Ball grid array socket
    21.
    发明授权
    Ball grid array socket 失效
    球栅阵列插座

    公开(公告)号:US5669774A

    公开(公告)日:1997-09-23

    申请号:US614885

    申请日:1996-03-13

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    摘要: A substrate mating assembly has a first substrate with at least one socket mounted thereon. The at least one socket has contact retention points provided thereon which extend into a contact receiving opening thereof. A second substrate is provided with at least one mating contact mounted thereon. The at least one mating contact has an arcuate surface and is dimensioned to be received in the contact receiving opening of the at least one socket. As the first substrate and the second substrate are electrically mated together, the at least one mating contact is received in the contact receiving opening and maintained in position therein by the cooperation of the contact retention points with the arcuate surface of the at least one mating contact. The contact retention points are provided on resilient arms which are configured to allow for the elastic distortion thereof as the at least one mating contact is brought into engagement with the at least one socket, such that when the at least one mating contact is fully inserted, the resilient arms will return toward an unstressed position to cooperate with the arcuate surface of the at least one mating contact to maintain the at least one mating contact in position.

    摘要翻译: 衬底配合组件具有安装在其上的至少一个插座的第一衬底。 所述至少一个插座具有设置在其上的接触保持点,其延伸到其接触接收开口中。 第二基板设置有安装在其上的至少一个配合触头。 所述至少一个配合接触件具有弧形表面,并且其尺寸设计成容纳在所述至少一个插座的接触接收开口中。 当第一基板和第二基板电气配合在一起时,所述至少一个配合触头被接收在触点接收开口中并且通过所述触点保持点与所述至少一个配合触头的弓形表面的配合保持在其中 。 接触保持点设置在弹性臂上,弹性臂构造为当至少一个配合接触件与至少一个插座接合时允许其弹性变形,使得当至少一个配合接触件完全插入时, 弹性臂将朝向不受应力的位置返回,以与所述至少一个配合接触件的弧形表面配合,以将至少一个配合接触件维持在适当位置。

    Method of forming relatively hard materials
    22.
    发明授权
    Method of forming relatively hard materials 失效
    形成相对硬的材料的方法

    公开(公告)号:US5606888A

    公开(公告)日:1997-03-04

    申请号:US502647

    申请日:1995-07-14

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    摘要: A method of forming relatively hard materials is disclosed. The method includes providing tooling for performing the forming operation on a strip (10) of relatively hard material. The tooling includes a forming tool (22) and a mating die (24) coupled to a high speed stamping and forming machine (70). The tooling and machine are arranged so that the forming operation is performed within a time period that is less than the stress relaxation time constant for the material being formed.

    摘要翻译: 公开了形成相对硬的材料的方法。 该方法包括提供用于在相对硬的材料的条带(10)上进行成形操作的模具。 工具包括成形工具(22)和与高速冲压成型机(70)相连的配合模具(24)。 工具和机器被布置成使得成形操作在小于所形成材料的应力松弛时间常数的时间段内进行。

    High density area array modular connector
    23.
    发明授权
    High density area array modular connector 失效
    高密度区域阵列模块化连接器

    公开(公告)号:US5380210A

    公开(公告)日:1995-01-10

    申请号:US218863

    申请日:1994-03-28

    摘要: A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.

    摘要翻译: 一种用于电连接具有位于区域阵列中的高密度接触焊盘的电路构件的连接器,所述连接器具有易于制造的面积阵列特定的保持器,用于保持定位批量生产的标准化接触模块,其包含模块体内的可变形接触 用于互连接触垫,其中接触构造成由模块主体支撑地接合以提供足够的相对的弹簧力,以实现接触件和接触垫之间的擦拭互连。

    Chip carrier socket which requires low insertion force for the chip
carrier
    25.
    发明授权
    Chip carrier socket which requires low insertion force for the chip carrier 失效
    芯片载体需要低插入力的芯片载体插座

    公开(公告)号:US4630875A

    公开(公告)日:1986-12-23

    申请号:US814511

    申请日:1985-12-18

    CPC分类号: H05K7/1007

    摘要: Chip carrier socket 2 comprises a socket body 24 having a rectangular base 30 and walls 34 extending normally from the edges 32 of the base. The walls can be pivotally moved inwardly of the recess which is defined by the walls after a chip carrier 12 has been placed in the recess. A frame 28 is provided in surrounding relationship to the walls 34 and is movable relative thereto between a first position and a second position. When the frame 28 is moved to the second position, the walls 34 are moved inwardly thereby to move the contact terminals 26 in the walls against terminal pads 20 on the leadless chip carrier 12. The frame 28 also may have an ejector means integral therewith which will eject the chip carrier from the socket when the frame is moved from a second position to the first position. The frame may also cam the walls outwardly to permit placement of the chip carrier in the recess under ZIF conditions.

