公开(公告)号：US08969734B2

公开(公告)日：2015-03-03

申请号：US13398090

申请日：2012-02-16

Applicant: James V. Murphy ,  Michael J. Murphy

Inventor： James V. Murphy ,  Michael J. Murphy

IPC: H05K1/14 ,  H01R9/24 ,  H01R13/187 ,  B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  H05K7/10

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H05K3/3426 ,  H05K7/1084 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract translation: 提供了一种互耦组件，其允许第一基板和第二基板之间的可靠的非永久性电连接。 相互联接部件包括具有第一端的插座端子和与第一端相对的第二端。 轴向孔从第二端向内延伸，并且导电芯构件设置在轴向孔内。 芯构件由与插座端子体不同的材料形成，并且其尺寸和形状被阻塞孔。 此外，插座端子的第一端被配置为接收销端子，并且插座端子的第二端被配置为容纳在印刷电路板的孔内。

公开(公告)号：US20100252311A1

公开(公告)日：2010-10-07

申请号：US12416689

申请日：2009-04-01

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H05K1/11 ,  H05K1/09 ,  B23K31/02 ,  H01R43/00 ,  H05K3/36

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K3/0623 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49208

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract translation: 提供了一种互耦组件，其允许第一基板和第二基板之间的可靠的非永久性电连接。 所述互耦部件包括导电端子，该导电端子包括与第一端相对的第一端和第二端。 第一和第二端构造成接收焊球。 轴向孔从端子的第一端向内延伸，并且导电芯构件设置在孔内。 芯构件的尺寸和形状可以阻挡孔。 此外，芯构件的至少外表面包括第一材料，并且主体的至少外表面包括第二材料，第一材料具有比第二材料更大的可焊性。

公开(公告)号：US07179108B2

公开(公告)日：2007-02-20

申请号：US10935880

申请日：2004-09-08

Applicant: Glen Goodman ,  James V. Murphy

Inventor： Glen Goodman ,  James V. Murphy

IPC: H00R13/28

CPC classification number: H01R12/714 ,  H01R12/716 ,  H01R13/631 ,  H01R24/84

Abstract: A hermaphroditic terminal assembly for connecting electrical devices includes an insulating support member for supporting female sockets and male pins, a number of female sockets, and a number of male pins. An intercoupling component for connecting electrical devices includes two hermaphroditic terminal assemblies configured such that the first hermaphroditic terminal assembly can be mated with the second hermaphroditic terminal assembly.

Abstract translation: 用于连接电气装置的阴模组合件包括用于支撑阴插座和阳销，多个阴插座和多个阳销的绝缘支撑构件。 用于连接电气装置的相互耦合部件包括两个两性端子组件，其被配置为使得第一阴模端子组件可以与第二阴模端子组件配合。

公开(公告)号：US07114996B2

公开(公告)日：2006-10-03

申请号：US10935996

申请日：2004-09-08

Applicant: Glen Goodman ,  James V. Murphy

Inventor： Glen Goodman ,  James V. Murphy

IPC: H01R13/24

CPC classification number: H01R13/2421 ,  H01R12/714

Abstract: A socket terminal assembly includes a socket body having a first end with a first opening to receive a contact element and a second opening at a second end to receive a pin. A contact element, located in the first opening, is configured to contact the corresponding connection region of a printed circuit board; a pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. A contact spring in the second opening receives the pin and applies a frictional force sufficient to retain the lower end of the pin within the opening of the socket body. A resilient member is disposed within the opening between the contact element and the contact spring. The resilient member applies to the pin and contact element, in response to a downward force applied to the pin or an upward force applied to the contact element, a force sufficient to overcome the frictional force of the contact spring. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

公开(公告)号：US5168432A

公开(公告)日：1992-12-01

申请号：US846974

申请日：1992-03-06

Applicant: James V. Murphy ,  Michael J. Murphy

Inventor： James V. Murphy ,  Michael J. Murphy

IPC: H01L23/495 ,  H01L23/498 ,  H05K3/32 ,  H05K7/10

CPC classification number: H05K7/1061 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49827 ,  H01L23/49861 ,  H05K3/326 ,  H05K7/1023 ,  H05K7/1092 ,  H01L2224/45147 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/30107

Abstract: An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having solder leads, and the adapter comprising a plurality of pins for connection to the circuit board, a plurality of lead frame elements, each lead frame element connected to a pin, and each lead frame element including a connection region sized and positioned for making a solder connection to a lead of an integrated circuit package, and insulative plastic molded around the pins and lead frame elements, the molded plastic body having a shape providing a plurality of grooves that each expose a connection region of one of the lead frame elements and that serve to align the solder leads with the connector regions.

