公开(公告)号：US10217682B2

公开(公告)日：2019-02-26

申请号：US15949225

申请日：2018-04-10

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: G01K3/10 ,  G01K3/04 ,  G01K7/01 ,  H01L21/66

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US20160178694A1

公开(公告)日：2016-06-23

申请号：US14574746

申请日：2014-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan R. Fry ,  Christopher Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: G01R31/28 ,  G01C22/00

CPC classification number: G01R31/2896 ,  G01C22/00

Abstract: Approaches for detecting wear in integrated circuit chips are provided. An on-chip sensor system includes an integrated circuit chip including a plurality of sensor groups. Each respective one of the sensor groups is structured and arranged to detect a measure of wear corresponding to a respective one of a plurality of failure mechanisms.

Abstract translation: 提供了集成电路芯片中的磨损检测方法。 片上传感器系统包括包括多个传感器组的集成电路芯片。 每个传感器组中的每个传感器组被构造和布置成检测对应于多个故障机构中的相应一个的磨损量度。

公开(公告)号：US09490197B2

公开(公告)日：2016-11-08

申请号：US14541803

申请日：2014-11-14

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mukta G. Farooq ,  William F. Landers ,  Jin Liu ,  Andrew J. Martin ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/03 ,  H05K3/42 ,  H05K3/00

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0017 ,  H05K3/007 ,  H05K3/423 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/143 ,  H05K2203/1461 ,  H01L2924/00

Abstract: A three-dimensional organic structure or glass interposer structure and methods of manufacture are disclosed. The method includes forming lined metal vias in a substrate. The method further includes removing the substrate, leaving the lined metal vias. The method further includes forming a new substrate about the lined metal vias. The method also includes connecting the lined metal vias to wiring layers using back end of the line processes.

Abstract translation: 公开了三维有机结构或玻璃内插器结构及其制造方法。 该方法包括在衬底中形成衬里的金属通孔。 该方法还包括去除衬底，留下衬里的金属通孔。 该方法还包括围绕衬里的金属通孔形成新的衬底。 该方法还包括使用线路工艺的后端将衬里金属通孔连接到布线层。

公开(公告)号：US20180350702A1

公开(公告)日：2018-12-06

申请号：US16043712

申请日：2018-07-24

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L21/66 ,  G01K3/04

CPC classification number: H01L22/34 ,  G01K3/04 ,  H01L22/14 ,  H01L22/26

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US09620396B1

公开(公告)日：2017-04-11

申请号：US15198308

申请日：2016-06-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Oleg Gluschenkov ,  Andrew J. Martin ,  Joyeeta Nag

IPC: H01L21/324 ,  H01L21/02 ,  H01L21/67 ,  H01L21/768 ,  H01L23/532 ,  H01L23/528 ,  B23K26/06 ,  B23K26/00 ,  C22F1/04 ,  C22F1/10 ,  C22F1/18 ,  B23K101/42 ,  B23K103/16

CPC classification number: H01L21/67115 ,  B23K26/0006 ,  B23K26/0619 ,  B23K26/0622 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/14 ,  B23K26/18 ,  B23K26/20 ,  B23K26/53 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/56 ,  C22F1/04 ,  C22F1/10 ,  C22F1/18 ,  H01L21/268 ,  H01L21/743 ,  H01L21/76894 ,  H01L21/76898 ,  H01L23/528 ,  H01L23/53214 ,  H01L23/53233 ,  H01L23/53257

Abstract: Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption.

公开(公告)号：US10060974B2

公开(公告)日：2018-08-28

申请号：US14574746

申请日：2014-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan R. Fry ,  Christopher Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: G01R31/26 ,  G01R31/28 ,  G01C22/00

CPC classification number: G01R31/2896 ,  G01C22/00 ,  G01R31/2884

Abstract: Approaches for detecting wear in integrated circuit chips are provided. An on-chip sensor system includes an integrated circuit chip including a plurality of sensor groups. Each respective one of the sensor groups is structured and arranged to detect a measure of wear corresponding to a respective one of a plurality of failure mechanisms.

公开(公告)号：US20160372391A1

公开(公告)日：2016-12-22

申请号：US14741086

申请日：2015-06-16

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L21/66 ,  G01K3/04 ,  H01L21/67

CPC classification number: H01L22/34 ,  G01K3/04 ,  H01L22/14 ,  H01L22/26

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

Abstract translation: 一种用于微芯片或类似结构的时间温度监测系统和方法。 所公开的系统包括：具有有源区的衬底; 位于所述有源区附近的掺杂剂源; 用于激活掺杂剂源扩散到有源区域中的激活系统; 以及嵌入在所述衬底的有源区域中的一组空间分布的电极，其中所述电极被配置为在与所述掺杂剂源不同的距离处检测所述有源区域中的扩散以提供时间温度信息。

公开(公告)号：US09455185B1

公开(公告)日：2016-09-27

申请号：US14972630

申请日：2015-12-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Oleg Gluschenkov ,  Andrew J. Martin ,  Joyeeta Nag

IPC: H01L21/324 ,  H01L21/768 ,  H01L21/67 ,  B23K26/20

CPC classification number: H01L21/67115 ,  B23K26/0006 ,  B23K26/0619 ,  B23K26/0622 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/14 ,  B23K26/18 ,  B23K26/20 ,  B23K26/53 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/50 ,  B23K2103/56 ,  C22F1/04 ,  C22F1/10 ,  C22F1/18 ,  H01L21/268 ,  H01L21/743 ,  H01L21/76894 ,  H01L21/76898 ,  H01L23/528 ,  H01L23/53214 ,  H01L23/53233 ,  H01L23/53257

Abstract: Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption.

Abstract translation: 公开了使用背面激光退火工艺通过硅通孔（TSV）或其它深埋金属互连进行退火的工艺。 该方法提供了几个优点，包括金属的足够的晶粒生长和应变消除，使得随后的热过程不会引起进一步的晶粒生长; 缩短退火时间，从而缩短3D器件制造的周期时间; 并降低激光吸收的图案灵敏度。

公开(公告)号：US20180226308A1

公开(公告)日：2018-08-09

申请号：US15949225

申请日：2018-04-10

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L21/66 ,  G01K3/04

CPC classification number: H01L22/34 ,  G01K3/04 ,  H01L22/14 ,  H01L22/26

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US10032683B2

公开(公告)日：2018-07-24

申请号：US14741086

申请日：2015-06-16

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: G01K3/04 ,  G01K7/01 ,  H01L21/66

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.