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公开(公告)号：US09665125B2
公开(公告)日：2017-05-30
申请号：US14229386
申请日：2014-03-28
Applicant: Intel Corporation
Inventor： David W. Browning , Jeremy Burr , Russell S. Aoki
CPC classification number: G06F1/1632 , G06F1/1654 , G06F1/1679 , H01R13/6205
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer, laptop, or tablet that includes a circuit board coupled to a plurality of electronic components (which may include any type of components, elements, circuitry, etc.). One particular example implementation of a docking base comprises a base housing including at least one alignment pin disposed within the base housing. Each of the at least one alignment pin is configured to engage a corresponding alignment pin receptacle of a device housing of an electronic device. The base housing further includes an attachment mechanism coupled to the at least one first alignment pin, wherein the attachment mechanism is configured to cause the at least one first alignment pin to extend at least partially from the base housing when the device housing is within a predetermined proximity of the base housing.
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公开(公告)号：US09483084B2
公开(公告)日：2016-11-01
申请号：US14038913
申请日：2013-09-27
Applicant: Intel Corporation
Inventor： Patrick S. Johnson , Russell S. Aoki
CPC classification number: G06F1/1681 , E05D11/084 , E05Y2201/484 , E05Y2900/606 , Y10T16/5403
Abstract: A frictional hinge assembly for use with electronics devices such as computer notebooks having base and lid portions may present a higher level of frictional resistance to rotation in one direction than in the other. The hinge may comprise a base-mounted helical sleeve having loops that embrace a rotational shaft that is connected to a lid. As the lid is opened, the rotation of the shaft may cause the loops of the helical sleeve to tighten and thereby generate frictional forces, which requires a greater opening force to overcome than when the lid is being closed, in which case the loops loosen. The helical hinge may have applicability for notebook computers, electronic devices having clamshell form factors, all-in-one designs and tablets using kickstands and the like.
Abstract translation: 与诸如具有底座和盖部分的计算机笔记本电子设备一起使用的摩擦铰链组件可以在一个方向上比在另一个方向上具有更高水平的摩擦阻力。 铰链可以包括基座安装的螺旋套筒，其具有包围连接到盖子的旋转轴的环。 当盖打开时，轴的旋转可能导致螺旋套筒的环被紧固并因此产生摩擦力，这需要与当盖关闭时相比需要更大的打开力来克服，在这种情况下，环松开。 螺旋铰链可能适用于笔记本电脑，具有蛤壳形状因子的电子设备，一体式设计和使用踢脚台的平板电脑等。
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23.发明授权Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices 有权用于半导体器件的集成平移式格栅阵列插座和加载机构公开(公告)号：US09244487B2
公开(公告)日：2016-01-26
申请号：US14090493
申请日：2013-11-26
Applicant: Intel Corporation
Inventor： Russell S. Aoki , Anthony P. Valpiani , Barry T. Dale , Chia-Pin Chiu
IPC: H01R4/50 , G06F1/16 , H01R13/193 , H05K7/10
CPC classification number: G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
Abstract: A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
Abstract translation: 地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。 对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。 在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触 。
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公开(公告)号：US10788856B2
公开(公告)日：2020-09-29
申请号：US15770984
申请日：2015-11-24
Applicant: Intel Corporation
Inventor： Brian R. Peil , Russell S. Aoki , Aleksander Magi , James W. Edwards , Don J. Nguyen , Nicholas W. Oakley , Daria A. Loi , Meenakshi Gupta , Nithyananda S. Jeganathan
Abstract: Particular embodiments described herein provide for an electronic system that includes a docking station configured to wirelessly couple to an electronic device and a wireless charging element removably coupled to the docking station. The wireless charging element includes a power receiving unit and is configured to wireless charge the electronic device. In an example, the docking station is configured for high speed input/output.
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公开(公告)号：US20200218314A1
公开(公告)日：2020-07-09
申请号：US16683814
申请日：2019-11-14
Applicant: Intel Corporation
Inventor： Michael Hui , Russell S. Aoki , Anthony P. Valpiani , Nicolas A. Kurczewski
IPC: G06F1/16
Abstract: Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.
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Patent Agency Ranking
公开(公告)号：US10178763B2
公开(公告)日：2019-01-08
申请号：US14975941
申请日：2015-12-21
Applicant: Intel Corporation
Inventor： Rashelle Yee , Russell S. Aoki , Shelby Ferguson , Michael Hui , Jonathon Robert Carstens , Joseph J. Jasniewski , Kevin J. Ceurter
IPC: H05K1/02 , H01L23/498 , H05B1/02 , B23K1/00 , H05K1/14 , B23K101/42
Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.
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公开(公告)号：US10088864B2
公开(公告)日：2018-10-02
申请号：US14497534
申请日：2014-09-26
Applicant: Intel Corporation
Inventor： Russell S. Aoki , David W. Browning
Abstract: A wireless gimbal connection of use with electronics devices such as computer notebooks relatively pivotable portions such as a lid and base. The gimbal includes a carriage on which transmitter and receiver chips are mounted, and further has a magnet whose magnetic forces may be used to bring the gimbaled carriage into a predetermined alignment with the base, which may be used to arrange the chips and any sensors as may be used into alignment as well. As the orientation of the lid varies with respect to the base, the carriage within seeks alignment with the base due to the magnetic forces present. Where the base is located on a flat surface, gravitational forces also contribute to the alignment.
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公开(公告)号：US10074591B1
公开(公告)日：2018-09-11
申请号：US15448120
申请日：2017-03-02
Applicant: Intel Corporation
Inventor： Devdatta P. Kulkarni , Russell S. Aoki
Abstract: Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.
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公开(公告)号：US10044115B2
公开(公告)日：2018-08-07
申请号：US14757626
申请日：2015-12-23
Applicant: Intel Corporation
Inventor： Donald T. Tran , Gregorio Murtagian , Kuang Liu , Srikant Nekkanty , Feroz Mohammad , Karumbu Meyyappan , Hong Xie , Russell S. Aoki , Gaurav Chawla
IPC: H01R4/50 , H01R13/639 , H01R4/52 , H01R13/508 , H01R12/85 , H01R12/72
Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.
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公开(公告)号：US10021814B2
公开(公告)日：2018-07-10
申请号：US15254535
申请日：2016-09-01
Applicant: Intel Corporation
Inventor： Russell S. Aoki , Alan W. Tate , Ralph W. Jensen
CPC classification number: H05K7/20763 , G06F1/20 , G06F1/203 , H05K7/2039
Abstract: Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.
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