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公开(公告)号：US20220350385A1
公开(公告)日：2022-11-03
申请号：US17732173
申请日：2022-04-28
Applicant: Intel Corporation
Inventor： Columbia Mishra , Carin Ruiz , Helin Cao , Soethiha Soe , James Hermerding, II , Bijendra Singh , Navneet Singh
Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.
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公开(公告)号：US20220225536A1
公开(公告)日：2022-07-14
申请号：US17711821
申请日：2022-04-01
Applicant: The Intel Corporation
Inventor： Arunpandi R. , Kathiravan D , Triplicane Gopikrishnan Babu , Doddi Raghavendra , Ritu Bawa , Bijendra Singh
Abstract: Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.
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公开(公告)号：US20210232184A1
公开(公告)日：2021-07-29
申请号：US17227962
申请日：2021-04-12
Applicant: Intel Corporation
Inventor： Bijendra Singh , Prakash Kurma Raju , Prasanna Pichumani , Kathiravan D
IPC: G06F1/16
Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
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公开(公告)号：US20200352052A1
公开(公告)日：2020-11-05
申请号：US16914162
申请日：2020-06-26
Applicant: Intel Corporation
Inventor： Srinivas Rao Konakalla , Prakash Kurma Raju , Bijendra Singh , Juha Tapani Paavola , Prasanna Pichumani
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.
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Patent Agency Ranking
公开(公告)号：US20180351230A1
公开(公告)日：2018-12-06
申请号：US15609144
申请日：2017-05-31
Applicant: Intel Corporation
Inventor： Praveen Kumar , Bijendra Singh , Saku Lahti , Seppo Vesamaki , Marko Bonden
Abstract: A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.
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公开(公告)号：US11304329B2
公开(公告)日：2022-04-12
申请号：US16722275
申请日：2019-12-20
Applicant: Intel Corporation
Inventor： Bijendra Singh , Prakash Kurma Raju , Samarth Alva
IPC: H05K7/20
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.
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公开(公告)号：US11231757B2
公开(公告)日：2022-01-25
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US10976782B2
公开(公告)日：2021-04-13
申请号：US16274818
申请日：2019-02-13
Applicant: Intel Corporation
Inventor： Bijendra Singh , Prakash Kurma Raju , Prasanna Pichumani , Kathiravan D
IPC: G06F1/16
Abstract: A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.
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公开(公告)号：US20190041922A1
公开(公告)日：2019-02-07
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Doddi Raghavendra , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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