Staggered target tiles
    21.
    发明授权
    Staggered target tiles 有权
    交错的目标瓷砖

    公开(公告)号:US07550066B2

    公开(公告)日:2009-06-23

    申请号:US10888383

    申请日:2004-07-09

    申请人: Avi Tepman

    发明人: Avi Tepman

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3407

    摘要: A sputtering target, particularly for sputter depositing a target material onto large rectangular panels, in which a plurality of target tiles are bonded to a backing plate in a two-dimensional non-rectangular array such that the tiles meet at interstices of no more than three tile, thus locking the tiles against excessive misalignment during bonding. The rectangular tiles may be arranged in staggered rows or in a herringbone or zig-zag pattern. Hexagonal and triangular tiles also provide many of the advantages of the invention.

    摘要翻译: 一种溅射靶,特别是用于将目标材料溅射沉积到大矩形板上,其中多个目标瓦片以二维非矩形阵列结合到背板上,使得瓦片在不超过三个 从而在粘合期间将瓷砖锁定以防止过度的未对准。 矩形瓦片可以以交错的行或人字形或锯齿形图案布置。 六角形和三角形瓦片也提供了本发明的许多优点。

    Two dimensional magnetron scanning for flat panel sputtering
    22.
    发明授权
    Two dimensional magnetron scanning for flat panel sputtering 有权
    二维磁控管扫描用于平板溅射

    公开(公告)号:US07513982B2

    公开(公告)日:2009-04-07

    申请号:US10863152

    申请日:2004-06-07

    申请人: Avi Tepman

    发明人: Avi Tepman

    CPC分类号: C23C14/35 H01J37/3408

    摘要: A generally rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100 mm for a 2 m target. The scan may follow a double-Z pattern along two links parallel to a target side and the two connecting diagonals. The magnetron includes a closed plasma loop formed in a convolute shape, for example, serpentine or rectangularized helix with an inner pole of nearly constant width extending along a single path and having one magnetic polarity completely surrounded by an outer pole having the opposed polarity.

    摘要翻译: 放置在矩形靶的背面的大致矩形的磁控管,以在用于将靶材溅射到矩形面板上的溅射反应器中加强等离子体。 磁控管的尺寸仅略低于目标的尺寸,并且在靶的两个垂直方向上扫描,扫描长度例如对于2m靶的扫描长度为约100mm。 扫描可以沿着平行于目标侧的两个链接和两个连接对角线沿着双Z图案。 磁控管包括形成为卷积形状的闭合等离子体环,例如蛇形或矩形螺旋,具有几乎恒定宽度的内极,沿着单个路径延伸,并具有完全被具有相反极性的外极包围的一个磁极。

    Scrubber box
    23.
    发明授权
    Scrubber box 有权
    洗衣盒

    公开(公告)号:US07377002B2

    公开(公告)日:2008-05-27

    申请号:US10976012

    申请日:2004-10-28

    IPC分类号: B08B1/04

    CPC分类号: H01L21/67046 B08B1/04

    摘要: A scrubber box is provided that includes a tank adapted to receive a substrate for cleaning, supports outside of the tank and adapted to couple to ends of scrubber brushes disposed within the tank, a motor mounted to each of the supports and adapted to rotate the scrubber brushes, a base to which the supports are pivotally mounted via spherical bearings adapted to permit toe-in of the scrubber brushes, a brush gap actuator adapted, via a crank and rocker mechanism, to substantially simultaneously pivot the supports toward or away from each other so as to permit the scrubber brushes to substantially simultaneously achieve or break contact with the substrate, and a toe-in actuator adapted to move two of the spherical bearings toward or away from each other so as to adjust a toe-in angle between the scrubber brushes.

