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    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET
    24.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED COOLING OF A HEAT SINK USING A SYNTHETIC JET 审中-公开
    使用合成喷嘴改善散热的方法和装置

    公开(公告)号：US20140290916A1

    公开(公告)日：2014-10-02

    申请号：US14302613

    申请日：2014-06-12

    Applicant: General Electric Company

    Inventor： Mehmet Arik ,  Yogen Vishwas Utturkar

    IPC: F28F3/02

    CPC classification number: F28F3/022 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

    Abstract translation: 一种用于冷却装置的系统包括：散热器，其包括其上布置有多个翅片的基板，定位成沿着第一方向引导环境流体穿过散热器的风扇;以及第一合成射流组件， 孔口合成射流和多个单孔合成射流。 第一合成喷射器组件被构造成引导围绕散热器的第二方向的环境流体，其中第二方向大致垂直于第一方向。

    SYNTHETIC JET EMBEDDED HEAT SINK
    25.
    发明申请
    SYNTHETIC JET EMBEDDED HEAT SINK 有权

    公开(公告)号：US20130213618A1

    公开(公告)日：2013-08-22

    申请号：US13852422

    申请日：2013-03-28

    Applicant: General Electric Company

    Inventor： Mehmet Arik ,  Yogen Vishwas Utturkar ,  Mustafa Gursoy

    IPC: F28F9/24

    CPC classification number: F28F9/24 ,  F28F13/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.

    Systems and methods for synthetic jet enhanced natural cooling
    26.
    再颁专利
    Systems and methods for synthetic jet enhanced natural cooling 有权

    公开(公告)号：USRE47790E1

    公开(公告)日：2019-12-31

    申请号：US13956904

    申请日：2013-08-01

    Applicant: General Electric Company

    Inventor： Jeffrey Russell Bult ,  Mehmet Arik ,  William Dwight Gerstler ,  Yogen Vishwas Utturkar

    IPC: H05K7/20 ,  F28F7/00 ,  F04B17/00 ,  F15D1/08 ,  H01L23/473

    Abstract: A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface.

    SELF-COOLING ELECTRIC SUBMERSIBLE PUMP
    28.
    发明申请
    SELF-COOLING ELECTRIC SUBMERSIBLE PUMP 审中-公开

    公开(公告)号：US20170292533A1

    公开(公告)日：2017-10-12

    申请号：US15092767

    申请日：2016-04-07

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Jalal Hunain Zia ,  Yogen Vishwas Utturkar ,  Nathaniel Benedict Hawes

    IPC: F04D29/58 ,  E21B43/12 ,  F25B1/04 ,  F04D13/10

    CPC classification number: F04D29/5806 ,  E21B43/121 ,  E21B43/128 ,  F04D13/10 ,  F25B1/04

    Abstract: A self-cooling electric submersible pump having an integrated cooling system is provided. The cooling system is configured to cool and lubricate the electric motor section of the pump by expanding a compressed multi-component coolant fluid through flow channels within the motor. The coolant fluid contains a first fluid having a boiling point of at least 230° C. and a second fluid having a boiling point of less than 150° C. During pump operation the first fluid acts as a largely incompressible liquid and the second fluid behaves as a compressible gas. A compressor compresses the second fluid in the presence of the first fluid to produce a hot compressed coolant fluid from which heat is transferred to a production fluid being processed by the pump. The compressed coolant fluid is expanded through an orifice and into the motor flow channels, returning thereafter to the compressor.

    SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES
    30.
    发明申请
    SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES 审中-公开

    公开(公告)号：US20170141654A1

    公开(公告)日：2017-05-18

    申请号：US15070333

    申请日：2016-03-15

    Applicant: General Electric Company

    Inventor： Karthik Kumar Bodla ,  Joo Han Kim ,  Yogen Vishwas Utturkar

    IPC: H02K9/20

    CPC classification number: H02K9/20

    Abstract: A component for an electrical machine is disclosed. The component is a stator and/or a rotor. The component includes a core, a magnetic field-generating component, and an oscillating heat pipe assembly. The core includes a plurality of slots and the magnetic field-generating component is disposed in at least one slot of the plurality of slots. The oscillating heat pipe assembly is disposed in the core and the at least one slot of the plurality of slots. The oscillating heat pipe assembly is in contact with the core and the magnetic field-generating component. The oscillating heat pipe assembly includes a dielectric material, and where the oscillating heat pipe assembly has an in-plane thermal conductivity higher than a through-plane thermal conductivity.

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