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公开(公告)号：US20190101469A1
公开(公告)日：2019-04-04
申请号：US15720861
申请日：2017-09-29
Applicant: International Business Machines Corporation
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane
Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.
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公开(公告)号：US20180364690A1
公开(公告)日：2018-12-20
申请号：US15623934
申请日：2017-06-15
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane , Jeffrey Nettey
Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.
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公开(公告)号：US10060974B2
公开(公告)日：2018-08-28
申请号：US14574746
申请日：2014-12-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jonathan R. Fry , Christopher Klabes , Andrew J. Martin , Vincent J. McGahay , Kathryn E. Schlichting , Melissa A. Smith
CPC classification number: G01R31/2896 , G01C22/00 , G01R31/2884
Abstract: Approaches for detecting wear in integrated circuit chips are provided. An on-chip sensor system includes an integrated circuit chip including a plurality of sensor groups. Each respective one of the sensor groups is structured and arranged to detect a measure of wear corresponding to a respective one of a plurality of failure mechanisms.
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24.发明申请公开(公告)号：US20180047644A1
公开(公告)日：2018-02-15
申请号：US15722459
申请日：2017-10-02
Applicant: International Business Machines Corporation
Inventor： Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
IPC: H01L21/66 , H01L21/54 , H01L21/48 , H01L23/522 , G01R31/28
CPC classification number: H01L22/14 , G01R31/2853 , G01R31/2896 , H01L21/4853 , H01L21/54 , H01L21/563 , H01L22/34 , H01L23/5222 , H01L23/5223 , H01L2224/16145 , H01L2224/32145 , H01L2224/73204 , H01L2224/73253 , H01L2924/00
Abstract: Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.
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25.发明申请公开(公告)号：US20170271219A1
公开(公告)日：2017-09-21
申请号：US15615148
申请日：2017-06-06
Applicant: International Business Machines Corporation
Inventor： Taryn J. Davis , Jonathan R. Fry , Tuhin Sinha
IPC: H01L21/66 , H01L23/498 , G01N29/06 , H01L21/56 , H01L21/48
CPC classification number: H01L22/34 , G01N29/043 , G01N29/06 , G01N29/0681 , G01N2291/101 , G01N2291/2697 , H01L21/4853 , H01L21/563 , H01L22/12 , H01L22/20 , H01L22/26 , H01L23/49816 , H01L23/49838 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2225/06596 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/16251 , H01L2924/19041 , H01L2924/19106 , H01L2924/35121
Abstract: A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.
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Patent Agency Ranking
公开(公告)号：US20160372391A1
公开(公告)日：2016-12-22
申请号：US14741086
申请日：2015-06-16
Applicant: International Business Machines Corporation
Inventor： Taryn J. Davis , Jonathan R. Fry , Terence L. Kane , Christopher F. Klabes , Andrew J. Martin , Vincent J. McGahay , Kathryn E. Schlichting , Melissa A. Smith
Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.
Abstract translation: 一种用于微芯片或类似结构的时间温度监测系统和方法。 所公开的系统包括：具有有源区的衬底; 位于所述有源区附近的掺杂剂源; 用于激活掺杂剂源扩散到有源区域中的激活系统; 以及嵌入在所述衬底的有源区域中的一组空间分布的电极，其中所述电极被配置为在与所述掺杂剂源不同的距离处检测所述有源区域中的扩散以提供时间温度信息。
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公开(公告)号：US10883886B2
公开(公告)日：2021-01-05
申请号：US16454564
申请日：2019-06-27
Applicant: International Business Machines Corporation
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane
Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.
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公开(公告)号：US10697851B2
公开(公告)日：2020-06-30
申请号：US15720861
申请日：2017-09-29
Applicant: International Business Machines Corporation
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane
Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.
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公开(公告)号：US10648871B2
公开(公告)日：2020-05-12
申请号：US15725380
申请日：2017-10-05
Applicant: International Business Machines Corporation
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane
Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.
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公开(公告)号：US20190163561A1
公开(公告)日：2019-05-30
申请号：US15825576
申请日：2017-11-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Jonathan D. Bradbury , Jonathan R. Fry , Michael R. Kane , Jeffrey Nettey
Abstract: A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.
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