Abstract translation: 一种用于将集成电路封装连接到电路板的适配器，所述封装是具有焊接引线的类型，并且所述适配器包括用于连接到电路板的多个引脚，多个引线框架元件，每个引线框架元件 连接到销，并且每个引线框架元件包括尺寸和位置的连接区域，用于形成与集成电路封装的引线的焊接连接，以及围绕销和引线框架元件模制的绝缘塑料，所述模制塑料体具有形状 提供多个凹槽，每个凹槽暴露引线框架元件之一的连接区域并且用于使焊接引线与连接器区域对齐。

公开(公告)号：US5152057A

公开(公告)日：1992-10-06

申请号：US564406

申请日：1990-08-08

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H01L23/04 ,  H01L23/08 ,  H01L23/29 ,  H01L23/31 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K3/32 ,  H05K7/10

CPC classification number: H01L23/495 ,  H01L23/293 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/50 ,  H01L24/48 ,  H05K3/326 ,  H05K7/1023 ,  H05K7/1061 ,  H05K7/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4899 ,  H01L2224/49109 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A plastic package that includes a cavity for holding an integrated circuit die. The package also includes several singel-piece leads that each have bonding pad area on one end and an area for connecting to external circuitry on the other end. The package's plastic body supports the leads, separates them from each other, and includes a ridge that substantially encircles the cavity and separates the bonding pad areas from the cavity. The package may be made by forming a first portion including alignment protrusions sized to receive lead bonding pad ends, placing the leads with their bonding pads so that they are spaced apart by the protrusions, and securing them, preferably by supplying heat to the protrusions. A second portion of the package may then be molded around the first portion, the leads, and, preferably, a heat sink.

Abstract translation: 一种塑料封装，其包括用于保持集成电路管芯的腔体。 封装还包括几个单引脚，每个引线在一端具有焊盘区域，另一端具有用于连接到另一端的外部电路的区域。 包装的塑料体支撑引线，将它们彼此分开，并且包括基本上环绕空腔并将接合焊盘区域与空腔分离的脊。 封装可以通过形成第一部分来制造，该第一部分包括尺寸适于接纳引线焊盘端部的对准突起，将引线与它们的接合焊盘放置成使得它们被突起间隔开，并且优选地通过向突起提供热来固定它们。 然后可以围绕第一部分，引线，以及优选地，散热器模制封装的第二部分。

公开(公告)号：US5088930A

公开(公告)日：1992-02-18

申请号：US616180

申请日：1990-11-20

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H01L21/00 ,  H01R12/71 ,  H05K7/10

CPC classification number: H01L21/67121 ,  H01R12/716 ,  H05K7/1023 ,  H05K7/1084 ,  Y10S439/912

Abstract: A socket has several upwardly extending resilient single-reed-shaped contacts that connect to downwardly extending portions of leads of an integrated circuit package. A bottom section supports these contacts and the leads of the socket, which are connected to the contacts. The contacts may be integral to lead frame elements, make a wiping contact over at least half of the downward section or at least 0.02 inches, extend from the bottom surface of the package, press inwardly or outwardly against the package leads, and are separated and maintained in registration by ribs. A top section with ribs separates and maintains the package leads in registration and a resilient reed retains the package in the top section. A pin-and-socket connector maintains the top section in place. The package leads are retained by a surface against the force applied by the contacts. The socket leads are pins supported by the bottom section and are connected to a lead frame element and the bottom section is made of a molded thermoplastic in which the elements are at least partially embedded. The socket leads and contacts are integral to the same lead frame elements and may be adapted for through-hole insertion or surface mount and may have the same footprint as the package. The socket may include a cover.