    摘要翻译: 芯片承载座2包括具有矩形底座30的插座主体24和从基座的边缘32正常延伸的壁34。 在芯片托架12已经放置在凹槽中之后,壁可以由凹槽限定的凹槽向内枢转运动。 框架28围绕壁34提供,并且可在第一位置和第二位置之间相对于框架28移动。 当框架28移动到第二位置时,壁34向内移动,从而将壁中的接触端子26移动到无引线芯片载体12上的端子垫20上。框架28还可以具有与其成一体的顶出装置 当框架从第二位置移动到第一位置时,将从插座中弹出芯片载体。 框架还可以向外凸出壁,以允许芯片载体在ZIF条件下放置在凹部中。

    Fiber array ferrule and method of making
    26.
    发明授权
    Fiber array ferrule and method of making 失效
    光纤阵列套圈及其制作方法

    公开(公告)号:US06816654B1

    公开(公告)日:2004-11-09

    申请号:US10608205

    申请日:2003-06-27

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    IPC分类号: G02B642

    摘要: The array ferrule of the present invention has a main body having a fiber receiving cavity which extends therethrough from a mating face to a rear end. A pair of pin slots is formed in opposing side walls of the main body being precisely located with respect to the fiber receiving cavity. In communication with each pin slot is a retention member slot for receiving a pin retention member. A plurality of fibers is precisely positioned within the fiber receiving cavity and an encapsulant substantially surrounds the fibers to substantially fill the fiber receiving cavity. A method of making the array ferrule begins with providing a ferrule blank having a pair of preformed slots extending inward from the opposing side walls. The blank is precisely aligned on a mandrel which is placed within the fiber receiving cavity. Pin slots are broached in each side surface in the area of the preformed slots to form the ferrule main body. The ferrule main body is then positioned within a ferrule receiving opening of a central fixture such that locating pins of the central fixture are positioned within the pin slots. The fiber receiving cavity is then populated with a plurality of optical fibers which are accurately located using a plurality of combs over the ends of the optical fibers which protrude from the mating face. Finally, the fiber receiving cavity is filled with an encapsulant.

    摘要翻译: 本发明的阵列套管具有主体,该主体具有从配合面向后端延伸穿过的纤维接收腔。 一对销槽形成在主体的相对的侧壁中,其相对于光纤接收腔精确定位。 与每个销槽连通是用于接收销保持构件的保持构件槽。 多个纤维精确地定位在光纤接收腔内,并且密封剂基本上围绕纤维以基本上填充光纤接收腔。一种制造阵列套圈的方法开始于提供一个套圈坯料,该套圈坯料具有一对预先形成的槽, 相对的侧墙。 坯料精确对准在置于纤维接收腔内的心轴上。 在预制槽的区域中的每个侧表面中拉出销槽,以形成套圈主体。 然后将套圈主体定位在中心固定件的套圈接收开口内,使得中心固定件的定位销定位在销槽内。 光纤接收腔然后填充有多个光纤,这些光纤在配合面突出的光纤端部上使用多个梳子精确定位。 最后,纤维接收腔充满密封剂。

    Mold apparatus
    27.
    发明授权
    Mold apparatus 失效
    模具设备

    公开(公告)号:US06213753B1

    公开(公告)日:2001-04-10

    申请号:US09164479

    申请日:1998-10-01

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    IPC分类号: B29C3304

    CPC分类号: B29C33/302 Y10S425/058

    摘要: This invention provides a method of forming a mold (20) including the steps of segmenting a surface to be molded into discrete adjacent linear sections, forming a profile of each section on an edge of a planar material to define a plurality of blades (30, 40, 50), and; stacking each blade (30, 40, 50) such that their profiled mold edges (34, 44, 54) together form the surface to be molded. The blades (30, 40, 50) are secured in a mold body (20) and selected ones of the blades (30, 40, 50) may be articulated to eject the molded article from the mold (20).

