TEMPERATURE INSENSITIVE DEMUX/MUX IN SILICON PHOTONICS

    公开(公告)号:US20170090122A1

    公开(公告)日:2017-03-30

    申请号:US15374967

    申请日:2016-12-09

    Inventor: Masaki KATO

    CPC classification number: G02B6/29398 G02B6/00 G02B6/29344 H04B10/40 H04J14/02

    Abstract: A temperature insensitive DEMUX/MUX device whose wavelength does not change by environment temperature is provided for WDM application. The temperature insensitive DEMUX/MUX device includes a waveguide-based delay-line-interferometer configured to receive an input light bearing multiplexed wavelengths and output a first output light bearing the same multiplexed wavelengths but with a shifted intensity peak position. The first output light is transmitted into a DEMUX device through a first free space coupler and a grating fiber or waveguide to be demultiplexed for forming a plurality of second output lights each bearing an individual wavelength. The DEMUX device includes a second free space coupler for refocusing each second output light to corresponding output channel. The shifted intensity peak position of the first output light is tunable to make each second output light free from any temperature-induced drift off corresponding output channel.

    SILICON PHOTONICS DEVICE AND COMMUNICATION SYSTEM THEREFOR
    22.
    发明申请
    SILICON PHOTONICS DEVICE AND COMMUNICATION SYSTEM THEREFOR 有权
    硅光电设备及其通信系统

    公开(公告)号:US20170038531A1

    公开(公告)日:2017-02-09

    申请号:US15299731

    申请日:2016-10-21

    Abstract: A silicon photonics device and system therefor. The silicon photonics device can include a 300 nm SOI (silicon-on-insulator with 300 nm top Si) overlying a substrate member. A waveguide structure can be configured from a portion of the SOI layer and disposed overlying the substrate member. This waveguide structure can include an AWG (Arrayed Waveguide Gratings) structure with 300 nm×300 nm symmetric grating waveguides or an Echelle grating structure characterized by a top silicon thickness of 300 nm. The waveguide structure can also include an index compensator material configured to provide at least two material index ratings in the waveguide structure.

    Abstract translation: 一种硅光子器件及其系统。 硅光子器件可以包括覆盖在衬底构件上的300nm SOI(具有300nm顶部Si的绝缘体上硅)。 波导结构可以由SOI层的一部分配置并且设置在衬底构件上。 该波导结构可以包括具有300nm×300nm对称光栅波导的AWG(阵列波导光栅)结构或以300nm的顶部硅厚度为特征的Echelle光栅结构。 波导结构还可以包括配置为在波导结构中提供至少两个材料折射率等级的折射率补偿器材料。

    SILICON PHOTONICS DEVICE AND COMMUNICATION SYSTEM THEREFOR
    23.
    发明申请
    SILICON PHOTONICS DEVICE AND COMMUNICATION SYSTEM THEREFOR 有权
    硅光电设备及其通信系统

    公开(公告)号:US20150309252A1

    公开(公告)日:2015-10-29

    申请号:US14262621

    申请日:2014-04-25

    Abstract: A silicon photonics device and system therefor. The silicon photonics device can include a 300 nm SOI (silicon-on-insulator with 300 nm top Si) overlying a substrate member. A waveguide structure can be configured from a portion of the SOI layer and disposed overlying the substrate member. This waveguide structure can include an AWG (Arrayed Waveguide Gratings) structure with 300 nm×300 nm symmetric grating waveguides or an Echelle grating structure characterized by a top silicon thickness of 300 nm. The waveguide structure can also include an index compensator material configured to provide at least two material index ratings in the waveguide structure.

    Abstract translation: 一种硅光子器件及其系统。 硅光子器件可以包括覆盖在衬底构件上的300nm SOI(具有300nm顶部Si的绝缘体上硅)。 波导结构可以由SOI层的一部分配置并且设置在衬底构件上。 该波导结构可以包括具有300nm×300nm对称光栅波导的AWG(阵列波导光栅)结构或以300nm的顶部硅厚度为特征的Echelle光栅结构。 波导结构还可以包括配置为在波导结构中提供至少两个材料折射率等级的折射率补偿器材料。

    SILICON PHOTONICS INTEGRATION CIRCUIT

    公开(公告)号:US20210231866A1

    公开(公告)日:2021-07-29

    申请号:US16776362

    申请日:2020-01-29

    Abstract: A silicon photonics integration circuit includes a silicon substrate member; a RX sub-circuit formed in the silicon substrate member including multiple RX-input ports each having a mode size converter configured to receive an incoming light signal into one of multiple waveguides and multiple RX photo detectors coupled respectively to the multiple waveguides; and a TX sub-circuit formed in the silicon substrate member including one or more TX-input ports each having a mode size converter coupled to a first TX photo detector into one input waveguide, one or more 1×2 directional couplers each coupled between the input waveguide and two mod-input waveguides, multiple modulators coupled between respective multiple mod-input waveguides and multiple mod-output waveguides each being coupled to a second TX photo detector into one of multiple output waveguides, and multiple TX-output ports each having a mode size converter coupled to respective one of the multiple output waveguides.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE

