公开(公告)号：US09431366B2

公开(公告)日：2016-08-30

申请号：US14705005

申请日：2015-05-06

Applicant: International Business Machines Corporation

Inventor： Mario J. Interrante ,  Katsuyuki Sakuma

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K3/3494 ,  H01L21/4853 ,  H01L21/50 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/17 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/75252 ,  H01L2224/75272 ,  H01L2224/75283 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A method of forming a 3D package. The method may include joining an interposer to a laminate chip carrier with the solid state diffusion of a first plurality of solder bumps by applying a first selective non-uniform heat and first uniform pressure; joining a top chip to the interposer with the solid state diffusion of a second plurality of solder bumps by applying a second selective non-uniform heat and second uniform pressure; heating the 3D package, the first and second pluralities of solder bumps to a temperature greater than the reflow temperature of the first and second pluralities of solder bumps, where the second plurality of solder bumps achieves the reflow temperature before the first plurality of solder bumps, where the first and second selective non-uniform heats being less that the reflow temperature of the first and second pluralities of solder bumps, respectively.

Abstract translation: 一种形成3D封装的方法。 该方法可以包括通过施加第一选择性不均匀的热和第一均匀压力将插入件连接到具有第一多个焊料凸块的固态扩散的层压芯片载体; 通过施加第二选择性不均匀的热和第二均匀压力将第二多个焊料凸块的固态扩散连接到所述插入件的顶部芯片; 将所述第一和第二多个焊料凸起加热到大于所述第一和第二多个焊料凸块的回流温度的温度，其中所述第二多个焊料凸块在所述第一多个焊料凸点之前达到回流温度， 其中第一和第二选择性不均匀热分别小于第一和第二多个焊料凸块的回流温度。