    摘要翻译: 本发明提供了一种形成模具(20)的方法,包括以下步骤:将待模制的表面分割成离散的相邻线性部分,在平面材料的边缘上形成每个部分的轮廓以限定多个叶片(30, 40,50),和; 堆叠每个叶片(30,40,50),使得其成型模具边缘(34,44,54)一起形成待模制的表面。 刀片(30,40,50)固定在模具本体(20)中,并且所选择的刀片(30,40,50)可被铰接以将模制品从模具(20)中排出。

    Configurable ground plane
    28.
    发明授权
    Configurable ground plane 失效
    可配置地平面

    公开(公告)号:US6039583A

    公开(公告)日:2000-03-21

    申请号:US40680

    申请日:1998-03-18

    摘要: An electrical connector 10 having a configurable ground plane 60 is provided. The connector 10 features an insulative housing 20 having an upright section 30 and a board receiving section 28. The board receiving section has open top and bottom outer surfaces 29, 27 for allowing insertion of contacts 50, 52 into contact receiving passages 34, 32. The ground plane 60 is disposed over the top set of contacts 50 and is profiled to engage selected ones of the contacts 50 in the upright section of the passages 34. The ground plane 60 is configurable in that it can be easily adapted to achieve various signal to ground contact ratios by locating contacts 92, 94 at selected positions on fingers 88 which extend into the upright section of the passages 34.

    摘要翻译: 提供具有可配置的接地平面60的电连接器10。 连接器10具有绝缘壳体20,其具有直立部分30和板接收部分28.板接收部分具有敞开的顶部和底部外表面29,27,用于允许将接触件50,52插入接触接收通道34,32。 接地平面60设置在顶部组触点50上方并被成型以与通道34的直立部分中的接触件50中选定的接触件接合。接地平面60可配置成可以容易地适应于实现各种信号 通过将接触件92,94定位在指向通道34的直立部分的指状物88上的选定位置。

    Method of making surface mount pads
    29.
    发明授权
    Method of making surface mount pads 失效
    制作表面贴装垫的方法

    公开(公告)号:US6012225A

    公开(公告)日:2000-01-11

    申请号:US19317

    申请日:1998-02-05

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    摘要: An apparatus and method for establishing a reliable compressive electrical connection between an electronic package and surface mount pads (6) of the printed circuit board (4) are disclosed. Contact pads (2) are solderable to pads (6) of the printed circuit board (4) and have electrically compatible metallurgy on the contact surface (10). These contact pads (2) are solderable to the pads (6) on their mounting surface (12). The contact pads (2) are assembled to the printed circuit board (4) by first adhesively attaching an array of contact pads to a film (20) and then placing the array over the pads (6) of the printed circuit board (4) and finally reflowing solder (7) which was previously attached to the pads (6) to complete the attachment.

    摘要翻译: 公开了一种用于在电子封装和印刷电路板(4)的表面安装焊盘(6)之间建立可靠的压缩电连接的装置和方法。 接触焊盘(2)可焊接到印刷电路板(4)的焊盘(6),并且在接触表面(10)上具有电气兼容的冶金。 这些接触焊盘(2)可焊接到其安装表面(12)上的焊盘(6)。 接触焊盘(2)通过首先将接触焊盘的阵列粘附到膜(20)上,然后将阵列放置在印刷电路板(4)的焊盘(6)上而组装到印刷电路板(4) 并且最后回流先前连接到焊盘(6)的焊料(7)以完成附着。

    Tool accelerator
    30.
    发明授权
    Tool accelerator 失效
    工具加速器

    公开(公告)号:US5927140A

    公开(公告)日:1999-07-27

    申请号:US991716

    申请日:1997-12-16

    申请人: Dimitry Grabbe

    发明人: Dimitry Grabbe

    摘要: A tool accelerator is disclosed that is cooperatively disposed in a stamping and forming machine that is adapted to operate on a strip of relatively hard material. The tool accelerator generally includes a trigger punch having a proximal end and a distal end. A tool is coupled to the proximal end of the trigger punch and is adapted to perform work on a strip of relatively hard material. A spring is disposed between a portion of the stamping and forming machine and the proximal end of the trigger punch, the spring being capable of being compressed by a predetermined amount in response engagement of the distal end of the trigger punch with the strip of relatively hard material. Structure is provided for triggering the release of the compressed spring when the predetermined amount of compression is reached where the time period for moving the tool into engagement with the strip of relatively hard material coincides with a rate of travel sufficiently fast so that the forming operation is completed in less than the stress relaxation time constant of the material and without cracking the strip of relatively hard material.

    摘要翻译: 公开了一种工具加速器,其协同地设置在适于在相对硬的材料的条带上操作的冲压成形机中。 工具加速器通常包括具有近端和远端的扳机冲头。 工具联接到触发器的近端并且适于对相对硬的材料的条进行加工。 弹簧设置在冲压成形机的一部分和触发冲头的近端之间,弹簧能够在扳机冲头的远端与相对硬的条带的响应接合中被压缩预定量 材料。 当达到预定量的压缩时,提供用于触发压缩弹簧的释放的结构,其中用于使工具移动与相对硬的材料的条带接合的时间周期与足够快的行进速度一致,使得成形操作是 在材料的应力松弛时间常数小于或小于不破裂相对硬的材料条的情况下完成。