公开(公告)号：US20230238252A1

公开(公告)日：2023-07-27

申请号：US17751643

申请日：2022-05-23

Applicant: Innolux Corporation

Inventor： Cheng-Chi Wang ,  Chien-Feng Li ,  Kuang-Ming Fan

IPC: H01L21/56 ,  H01L23/00

CPC classification number: H01L21/568 ,  H01L24/19 ,  H01L23/293

Abstract: A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. The carrier plate includes a composite structure and has a first surface and a second surface opposite to each other. Next, an anti-warpage structure is formed on the first surface of the carrier plate. Then, a redistribution structure is formed on the second surface of the carrier plate. When the package structure manufactured with the manufacturing method of the package structure of the electronic device of the disclosure is applied to the electronic device, reliability and/or electrical properties of the electronic device are enhanced.

公开(公告)号：US20230027220A1

公开(公告)日：2023-01-26

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US11488899B2

公开(公告)日：2022-11-01

申请号：US16941516

申请日：2020-07-28

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

公开(公告)号：US20220189863A1

公开(公告)日：2022-06-16

申请号：US17531777

申请日：2021-11-21

Applicant: Innolux Corporation

Inventor： Hung-Sheng Chou ,  Wen-Hsiang Liao ,  Kuo-Jung Fan ,  Heng-Shen Yeh ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48

Abstract: A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, and a second dielectric layer disposed on the second metal layer. A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer.

公开(公告)号：US10910285B2

公开(公告)日：2021-02-02

申请号：US15943736

申请日：2018-04-03

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chien-Chang Lu ,  Cheng-I Wu ,  Li-Wei Sung ,  Cheng-Chi Wang ,  Chin-Lung Ting

IPC: H01L23/31 ,  H01L23/00 ,  H01L27/02 ,  H01L25/065 ,  H01L27/12

Abstract: The present disclosure provides a package structure including a redistribution layer and a die. The redistribution layer includes a switch circuit portion and a redistribution portion, the switch circuit portion includes a transistor, and the redistribution portion is adjacent to the switch circuit portion. The die overlaps the redistribution portion, wherein the transistor is electrically connected to the die.

公开(公告)号：US20250140671A1

公开(公告)日：2025-05-01

申请号：US18896935

申请日：2024-09-26

Applicant: Innolux Corporation

Inventor： Cheng-Chi Wang ,  Wen-Hsiang Liao ,  Jui-Jen Yueh ,  Ju-Li Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: An electronic device includes an electronic unit and a circuit structure. The circuit structure is electrically connected to the electronic unit and includes a first circuit structure, a second circuit structure, a bonding pad, and an adjustment layer. The first circuit structure includes at least one first circuit layer and at least one first insulation layer. The second circuit structure is disposed between the electronic unit and the first circuit structure, and includes at least one second circuit layer and at least one second insulation layer. The bonding pad and the adjustment layer are disposed between the second circuit structure and the first circuit structure. A coefficient of thermal expansion of the adjustment layer is smaller than that of at least one of the at least one first insulation layer of the first circuit structure and the at least one second insulation layer of the second circuit structure.

公开(公告)号：US12230558B2

公开(公告)日：2025-02-18

申请号：US17960816

申请日：2022-10-05

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

公开(公告)号：US20250038089A1

公开(公告)日：2025-01-30

申请号：US18914225

申请日：2024-10-13

Applicant: Innolux Corporation

Inventor： Hung-Sheng Chou ,  Wen-Hsiang Liao ,  Kuo-Jung Fan ,  Heng-Shen Yeh ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683

Abstract: An electronic device includes a first metal layer, a first insulating layer disposed on the first metal layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and an electronic component. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The electronic component is disposed on the fourth insulating layer and electrically connected to the fourth metal layer. A Young's modulus of the third insulating layer is less than a Young's modulus of the first insulating layer.

公开(公告)号：US12148658B2

公开(公告)日：2024-11-19

申请号：US18074525

申请日：2022-12-05

Applicant: InnoLux Corporation

Inventor： Cheng-Chi Wang ,  Yeong-E Chen ,  Cheng-En Cheng

IPC: H01L21/768 ,  H01L21/027 ,  H01L21/288 ,  H01L21/48 ,  H01L21/66 ,  H01L21/683

Abstract: The present disclosure discloses a method for manufacturing an electronic device, including: setting a basic working area; a photoresist coating process; a development process; an etching process; an exposure process; a metal plating process; and a polishing process, wherein the photoresist coating process, the development process, the etching process, the exposure process, the metal plating process and the polishing process respectively have a maximum optimized process area, and a smallest one of the maximum optimized process areas is selected as the basic working area.

公开(公告)号：US12142554B2

公开(公告)日：2024-11-12

申请号：US17523895

申请日：2021-11-10

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic component and a manufacturing method thereof are provided. The electronic component includes a structure member and a connecting member. The structure member includes at least one working unit. The at least one working unit is disposed in a first region. The connecting member is disposed on the structure member and includes a second region. The second region is overlapped with the first region, and a metal density of the second region is less than a metal density of the first region. The electronic component and the manufacturing method thereof of the embodiment of the disclosure include the effect of improving the reliability or quality of the electronic component.