    摘要翻译: 提供了一种洗涤器箱,其包括适于接收用于清洁的基底的罐,支撑在罐外部并且适于耦合到设置在罐内的洗涤器刷的端部;马达,其安装到每个支撑件上并适于旋转洗涤器 电刷,支架通过适于允许洗涤器刷子进入的球面轴承可枢转地安装的基座,经由曲柄和摇臂机构适应的基本上同时地使支撑件朝向或远离彼此枢转的电刷间隙致动器 以便允许洗涤器刷子基本上同时实现或断开与基板的接触,以及适于将两个球形轴承朝向或远离彼此移动的脚趾致动器,以便调节洗涤器之间的束缚角度 刷子

    Method for processing a substrate using multiple fluid distributions on a polishing surface
    24.
    发明申请
    Method for processing a substrate using multiple fluid distributions on a polishing surface 审中-公开
    在抛光表面上使用多个流体分布来处理基底的方法

    公开(公告)号:US20060079156A1

    公开(公告)日:2006-04-13

    申请号:US11262620

    申请日:2005-10-31

    IPC分类号: B24B1/00

    摘要: A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled thereto. The restricting device interfaces with the delivery tube and is adapted to provide a variable restriction to flow passing through the delivery tube. In another embodiment, the restricting device is a pinch valve and the tube in continuous from the outlet to beyond a portion that interfaces with the pinch valve. In yet another embodiment, the position of the dispense arm is controllable.

    摘要翻译: 已经提供了一种抛光流体输送装置,其在一个实施例中包括支撑构件,分配臂,抛光流体输送管和可变限制装置。 分配臂从支撑构件的上部延伸并且具有与其连接的输送管的出口。 限制装置与输送管接口并且适于对通过输送管的流动提供可变的限制。 在另一个实施例中,限制装置是夹管阀,并且管从出口连续到超过与夹紧阀相接合的部分。 在另一个实施例中,分配臂的位置是可控的。

    Lift pin alignment and operation methods and apparatus
    25.
    发明授权
    Lift pin alignment and operation methods and apparatus 失效
    提升针对准和操作方法和装置

    公开(公告)号:US06935466B2

    公开(公告)日:2005-08-30

    申请号:US09797459

    申请日:2001-03-01

    CPC分类号: H01L21/68742 Y10S414/135

    摘要: A lifting mechanism includes a plurality of lift pins which may be driven separately and independently upward to engage an alignment surface of the chamber using ambient atmospheric pressure as the chamber is evacuated by a pump. In the illustrated embodiment, each lift pin includes a piston which is exposed to the internal chamber pressure on one side of the piston, and is exposed to the external ambient pressure on the other side of the piston. As the pump evacuates the chamber, the internal chamber pressure decreases, causing each lift pin piston to drive the associated lift pin upward. Once all the lift pins have securely engaged the alignment surface, the lift pins may be clamped to a linking mechanism to permit a motor to actuate the lift pins during processing operations.

    摘要翻译: 提升机构包括多个提升销,所述提升销可以单独驱动并且独立地向上驱动,以便当所述室被泵排空时,使用环境大气压与室的对准表面接合。 在所示的实施例中,每个提升销包括活塞,该活塞暴露于活塞的一侧上的内部室压力,并且暴露于活塞另一侧的外部环境压力。 当泵排空室时,内部室压力降低,导致每个升降销活塞向上驱动相关联的升降销。 一旦所有升降销牢固地接合到对准表面上,升降销可以被夹紧到连接机构,以允许马达在加工操作期间致动提升销。

    Variable flow deposition apparatus and method in semiconductor substrate processing
    27.
    发明授权
    Variable flow deposition apparatus and method in semiconductor substrate processing 失效
    半导体衬底加工中的可变流沉积装置和方法

    公开(公告)号:US06777352B2

    公开(公告)日:2004-08-17

    申请号:US10074854

    申请日:2002-02-11

    IPC分类号: H01L2131

    摘要: In one embodiment of the present inventions, an exhaust outlet in a vacuum processing chamber includes a nonsealing flow restrictor which can facilitate rapid opening and closing of the flow restrictor in some applications. Because the flow restrictor is a nonsealing flow restrictor, the conductance of the flow restrictor in the closed position may not be zero. However, the flow restrictor can restrict the flow of an exhaust gas from the chamber to permit the retention of sufficient processing gas in the chamber to deposit a film on the substrate or otherwise react with the substrate. After a film has been deposited, typically in a thin atomic layer, the exhaust flow restrictor may be opened such that the flow restrictor conductance is significantly increased to a second, higher flow rate to facilitate exhausting residue gas from the chamber. The nonsealing flow restrictor may be closed again to deposit a second layer, typically of a different material onto the substrate. The nonsealing flow restrictor may be rapidly opened and closed to deposit alternating layers of a variety of materials onto the substrate.

