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    Roller assembly for a brush cleaning device in a cleaning module
    21.
    发明授权
    Roller assembly for a brush cleaning device in a cleaning module 有权
    用于清洁模块中的刷清洁装置的辊组件

    公开(公告)号：US08250695B2

    公开(公告)日：2012-08-28

    申请号：US12573500

    申请日：2009-10-05

    申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    IPC分类号： A47L25/00

    CPC分类号： B08B1/04

    摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

    摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

    Determining Physical Property of Substrate
    22.
    发明申请
    Determining Physical Property of Substrate 审中-公开
    确定基材的物理性质

    公开(公告)号：US20110294400A1

    公开(公告)日：2011-12-01

    申请号：US13193011

    申请日：2011-07-28

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： B24B51/00

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE
    24.
    发明申请
    ROLLER ASSEMBLY FOR A BRUSH CLEANING DEVICE IN A CLEANING MODULE 有权
    用于清洁模块中的清洁装置的滚子组件

    公开(公告)号：US20110079245A1

    公开(公告)日：2011-04-07

    申请号：US12573500

    申请日：2009-10-05

    申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

    IPC分类号： B08B7/00 ,  B08B1/04

    CPC分类号： B08B1/04

    摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

    摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

    Determining physical property of substrate
    25.
    发明授权
    Determining physical property of substrate 有权
    确定底物的物理性质

    公开(公告)号：US07746485B2

    公开(公告)日：2010-06-29

    申请号：US12253160

    申请日：2008-10-16

    申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

    IPC分类号： G01B11/28

    CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

    摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

    In-Line Wafer Thickness Sensing
    26.
    发明申请
    In-Line Wafer Thickness Sensing 有权
    在线晶圆厚度感应

    公开(公告)号：US20100120333A1

    公开(公告)日：2010-05-13

    申请号：US12610979

    申请日：2009-11-02

    申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

    IPC分类号： B24B49/04 ,  H01L21/304 ,  H01L21/66 ,  B24B49/10

    CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

    摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。

    PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING
    28.
    发明申请
    PLATEN ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL PROCESSING 审中-公开
    电化学机械加工用板组件

    公开(公告)号：US20080146121A1

    公开(公告)日：2008-06-19

    申请号：US11957798

    申请日：2007-12-17

    申请人： Omer Ozgun ,  Alpay Yilmaz ,  Antoine P. Manens ,  Lakshmanan Karuppiah

    发明人： Omer Ozgun ,  Alpay Yilmaz ,  Antoine P. Manens ,  Lakshmanan Karuppiah

    IPC分类号： B24B7/04 ,  B24B1/00 ,  B23H5/08

    CPC分类号： B24B37/16 ,  B23H5/08

    摘要： A processing pad and platen assembly for processing a substrate is provided. The platen assembly includes a spacer having an upper surface adapted to contact a lower surface of a pad assembly, an upper plate having a recessed area coupled to and disposed below the spacer, and a lower plate coupled to and disposed below the upper plate. The pad assembly includes at least a processing layer having a working surface adapted to process a substrate and an electrode disposed below the working surface of the processing layer. The spacer and the pad assembly have apertures therethrough to provide an electrolyte pathway to the platen assembly for removal of residual materials and other byproducts.

    摘要翻译： 提供了一种用于处理基板的处理垫和压板组件。 压板组件包括具有适于接触焊盘组件的下表面的上表面的间隔件，具有联接到并设置在间隔件下方的凹陷区域的上板和联接到并设置在上板下方的下板。 衬垫组件至少包括具有适于处理衬底的工作表面和设置在处理层的工作表面下方的电极的处理层。 间隔件和衬垫组件具有穿过其中的孔，以提供到压板组件的电解质通路，用于去除残余材料和其它副产物。

    CONDITIONING DISK HAVING UNIFORM STRUCTURES
    29.
    发明申请
    CONDITIONING DISK HAVING UNIFORM STRUCTURES 审中-公开
    具有均匀结构的调节盘

    公开(公告)号：US20080014845A1

    公开(公告)日：2008-01-17

    申请号：US11775533

    申请日：2007-07-10

    申请人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

    发明人： Alpay Yilmaz ,  Omer Ozgun ,  Gerald Alonzo ,  Lakshmanan Karuppiah ,  Shou-Sung Chang ,  Antoine P. Manens ,  Clinton Sakata

    IPC分类号： B24B21/18

    CPC分类号： B24B53/017

    摘要： A method and apparatus for conditioning a conductive polishing material is described. In one embodiment, the pad dresser comprises a backing plate adapted to coupled to a conditioning head assembly, the backing plate comprising a rigid disk having a first side and an opposing second side, the second side having a perpendicular orientation to a centerline of the backing plate, and an annular member having a base portion adhered to the second side of the backing plate, wherein the annular member defines a conditioning surface opposite the second side that is radially sloped relative to a plane of the second side.

    摘要翻译： 描述了用于调理导电抛光材料的方法和装置。 在一个实施例中，垫修整器包括适于联接到调节头组件的背板，所述背板包括具有第一侧和相对的第二侧的刚性盘，所述第二侧具有与所述背衬的中心线垂直的取向 板和环形构件，其具有粘附到背板的第二侧的基部，其中环形构件限定相对于第二侧的平面径向倾斜的第二侧相对的调节表面。