Heating unit and substrate processing apparatus having the same
    22.
    发明授权
    Heating unit and substrate processing apparatus having the same 有权
    加热单元和具有该加热单元的基板处理设备

    公开(公告)号:US08815016B2

    公开(公告)日:2014-08-26

    申请号:US12857723

    申请日:2010-08-17

    IPC分类号: C23C16/00

    CPC分类号: H01L21/67109 C23C16/46

    摘要: A substrate processing apparatus includes a heating unit that heats a processing chamber that processes a plurality of substrates and that quickly cools the processing chamber after the processing. The heating unit includes a body having an intake port and an exhaust port, one or more heaters located inside the body, a cooler connected to the intake port of the body, an exhaust pump connected to the exhaust port of the body, and a controller controlling the cooler. The substrate processing apparatus includes a boat in which a plurality of substrates are stacked, a processing chamber providing a space in which the substrates are processed, a transfer unit carrying the boat into or out of the processing chamber, and the heating unit located outside the processing chamber.

    摘要翻译: 基板处理装置包括加热单元,加热处理多个基板的处理室,并且在处理之后快速地冷却处理室。 加热单元包括具有进气口和排气口的主体,位于主体内部的一个或多个加热器,连接到主体进气口的冷却器,连接到主体排气口的排气泵,以及控制器 控制冷却器。 衬底处理装置包括堆叠多个衬底的舟皿,提供衬底处理的空间的处理室,将处理室中的船运送到处理室内的传送单元和位于处理室外的加热单元 处理室。

    Sputtering apparatus
    25.
    发明申请
    Sputtering apparatus 有权
    溅射装置

    公开(公告)号:US20110139612A1

    公开(公告)日:2011-06-16

    申请号:US12926115

    申请日:2010-10-27

    IPC分类号: C23C14/14 C23C14/34

    摘要: A sputtering apparatus includes a process chamber having first and second regions, a metal target inside the process chamber, a target transfer unit inside the process chamber, the target transfer unit being configured to move the metal target between the first and second regions, a substrate holder in the second region of the process chamber, and a magnetic assembly in the first region of the process chamber, the magnetic assembly being interposed between the target transfer unit and a wall of the process chamber.

    摘要翻译: 溅射装置包括具有第一和第二区域的处理室,处理室内部的金属靶,处理室内的目标传送单元,目标传送单元构造成在第一和第二区域之间移动金属靶,衬底 保持器在处理室的第二区域中,以及在处理室的第一区域中的磁性组件,磁性组件插入在目标转印单元和处理室的壁之间。

    SOURCE GAS SUPPLY UNIT, AND DEPOSITION APPARATUS AND METHOD USING THE SAME
    26.
    发明申请
    SOURCE GAS SUPPLY UNIT, AND DEPOSITION APPARATUS AND METHOD USING THE SAME 失效
    源气体供应单元和沉积装置以及使用该装置的方法

    公开(公告)号:US20110070360A1

    公开(公告)日:2011-03-24

    申请号:US12711495

    申请日:2010-02-24

    IPC分类号: C23C16/52 B05C11/00

    摘要: Provided are a source gas supply unit capable of supplying a constant amount of source gas to a deposition chamber to deposit a uniform layer, and a deposition apparatus and method using the same. The source gas supply unit includes a canister in which a source is stored, a heater heating the canister, a source gas supply pipe provided on one side of the canister, a measuring unit installed on the source gas supply pipe and measuring an amount of source gas passing through the source gas supply pipe, and a temperature controller connected to the heater and the measuring unit. The temperature controller controls the heater based on the amount of the source gas measured by the measuring unit.

    摘要翻译: 提供能够向沉积室供给恒定量的源气体以沉积均匀层的源气体供应单元,以及使用该源气体供应单元的沉积设备和方法。 源气体供给单元包括储存有源的罐,加热罐的加热器,设置在罐的一侧的源气体供给管,安装在源气体供给管上并测量源的量的测量单元 通过原料气体供给管的气体以及连接到加热器和测量单元的温度控制器。 温度控制器基于由测量单元测量的源气体的量来控制加热器。

    Sputtering apparatus
    29.
    发明授权
    Sputtering apparatus 有权
    溅射装置

    公开(公告)号:US08512530B2

    公开(公告)日:2013-08-20

    申请号:US12926115

    申请日:2010-10-27

    IPC分类号: C23C14/35

    摘要: A sputtering apparatus includes a process chamber having first and second regions, a metal target inside the process chamber, a target transfer unit inside the process chamber, the target transfer unit being configured to move the metal target between the first and second regions, a substrate holder in the second region of the process chamber, and a magnetic assembly in the first region of the process chamber, the magnetic assembly being interposed between the target transfer unit and a wall of the process chamber.

    摘要翻译: 溅射装置包括具有第一和第二区域的处理室,处理室内部的金属靶,处理室内的目标传送单元,目标传送单元构造成在第一和第二区域之间移动金属靶,衬底 保持器在处理室的第二区域中,以及在处理室的第一区域中的磁性组件,磁性组件插入在目标转印单元和处理室的壁之间。