    摘要翻译: 在本发明的一个实施例中,真空处理室中的排气出口包括非密封流量限制器,其可以在某些应用中促进限流器的快速打开和关闭。 由于限流器是非密封流量限制器,因此限流器在关闭位置的电导可能不为零。 然而,限流器可以限制来自腔室的废气的流动,以允许在腔室中保留足够的处理气体以将膜沉积在衬底上或以其它方式与衬底反应。 在薄膜沉积后,通常在薄原子层中,可以打开排气限流器,使得限流器电导率显着增加到第二较高的流速,以便排出来自腔室的残余气体。 非密封流量限制器可以再次关闭,以将通常为不同材料的第二层沉积到基底上。 非密封流量限制器可以被快速地打开和关闭,以将各种材料的交替层沉积到基底上。

    System for planarizing metal conductive layers
    28.
    发明授权
    System for planarizing metal conductive layers 失效
    用于平坦化金属导电层的系统

    公开(公告)号:US06770565B2

    公开(公告)日:2004-08-03

    申请号:US10043561

    申请日:2002-01-08

    IPC分类号: H01L2302

    摘要: A method of planarizing a metal conductive layer on a substrate is provided. In one embodiment, a substrate having a metal conductive layer disposed on a top surface of the substrate is provided on a substrate support. The substrate support is rotated and the top surface of the substrate is contacted with a liquid etching composition. The metal conductive layer is then exposed to an etchant gas in order to planarize the top surface of the metal conductive layer. Also provided is an apparatus for etching a metal conductive layer on a substrate. The apparatus comprises a container, a substrate support disposed in the container, a rotation actuator attached to the substrate support, and a fluid delivery assembly disposed in the container.

    摘要翻译: 提供了在基板上平面化金属导电层的方法。 在一个实施例中,在衬底支架上设置具有设置在衬底顶表面上的金属导电层的衬底。 衬底支撑件旋转并且衬底的顶表面与液体蚀刻组合物接触。 然后将金属导电层暴露于蚀刻剂气体,以平坦化金属导电层的顶表面。 还提供了一种用于在基板上蚀刻金属导电层的装置。 该装置包括容器,设置在容器中的基板支撑件,附接到基板支撑件的旋转致动器以及设置在容器中的流体输送组件。

    Cooling system for magnetron sputtering apparatus
    29.
    发明授权
    Cooling system for magnetron sputtering apparatus 有权
    磁控溅射装置冷却系统

    公开(公告)号:US06641701B1

    公开(公告)日:2003-11-04

    申请号:US09594198

    申请日:2000-06-14

    申请人: Avi Tepman

    发明人: Avi Tepman

    IPC分类号: C23C1434

    CPC分类号: H01J37/3497 H01J37/3405

    摘要: Apparatus and method for cooling a magnetron sputtering apparatus. More particularly, a system including a stationary conduit, a hollow drive shaft rotatably coupled to the stationary conduit, and a magnetron coupled to the hollow drive shaft.

    摘要翻译: 用于冷却磁控管溅射装置的装置和方法。 更具体地,包括固定导管,可旋转地联接到固定导管的中空驱动轴和耦合到中空驱动轴的磁控管的系统。

    Dual buffer chamber cluster tool for semiconductor wafer processing
    30.
    发明授权
    Dual buffer chamber cluster tool for semiconductor wafer processing 有权
    用于半导体晶圆处理的双缓冲室集群工具

    公开(公告)号:US06440261B1

    公开(公告)日:2002-08-27

    申请号:US09318233

    申请日:1999-05-25

    IPC分类号: H01L2100

    摘要: Apparatus for multi-chambered semiconductor wafer processing comprising a polygonal structure having at least two semiconductor process chambers disposed on one side. An area between the process chambers provides a maintenance access to the semiconductor processing equipment. Additionally, the apparatus may be clustered or daisy-chained together to enable a wafer to access additional processing chambers without leaving the controlled environment of the semiconductor wafer processing equipment.

    摘要翻译: 用于多室半导体晶片处理的装置,包括具有设置在一侧上的至少两个半导体处理室的多边形结构。 处理室之间的区域提供对半导体处理设备的维护访问。 另外,该装置可以被集群或菊花链连接在一起,以使得晶片能够访问附加的处理室而不会离开半导体晶片处理设备的受控环境。