MRAM synthetic anitferomagnet structure
    21.
    发明授权
    MRAM synthetic anitferomagnet structure 有权
    MRAM合成非铁磁结构

    公开(公告)号:US08754460B2

    公开(公告)日:2014-06-17

    申请号:US13925590

    申请日:2013-06-24

    CPC classification number: H01L43/08 G11C11/161 H01L27/222 H01L43/02 H01L43/10

    Abstract: An MRAM bit (10) includes a free magnetic region (15), a fixed magnetic region (17) comprising an antiferromagnetic material, and a tunneling barrier (16) comprising a dielectric layer positioned between the free magnetic region (15) and the fixed magnetic region (17). The MRAM bit (10) avoids a pinning layer by comprising a fixed magnetic region exhibiting a well-defined high Hflop using a combination of high Hk (uniaxial anisotropy), high Hsat (saturation field), and ideal soft magnetic properties exhibiting well-defined easy and hard axes.

    Abstract translation: MRAM位(10)包括自由磁区(15),包括反铁磁材料的固定磁区(17)和隧道势垒(16),其包括位于自由磁区(15)和固定 磁区(17)。 MRAM位(10)通过使用高Hk(单轴各向异性),高Hsat(饱和磁场)和显示明确定义的理想软磁性质的组合,包括表现出明确的高Hflop的固定磁区,避免了钉扎层 容易和坚硬的轴。

    Magnetoresistive stack and method of fabricating same

    公开(公告)号:USRE50331E1

    公开(公告)日:2025-03-04

    申请号:US17658470

    申请日:2022-04-08

    Abstract: A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the free magnetic layer. The magnetoresistive element further includes a second dielectric, having a first surface that is in contact with the surface of the free magnetic layer, and an electrode, disposed between the second dielectric and a conductor. The electrode includes: (i) a non-ferromagnetic portion having a surface that is in contact with a second surface of the second dielectric, and (ii) a second portion having at least one ferromagnetic material disposed between the non-ferromagnetic portion of the electrode and the conductor.

    Magnetoresistive stack and method of fabricating same

    公开(公告)号:US10199574B2

    公开(公告)日:2019-02-05

    申请号:US15941153

    申请日:2018-03-30

    Abstract: A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the free magnetic layer. The magnetoresistive element further includes a second dielectric, having a first surface that is in contact with the surface of the free magnetic layer, and an electrode, disposed between the second dielectric and a conductor. The electrode includes: (i) a non-ferromagnetic portion having a surface that is in contact with a second surface of the second dielectric, and (ii) a second portion having at least one ferromagnetic material disposed between the non-ferromagnetic portion of the electrode and the conductor.

    Magnetoresistive Stack and Method of Fabricating Same

    公开(公告)号:US20170125670A1

    公开(公告)日:2017-05-04

    申请号:US15400889

    申请日:2017-01-06

    CPC classification number: H01L43/12 G11C11/161 H01L43/02 H01L43/08 H01L43/10

    Abstract: A magnetoresistive element (e.g., a spin-torque magnetoresistive memory element) includes a fixed magnetic layer, a free magnetic layer, having a high-iron alloy interface region located along a surface of the free magnetic layer, wherein the high-iron alloy interface region has at least 50% iron by atomic composition, and a first dielectric, disposed between the fixed magnetic layer and the free magnetic layer. The magnetoresistive element further includes a second dielectric, having a first surface that is in contact with the surface of the free magnetic layer, and an electrode, disposed between the second dielectric and a conductor. The electrode includes: (i) a non-ferromagnetic portion having a surface that is in contact with a second surface of the second dielectric, and (ii) a second portion having at least one ferromagnetic material disposed between the non-ferromagnetic portion of the electrode and the conductor.

    Magnetoresistive memory element having a metal oxide tunnel barrier
    29.
    发明授权
    Magnetoresistive memory element having a metal oxide tunnel barrier 有权
    具有金属氧化物隧道势垒的磁阻存储元件

    公开(公告)号:US09444037B2

    公开(公告)日:2016-09-13

    申请号:US15043633

    申请日:2016-02-15

    Abstract: A magnetoresistive memory array including a plurality of magnetoresistive memory elements wherein each magnetoresistive memory element comprises a free layer including at least one ferromagnetic layer having perpendicular magnetic anisotropy, a fixed layer, and a tunnel barrier, disposed between and in contact with the free and fixed layers. The tunnel barrier includes a first metal-oxide layer, having a thickness between 1 and 10 Angstroms, a second metal-oxide layer, having a thickness between 3 and 6 Angstroms, disposed on the first metal-oxide layer, and a third metal-oxide layer, having a thickness between 3 and 6 Angstroms, disposed over the second metal-oxide layer. In one embodiment, the third metal-oxide layer is in contact with the free layer or fixed layer. The tunnel barrier may also include a fourth metal-oxide layer, having a thickness between 1 and 10 Angstroms, disposed between the second and third metal-oxide layers.

    Abstract translation: 一种包括多个磁阻存储元件的磁阻存储器阵列,其中每个磁阻存储元件包括自由层,该自由层包括至少一个具有垂直磁各向异性的铁磁层,固定层和隧道势垒,该自由层设置在自由和固定 层。 隧道势垒包括设置在第一金属氧化物层上的第一金属氧化物层,其厚度为1至10埃,厚度为3埃至6埃的第二金属氧化物层,以及第三金属氧化物层, 氧化物层,其厚度为3埃至6埃,设置在第二金属氧化物层上。 在一个实施例中,第三金属氧化物层与自由层或固定层接触。 隧道势垒还可以包括设置在第二和第三金属氧化物层之间的厚度在1埃和10埃之间的第四金属氧化物层。

    MRAM having an unpinned, fixed synthetic anti-ferromagnetic structure
    30.
    发明授权
    MRAM having an unpinned, fixed synthetic anti-ferromagnetic structure 有权
    MRAM具有未固定的,固定的合成反铁磁结构

    公开(公告)号:US09391264B2

    公开(公告)日:2016-07-12

    申请号:US14727910

    申请日:2015-06-02

    CPC classification number: H01L43/08 G11C11/161 H01L27/222 H01L43/02 H01L43/10

    Abstract: An MRAM bit includes a free magnetic region, a fixed magnetic region comprising an anti-ferromagnetic material, and a dielectric layer positioned between the free magnetic region and the fixed magnetic region. In one aspect, the fixed magnetic region consists essentially of an unpinned, fixed synthetic anti-ferromagnetic (SAF) structure which comprises (i) a first layer of one or more ferromagnetic materials, wherein the one or more ferromagnetic materials includes cobalt, (ii) a second layer of one or more ferromagnetic materials wherein the one or more ferromagnetic materials includes cobalt, (iii) a third layer of one or more ferromagnetic materials, and an anti-ferromagnetic coupling layer, wherein: (a) the anti-ferromagnetic coupling layer is disposed between the first and third layers, and (b) the second layer is disposed between the first layer and the anti-ferromagnetic coupling layer.

    Abstract translation: MRAM位包括自由磁区,包括反铁磁材料的固定磁区和位于自由磁区与固定磁区之间的电介质层。 在一个方面,固定磁区基本上由未固定的固定合成反铁磁(SAF)结构组成,其包括(i)一个或多个铁磁材料的第一层,其中一个或多个铁磁材料包括钴,(ii )一种或多种铁磁材料的第二层,其中所述一种或多种铁磁材料包括钴,(iii)一种或多种铁磁材料的第三层和反铁磁性耦合层,其中:(a)所述反铁磁性材料 耦合层设置在第一和第三层之间,(b)第二层设置在第一层和反铁磁性耦合层之间。

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