    公开(公告)号:US20200183105A1

    公开(公告)日:2020-06-11

    申请号:US16793550

    申请日:2020-02-18

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    SURFACE GRATINGS, PHOTONICS CIRCUIT, AND METHOD FOR WAFER-LEVEL TESTING THEREOF

    公开(公告)号:US20190310418A1

    公开(公告)日:2019-10-10

    申请号:US16440814

    申请日:2019-06-13

    Abstract: A surface grating coupler for polarization splitting or diverse includes a planar layer and an array of scattering elements arranged in the planar layer at intersections of a first set of concentric elliptical curves crossing with a second set of concentric elliptical curves rotated proximately 90 or 180 degrees to form a two-dimensional (2D) grating. Additionally, the grating coupler includes a first waveguide in double-taper shape and a second waveguide in double-taper shape respectively for split or diverse an incident light into the 2D grating into two output light to two output ports with a same (either TE or TM) polarization mode or one output port with TE polarization mode and another output port with TM polarization mode. The polarization diverse grating coupler is required to test multiple polarization sensitive photonics components and can be used with other single polarization grating coupler via a fiber array to perform wafer-level testing.

    OPTICAL EQUALIZER FOR PHOTONICS SYSTEM
    27.
    发明申请

    公开(公告)号:US20190212496A1

    公开(公告)日:2019-07-11

    申请号:US16352636

    申请日:2019-03-13

    Abstract: The present disclosure provides an optical equalizer for photonics system in an electric-optical communication network. The optical equalizer includes an input port and an output port. Additionally, the optical equalizer includes a filter having a number of stages coupled to each other in a multi-stage series with an output terminal of any stage being coupled to an input terminal of an adjacent next stage while the input terminal of a first stage of the multi-stage series being coupled from the input port. Each stage includes a tap terminal configured to pass an optical power factored by a coefficient of multiplication from the corresponding input terminal of the stage to a tap-output path characterized by a corresponding phase delay. Furthermore, the optical equalizer includes a combiner configured to sum up the optical powers respectively from the number of tap-output paths of the multi-stage series to the output port.

    OPTICAL DISPERSION COMPENSATOR ON SILICON
    28.
    发明申请

    公开(公告)号:US20190041580A1

    公开(公告)日:2019-02-07

    申请号:US16157409

    申请日:2018-10-11

    Abstract: An optical dispersion compensator integrated with a silicon photonics system including a first phase-shifter coupled to a second phase-shifter in parallel on the silicon substrate characterized in an athermal condition. The dispersion compensator further includes a third phase-shifter on the silicon substrate to the first phase-shifter and the second phase-shifter through two 2×2 splitters to form an optical loop. A second entry port of a first 2×2 splitter is for coupling with an input fiber and a second exit port of a second 2×2 splitter is for coupling with an output fiber. The optical loop is characterized by a total phase delay tunable via each of the first phase-shifter, the second phase-shifter, and the third phase-shifter such that a normal dispersion (>0) at a certain wavelength in the input fiber is substantially compensated and independent of temperature.

    DELAY LINE INTERFEROMETER WITH POLARIZATION COMPENSATION AT SELECTIVE FREQUENCY

    公开(公告)号:US20170285267A1

    公开(公告)日:2017-10-05

    申请号:US15088862

    申请日:2016-04-01

    CPC classification number: G02B6/274 G02B6/1228 G02B6/29352 G02B6/29395

    Abstract: An apparatus of polarization self-compensated delay line interferometer. The apparatus includes a first waveguide arm of a first material of a first length disposed between an input coupler and an output coupler and a second waveguide arm of the first material of a second length different from the first length disposed between the same input coupler and the same output coupler. The apparatus produces an interference spectrum with multiple periodic passband peaks where certain TE (transverse electric) and TM (transverse magnetic) polarization mode passband peaks are lined up. The apparatus further includes a section of waveguide of a birefringence material of a third length added to the second waveguide arm to induce a phase shift of the lined-up TE/TM passband peaks to a designated grid as corresponding polarization compensated channels of a wide optical band.

    PACKAGE STRUCTURE FOR PHOTONIC TRANSCEIVING DEVICE

    公开(公告)号:US20170090132A1

    公开(公告)日:2017-03-30

    申请号:US15375042

    申请日:2016-12-09

    Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

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