公开(公告)号：US20220099886A1

公开(公告)日：2022-03-31

申请号：US17036827

申请日：2020-09-29

Applicant: Google LLC

Inventor： Liming Wang ,  Ryohei Urata ,  Jan Petykiewicz ,  Jill Berger

IPC: G02B6/124 ,  H01L23/00 ,  G02B6/122 ,  G02B6/13

Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

公开(公告)号：US11264295B2

公开(公告)日：2022-03-01

申请号：US17038878

申请日：2020-09-30

Applicant: Google LLC

Inventor： Woon Seong Kwon ,  Ryohei Urata ,  Teckgyu Kang

IPC: H01L23/495 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: Integrated circuit substrates having features for containing liquid adhesive, and methods for fabricating such substrates, are provided. A device can include a first substrate layer and a second substrate layer adhered to the first substrate layer such that a portion of the top surface of the first substrate layer is exposed to define a bottom of a cavity, and an edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines an edge of the cavity. The device can include an integrated circuit die adhered to the exposed top surface of first substrate layer with a liquid adhesive. The first substrate layer can define a trench in the bottom of the cavity between a region of the integrated circuit die and the edge of the cavity such that the trench can receive bleed-out of the liquid adhesive from between the integrated circuit die and the top surface of the first substrate layer.

公开(公告)号：US20210074601A1

公开(公告)日：2021-03-11

申请号：US17038878

申请日：2020-09-30

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Ryohei Urata ,  Teckgyu Kang

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/538

Abstract: Integrated circuit substrates having features for containing liquid adhesive, and methods for fabricating such substrates, are provided. A device can include a first substrate layer and a second substrate layer adhered to the first substrate layer such that a portion of the top surface of the first substrate layer is exposed to define a bottom of a cavity, and an edge of the second substrate layer adjacent to the exposed top surface of the first substrate layer defines an edge of the cavity. The device can include an integrated circuit die adhered to the exposed top surface of first substrate layer with a liquid adhesive. The first substrate layer can define a trench in the bottom of the cavity between a region of the integrated circuit die and the edge of the cavity such that the trench can receive bleed-out of the liquid adhesive from between the integrated circuit die and the top surface of the first substrate layer.

公开(公告)号：US10763968B1

公开(公告)日：2020-09-01

申请号：US16517151

申请日：2019-07-19

Applicant: Google LLC

Inventor： Wenzao Li ,  Ryohei Urata ,  Xiang Zhou ,  Lieven Verslegers

IPC: H04B10/00 ,  H04B10/50 ,  H04B10/40 ,  H01S3/10 ,  H01S3/106 ,  H01S5/00 ,  H01S3/105 ,  H04J14/00 ,  G02B6/12

Abstract: A dual-mode optical transceiver is disclosed. The dual-mode optical transceiver includes a receiver section configured to receive both coherently modulated and intensity modulated optical signals and to be optically switched between a first receiver mode for direct detection and a second receiver mode for coherent detection, and a transmitter section including a nested Mach-Zehnder Modulator or a polarization multiplexed quad Mach-Zehnder Modulator configured to be operated in a first transmission mode to output an intensity modulated optical signal and a second transmission mode to output a coherently modulated optical signal. In some implementations, the dual-mode optical receiver includes an optical switch configured to selectively direct a received optical signal down a direct detection optical circuit or a coherent detection optical circuit based on a control signal applied to the optical switch.

公开(公告)号：US20180198533A1

公开(公告)日：2018-07-12

申请号：US15914583

申请日：2018-03-07

Applicant: Google LLC

Inventor： Xiang Zhou ,  Ryohei Urata ,  Erji Mao ,  Hong Liu ,  Christopher Lyle Johnson

IPC: H04B10/69

CPC classification number: H04B10/6971 ,  H04B10/697

Abstract: This disclosure provides systems, methods, and apparatus for mitigating the effects of interference signals on optical signals received at a direct-detection optical receivers. The optical receivers are capable of attenuating interference noise signals resulting from the interference between a transmitted optical signal transmitted from a transmitter to the optical receiver and one or more additional signals received at the optical receiver. The interference can be due to multi-path interference or due to in-band interference. The receivers include a tunable filter for filtering the received optical signal to remove the interference. A frequency offset module processes the received optical signal to determine a frequency offset indicative of the difference between the carrier frequencies of a modulated optical signal and an interference optical signal. The offset frequency and a bandwidth determined by the frequency offset module can be used to adjust the tunable filter to remove the interference signal from the received signal.

