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    Microfluidic chip and method of fabricating the same
    21.
    发明授权
    Microfluidic chip and method of fabricating the same 有权
    微流控芯片及其制造方法

    公开(公告)号：US07858042B2

    公开(公告)日：2010-12-28

    申请号：US11934811

    申请日：2007-11-05

    申请人： Kyu-youn Hwang ,  Joon-ho Kim ,  Chin-sung Park ,  Sung-young Jeong

    发明人： Kyu-youn Hwang ,  Joon-ho Kim ,  Chin-sung Park ,  Sung-young Jeong

    IPC分类号： B01N3/00

    CPC分类号： B01L3/502707 ,  B01L3/502753 ,  B01L2200/12 ,  B01L2300/16 ,  Y10T428/14

    摘要： Provided are a microfluidic chip and a method of fabricating the same. The microfluidic chip includes: a lower substrate; an upper substrate formed of a silicone resin, wherein the lower substrate and the upper substrate, bonded together, provide a channel through which a fluid can flow and a chamber to receive the fluid; and an organic thin film formed on the upper surface of the lower substrate except for portions on which the lower substrate and the upper substrate are attached to each other.

    摘要翻译： 提供了一种微流控芯片及其制造方法。 微流体芯片包括：下基板; 由硅树脂形成的上基板，其中所述下基板和所述上基板接合在一起，提供流体可以流过的通道和容纳所述流体的室; 以及形成在下基板的上表面上的有机薄膜，除了下基板和上基板彼此附接的部分之外。

    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME
    23.
    发明申请
    METHOD OF REDUCING TEMPERATURE DIFFERENCE BETWEEN A PAIR OF SUBSTRATES AND FLUID REACTION DEVICE USING THE SAME 有权
    降低基板对流与使用其的流体反应装置之间的温度差异的方法

    公开(公告)号：US20080053647A1

    公开(公告)日：2008-03-06

    申请号：US11689640

    申请日：2007-03-22

    申请人： Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    发明人： Kak Namkoong ,  Su-hyeon Kim ,  Jin-tae Kim ,  Chin-sung Park ,  Young-sun Lee

    IPC分类号： F28F7/00

    CPC分类号： B81B3/0081 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00822 ,  B01J2219/00873 ,  B01L3/5027 ,  B01L7/5255 ,  B01L2200/14 ,  B01L2200/147 ,  B01L2300/1805 ,  B01L2300/1827 ,  B81B2201/051 ,  F28F21/02 ,  F28F2013/006

    摘要： A method of reducing a temperature difference between a high-temperature and a low-temperature substrate includes interposing a heat transfer facilitating layer which has a higher thermal conductivity than air and can hold particles between the substrates, and maintaining close contact between the high-temperature substrate, the heat transfer facilitating layer, and the low-temperature substrate, wherein formation of an air layer can be at least substantially prevented between the high-temperature substrate and the heat transfer facilitating layer, and between the low-temperature substrate and the heat transfer facilitating layer. A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented.

    摘要翻译： 降低高温和低温基板之间的温度差的方法包括：介于热传导率高于空气的传热促进层，并且可以在基板之间保持颗粒，并且保持高温 基板，传热促进层和低温基板，其中至少可以在高温基板和传热促进层之间以及在低温基板和热量之间基本上防止空气层的形成 转移促进层。 流体反应装置包括容纳流体的微流体反应芯片，加热器和介于微流体反应芯片和加热器之间的传热促进层，传热促进层具有比空气更高的导热性并且可以保持 颗粒，其中可以防止空气层的形成。