公开(公告)号：US11972303B2

公开(公告)日：2024-04-30

申请号：US16914177

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Carin Ruiz ,  Bo Qiu ,  Columbia Mishra ,  Arijit Chattopadhyay ,  Chee Lim Nge ,  Srikanth Potluri ,  Jianfang Zhu ,  Deepak Samuel Kirubakaran ,  Akhilesh Rallabandi ,  Mark Gallina ,  Renji Thomas ,  James Hermerding, II

IPC: G06F9/50 ,  G06F9/48 ,  G06F11/30

CPC classification number: G06F9/5094 ,  G06F9/4881 ,  G06F9/505 ,  G06F11/3058 ,  G06F2209/508

Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.

公开(公告)号：US20250112112A1

公开(公告)日：2025-04-03

申请号：US18479015

申请日：2023-09-30

Applicant: Intel Corporation

Inventor： Carin Ruiz

IPC: H01L23/373 ,  C22C26/00 ,  H01L23/367

Abstract: Technologies for diamond composite materials are disclosed. In one embodiment, field-assisted sintering technology (FAST) is used to create a diamond composite material that includes diamond particles, copper, and chromium. The chromium can help bond the copper and the diamond particles. The diamond composite material has a high thermal conductivity, such as 500-1,000 W/(m·K). In one embodiment, the diamond composite material may be used in an integrated heat spreader in an integrated circuit component. In other embodiments, the diamond composite material may be used in a heat sink, a cold plate, an internal frame, a chassis, etc.

公开(公告)号：US20240231454A1

公开(公告)日：2024-07-11

申请号：US18422948

申请日：2024-01-25

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  G06F1/32 ,  G06F3/01 ,  G06V10/774 ,  G06V40/10 ,  G06V40/16 ,  G10L25/51 ,  H04B1/3827

CPC classification number: G06F1/206 ,  G06F1/32 ,  G06F3/013 ,  G06V10/774 ,  G06V40/10 ,  G06V40/165 ,  G10L25/51 ,  H04B1/3827 ,  G06F2200/201

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US11966268B2

公开(公告)日：2024-04-23

申请号：US17732173

申请日：2022-04-28

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  G06F1/32 ,  G06F3/01 ,  G06V10/774 ,  G06V40/10 ,  G06V40/16 ,  G10L25/51 ,  H04B1/3827

CPC classification number: G06F1/206 ,  G06F1/32 ,  G06F3/013 ,  G06V10/774 ,  G06V40/10 ,  G06V40/165 ,  G10L25/51 ,  H04B1/3827 ,  G06F2200/201

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US20220350385A1

公开(公告)日：2022-11-03

申请号：US17732173

申请日：2022-04-28

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/20 ,  H04B1/3827 ,  G10L25/51 ,  G06F3/01 ,  G06F1/32 ,  G06V40/10

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example apparatus includes at least one of a user presence detection analyzer to identify a presence of a user relative to an electronic device based on first sensor data generated by a first sensor or at least one of an image data analyzer or a motion data analyzer to determine a gesture of the user relative to the device based on second sensor data generated by a second sensor; a thermal constraint selector to select a thermal constraint for a temperature of an exterior surface of the electronic device based on one or more of the presence of the user or the gesture; and a power source manager to adjust a power level for a processor of the electronic device based on the thermal constraint.

公开(公告)号：US11360528B2

公开(公告)日：2022-06-14

申请号：US16728774

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： Columbia Mishra ,  Carin Ruiz ,  Helin Cao ,  Soethiha Soe ,  James Hermerding, II ,  Bijendra Singh ,  Navneet Singh

IPC: G06F1/3203 ,  G06F1/20 ,  H04B1/3827 ,  G10L25/51 ,  G06F3/01 ,  G06F1/32 ,  G06V40/10

Abstract: Apparatus and methods for thermal management of electronic user devices are disclosed herein. An example electronic device disclosed herein includes a housing, a fan, a first sensor, a second sensor, and a processor to at least one of analyze first sensor data generated by the first sensor to detect a presence of a subject proximate to the electronic device or analyze second sensor data generated by the second sensor to detect a gesture of the subject, and adjust one or more of an acoustic noise level generated the fan or a temperature of an exterior surface of the housing based on one or more of the presence of the subject or the gesture.

公开(公告)号：US20200326994A1

公开(公告)日：2020-10-15

申请号：US16914177

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Carin Ruiz ,  Bo Qiu ,  Columbia Mishra ,  Arijit Chattopadhyay ,  Chee Lim Nge ,  Srikanth Potluri ,  Jianfang Zhu ,  Deepak Samuel Kirubakaran ,  Akhilesh Rallabandi ,  Mark Gallina ,  Renji Thomas ,  James Hermerding II

IPC: G06F9/50 ,  G06F9/48 ,  G06F11/30

Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.