公开(公告)号：US20250067932A1

公开(公告)日：2025-02-27

申请号：US18945011

申请日：2024-11-12

Applicant: Google LLC

Inventor： Liming Wang ,  Ryohei Urata ,  Jan Petykiewicz ,  Jill Berger

IPC: G02B6/124 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  H01L23/00

Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

公开(公告)号：US11978721B2

公开(公告)日：2024-05-07

申请号：US17579012

申请日：2022-01-19

Applicant: Google LLC

Inventor： Woon-Seong Kwon ,  Namhoon Kim ,  Teckgyu Kang ,  Ryohei Urata

IPC: H01L25/065 ,  G02B6/42 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H01L25/04 ,  H01L25/075 ,  H01L31/12 ,  H10K39/00

CPC classification number: H01L25/0652 ,  G02B6/4257 ,  H01L23/3121 ,  H01L23/3672 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5385 ,  H01L23/5386 ,  H01L25/162 ,  H01L25/041 ,  H01L25/075 ,  H01L25/167 ,  H01L31/12 ,  H01L2225/06517 ,  H10K39/601

Abstract: The technology relates to an integrated circuit (IC) package. The IC package may include a substrate. An IC die may be mounted to the substrate. One or more photonic modules may be attached to the substrate and one or more serializer/deserializer (SerDes) interfaces may connect the IC die to the one or more photonic modules. The IC die may be an application specific integrated circuit (ASIC) die and the one or more photonic modules may include a photonic integrated circuit (PIC) and fiber array. The one or more photonic modules may be mounted to one or more additional substrates which may be attached to the substrate via one or more sockets.

公开(公告)号：US20230335928A1

公开(公告)日：2023-10-19

申请号：US17722860

申请日：2022-04-18

Applicant: Google LLC

Inventor： William F. Edwards, JR. ,  Xu Zuo ,  Ryohei Urata ,  Melanie Beauchemin ,  Woon-Seong Kwon ,  Shinnosuke Yamamoto ,  Houle Gan ,  Yujeong Shim

IPC: H01R12/70 ,  H01R13/66 ,  H01R13/533

CPC classification number: H01R12/7064 ,  H01R13/533 ,  H01R13/6683

Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.

公开(公告)号：US20230314709A1

公开(公告)日：2023-10-05

申请号：US18203328

申请日：2023-05-30

Applicant: Google LLC

Inventor： Liming Wang ,  Ryohei Urata ,  Jan Petykiewicz ,  Jill Berger

IPC: G02B6/124 ,  G02B6/122 ,  G02B6/13 ,  H01L23/00

CPC classification number: G02B6/124 ,  G02B6/1228 ,  G02B6/13 ,  H01L24/16 ,  G02B2006/12107

Abstract: A photonic integrated circuit chip includes a substrate and a wafer on the substrate. The wafer itself includes a photonic grating coupler with a taper portion and grating features. The grating features extend from the taper portion toward the substrate.

公开(公告)号：US11693197B2

公开(公告)日：2023-07-04

申请号：US17358314

申请日：2021-06-25

Applicant: Google LLC

Inventor： Daoyi Wang ,  Ryohei Urata ,  Lieven Verslegers ,  Jan Petykiewicz

IPC: G02B6/42 ,  G02B6/12 ,  G02B6/30

CPC classification number: G02B6/4242 ,  G02B6/12 ,  G02B6/30 ,  G02B6/423 ,  G02B6/4249

Abstract: A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.