹性变形并与所述突起电极接触。
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公开(公告)号：US20100304790A1
公开(公告)日：2010-12-02
申请号：US12670339
申请日：2008-07-23
IPC分类号： H04W88/08
CPC分类号： H04B1/0067 , H03F3/24 , H04B1/0483 , H04B2001/0408 , H04W88/08
摘要： A shared AMP includes: a transmission/reception processor section (TRX-B) for a second mobile communication system configured to perform frequency convers ion processing on an inputted transmission baseband signal for a mobile communication system B, and to output a transmission radio frequency signal for the second mobile communication system; a power level adjuster section (VA) configured to adjust a power level of an inputted transmission radio frequency signal for a first mobile communication system; a combiner section (COM) configured to generate a transmission radio frequency signal, by combining the transmission radio frequency signal for the first mobile communication system outputted from the power level adjuster section (VA) and the transmission radio frequency signal for the second mobile communication system outputted from the transmission/reception processor section (TRX-B) for the second mobile communication system; and a common amplifier section (PA) configured to amplify a power level of the transmission radio frequency signal outputted from the combiner section (COM) at a predetermined amplification rate, and to output the resultant signal.
摘要翻译： 共享AMP包括：用于第二移动通信系统的发送/接收处理器部分（TRX-B），被配置为对移动通信系统B的输入的发送基带信号执行频率转换处理，并且输出发送射频信号 用于第二移动通信系统; 功率电平调整部（VA），被配置为调整用于第一移动通信系统的输入的发送射频信号的功率电平; 通过组合从功率电平调节部（VA）输出的第一移动通信系统的发送射频信号和第二移动通信系统的发送射频信号，构成为生成发送射频信号的组合器部（COM） 从第二移动通信系统的发送/接收处理器部分（TRX-B）输出; 以及公共放大器部（PA），被配置为以预定的放大率放大从组合器部（COM）输出的发送射频信号的功率电平，并输出所得到的信号。
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公开(公告)号：US07825676B2
公开(公告)日：2010-11-02
申请号：US11798188
申请日：2007-05-10
IPC分类号： G01R31/02
CPC分类号： H05K3/308 , G01R1/0466 , G01R1/0483 , G01R1/06716 , H01R12/52 , H01R12/57 , H01R13/2485 , H01R2201/20 , H05K3/325 , H05K3/4623 , H05K2201/0311 , H05K2201/096 , H05K2201/10734
摘要： A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.
摘要翻译： 由导电材料形成的接触端子布置在接触器基板的多个孔中的每一个中。 导电部分形成在每个孔的内表面上。 接触端子具有接触电子部件的端子的第一接触部分和在中间部分中与导电部件接触的第二接触部分。 当接触端子被第一接触部分按压时，第二接触部分接触接触器基板的导电部分并获得适当的接触压力。
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