Abstract translation: 插座具有几个向上延伸的弹性单簧片状触点，其连接到集成电路封装的引线的向下延伸部分。 底部支撑这些触点和连接到触点的插座的引线。 触头可以与引线框架元件成一体，在从封装的底部表面延伸的至少一半的向下部分或至少0.02英寸处形成擦拭接触，向内或向外压靠封装引线，并分离和 通过肋骨保持登记。 具有肋的顶部分离并将包装引线保持配准，并且弹性簧片将包装保持在顶部。 针脚和插座连接器将顶部保持在适当位置。 封装引线被抵抗由触点施加的力保持在表面上。 插座引线是由底部支撑并且连接到引线框架元件的引脚，并且底部部分由其中元件至少部分地嵌入其中的模制热塑性塑料制成。 插座引线和触点与相同的引线框架元件成一体，并且可以适于通孔插入或表面安装，并且可以具有与封装相同的封装。 插座可以包括盖子。

公开(公告)号：US20120196493A1

公开(公告)日：2012-08-02

申请号：US13398090

申请日：2012-02-16

Applicant: James V. Murphy ,  Michael J. Murphy

Inventor： James V. Murphy ,  Michael J. Murphy

IPC: H01R13/11

CPC classification number: B23K1/0016 ,  B23K3/0623 ,  H05K3/3426 ,  H05K7/1084 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract translation: 提供了一种互耦组件，其允许第一基板和第二基板之间的可靠的非永久性电连接。 相互联接部件包括具有第一端的插座端子和与第一端相对的第二端。 轴向孔从第二端向内延伸，并且导电芯构件设置在轴向孔内。 芯构件由与插座端子体不同的材料形成，并且其尺寸和形状被阻塞孔。 此外，插座端子的第一端被配置为接收销端子，并且插座端子的第二端被配置为容纳在印刷电路板的孔内。

公开(公告)号：US08119926B2

公开(公告)日：2012-02-21

申请号：US12416689

申请日：2009-04-01

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H05K1/16

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K3/0623 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49208

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract translation: 提供了一种互耦组件，其允许第一基板和第二基板之间的可靠的非永久性电连接。 所述互耦部件包括导电端子，该导电端子包括与第一端相对的第一端和第二端。 第一和第二端构造成接收焊球。 轴向孔从端子的第一端向内延伸，并且导电芯构件设置在孔内。 芯构件的尺寸和形状可以阻挡孔。 此外，芯构件的至少外表面包括第一材料，并且主体的至少外表面包括第二材料，第一材料具有比第二材料更大的可焊性。

公开(公告)号：US07592693B2

公开(公告)日：2009-09-22

申请号：US11850832

申请日：2007-09-06

Applicant: James V. Murphy

Inventor： James V. Murphy

IPC: H01L23/02

CPC classification number: G01R1/0483 ,  H01R12/7076 ,  H05K7/1084

Abstract: An intercoupling component includes first male contacts, each first male contact received within a corresponding aperture of a first array of apertures and extending beyond a second surface of a first insulative support member toward a second insulative support member, each first male contact having a first axis; second contacts, each second contact received within a corresponding aperture of a second array of apertures, each second contact having a second axis; and an alignment member configured to establish a specified position of the first insulative support member relative to the second insulative support member. The first axis of each male contact is offset from the second axis of a corresponding second contact when the first insulative support member is in the specified position relative to the second insulative support member.

Abstract translation: 相互耦合部件包括第一阳触头，每个第一阳触头容纳在第一孔阵列的对应孔内并且延伸超过第一绝缘支撑构件的第二表面朝向第二绝缘支撑构件，每个第一阳触头具有第一轴线 ; 第二触点，每个第二触点容纳在第二孔阵列的相应孔内，每个第二触点具有第二轴线; 以及对准构件，其构造成相对于所述第二绝缘支撑构件建立所述第一绝缘支撑构件的指定位置。 当第一绝缘支撑构件相对于第二绝缘支撑构件处于规定位置时，每个阳接触件的第一轴线偏离对应的第二接触件的第二轴线。