公开(公告)号：US20050214963A1

公开(公告)日：2005-09-29

申请号：US11029129

申请日：2005-01-04

申请人： John Daniels ,  Gregory Nelson

发明人： John Daniels ,  Gregory Nelson

IPC分类号： H01L21/00 ,  H01L25/075 ,  H01L27/00 ,  H01L33/52

CPC分类号： H01L31/022425 ,  H01L24/29 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L31/048 ,  H01L31/1876 ,  H01L31/188 ,  H01L33/52 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/75822 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2224/95 ,  H01L2224/95145 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10336 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y02E10/50 ,  Y02P70/521 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2924/00012

摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.

摘要翻译： 制备轻活性片材的方法。 提供具有导电表面的底部基板。 提供热熔粘合片。 诸如LED模具的光活性半导体元件被嵌入热熔粘合片中。 LED芯片各自具有顶部电极和底部电极。 提供具有透明导电层的顶部透明基板。 将具有嵌入式LED管芯的热熔粘合片插入在导电表面和透明导电层之间以形成层压。 层压通过加热的压力辊系统来熔化热熔粘合片并将顶部基底电绝缘并结合到底部基底。 当热熔片被软化时，LED管芯突破，使得顶部电极与顶部基板的透明导电层电接触，并且底部电极与底部基板的导电表面电接触。 因此，每个LED管芯的p侧和n侧自动连接到顶部导电层和底部导电表面。 每个LED芯片被封装并固定在柔性热熔粘合片层中的基板之间。 底部基材，热熔粘合剂（具有嵌入式LED模具）和顶部基材可以以卷材料形式提供。 辊以连续的辊制造工艺聚集在一起，产生柔性的照明材料片。

公开(公告)号：US20050212406A1

公开(公告)日：2005-09-29

申请号：US10919915

申请日：2004-08-17

申请人： John Daniels ,  Gregory Nelson

发明人： John Daniels ,  Gregory Nelson

IPC分类号： F21K99/00 ,  H01L25/075 ,  H05B33/00 ,  H05B33/14

CPC分类号： F21K9/90 ,  F21Y2105/10 ,  F21Y2115/10 ,  G03G15/6582 ,  H01L25/0753 ,  H01L2924/0002 ,  Y10S428/917 ,  H01L2924/00

摘要： A photo-radiation source for the selective polymerization of photo-radiation-curable organic material. In a first embodiment, a first electrode is provided with a second electrode disposed adjacent to the first electrode, and defining a gap therebetween. A photo-radiation emission layer is disposed in the gap. The photo-radiation emission layer includes a charge-transport matrix material and an emissive particulate dispersed within the charge-transport matrix material. The emissive particulate receives electrical energy through the charge-transport matrix material applied as a voltage to the first electrode and the second electrode photo-radiation. The emissive particulate generates photo-radiation in response to the applied voltage. This photo-radiation is effective for the selective polymerization of photo-radiation curable organic material. In a second embodiment, a plurality of light emitting diode chips generate a photo-radiation spectrum effective for the selective polymerization of photo-radiation-curable organic material. Each chip has an anode and a cathode. A first electrode is in contact with each anode of the respective light emitting diode chips. A second electrode is in contact with each cathode of the respective light emitting diode chips. At least one of the first electrode and the second electrode comprises a transparent conductor. The plurality of chips are permanently fixed in a formation by being squeezed between the first electrode and the second electrode without the use of solder or wiring bonding. The plurality of chips can be permanently fixed in a formation by being adhered to at least one of the first electrode and the second electrode using a conductive adhesive. In accordance with this embodiment of the invention, ultra-high chip packing density is obtained without the need for solder or wiring bonding each individual chip.

摘要翻译： 用于光可辐射固化的有机材料的选择性聚合的光辐射源。 在第一实施例中，第一电极设置有与第一电极相邻设置并且在其之间限定间隙的第二电极。 光辐射发射层设置在间隙中。 光辐射发射层包括分散在电荷传输基质材料内的电荷传输基质材料和发射颗粒。 发射颗粒通过作为电压施加到第一电极和第二电极光辐射的电荷传输基质材料接收电能。 发射颗粒响应于施加的电压产生光辐射。 该光辐射对于光可辐射固化的有机材料的选择性聚合是有效的。 在第二实施例中，多个发光二极管芯片产生对光可固化有机材料的选择性聚合有效的光辐射光谱。 每个芯片都有一个阳极和一个阴极。 第一电极与相应的发光二极管芯片的每个阳极接触。 第二电极与相应的发光二极管芯片的每个阴极接触。 第一电极和第二电极中的至少一个包括透明导体。 多个芯片通过在第一电极和第二电极之间被挤压而永久地固定在地层中，而不使用焊料或布线接合。 多个芯片可以通过使用导电粘合剂粘附到第一电极和第二电极中的至少一个来永久地固定在地层中。 根据本发明的这个实施例，可以获得超高的芯片封装密度，而不需要每个芯片的焊料或布线。

公开(公告)号：US20050212007A1

公开(公告)日：2005-09-29

申请号：US11029137

申请日：2005-01-04

申请人： John Daniels ,  Gregory Nelson

发明人： John Daniels ,  Gregory Nelson

IPC分类号： F21K99/00 ,  F21V5/04 ,  H01L25/075 ,  H01L27/00 ,  H01L27/146 ,  H01L29/24 ,  H01L29/26 ,  H01L31/12 ,  H01L33/62

CPC分类号： B32B17/10036 ,  B32B17/10174 ,  B32B17/10321 ,  F21K9/00 ,  F21V5/04 ,  H01L21/67132 ,  H01L25/0753 ,  H01L27/14625 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01033

摘要： A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the transparent conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate. Thus, the p and n sides of each LED die are automatically connected to the top conductive layer and the bottom conductive surface. Each LED die is encapsulated and secured between the substrates in the flexible, hotmelt adhesive sheet layer. The bottom substrate, the hotmelt adhesive (with the embedded LED die) and the top substrate can be provided as rolls of material. The rolls are brought together in a continuous roll fabrication process, resulting in a flexible sheet of lighting material.

公开(公告)号：US20050211998A1

公开(公告)日：2005-09-29

申请号：US10920010

申请日：2004-08-17

申请人： John Daniels ,  Gregory Nelson

发明人： John Daniels ,  Gregory Nelson

IPC分类号： F21K99/00 ,  F21V5/04 ,  H01L25/075 ,  H01L27/00 ,  H01L27/146 ,  H01L29/24 ,  H01L29/26 ,  H01L31/12 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L27/14625 ,  F21K9/00 ,  F21V5/04 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/01015 ,  H01L2924/00

摘要： Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

摘要翻译： 光活性材料片的装置结构。 第一基板具有透明的第一导电层。 光活性半导体元件的图案被固定到第一基板。 光活性半导体元件具有n侧和p侧。 每个光活性半导体元件具有与透明导电层电连通的n侧或p侧中的任一个。 第二基板具有第二导电层。 粘合剂将第二基板固定到第一基板，使得每个所述光活性半导体元件的所述n侧或所述p侧中的另一个与第二导电层电连通。 从而形成固态光活性器件。