公开(公告)号：US20150135496A1

公开(公告)日：2015-05-21

申请号：US14490981

申请日：2014-09-19

Applicant: Kemet Electronics Corporation

Inventor： Antony P. Chacko ,  Yang Jin ,  Randolph S. Hahn ,  Yongjian Qiu ,  Philip M. Lessner ,  Keith R. Brenneman

IPC: H01G9/00 ,  B05D1/18

CPC classification number: H01G9/0032 ,  B05D1/185 ,  B82Y99/00 ,  H01G9/0036 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/052 ,  H01G9/15 ,  Y10S977/948 ,  Y10T29/417 ,  Y10T29/43

Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.

Abstract translation: 一种制备固体电解电容器的方法，包括应用覆盖增强催化剂，然后施加导电聚合物层。 涂层和固化后除去覆盖增强催化剂。

公开(公告)号：US20140061284A1

公开(公告)日：2014-03-06

申请号：US14018001

申请日：2013-09-04

Applicant: Kemet Electronics Corporation

Inventor： Steven C. Hussey ,  Yuri Freeman ,  Philip M. Lessner ,  Qingping Chen ,  Javaid Qazi

IPC: H01G13/00

CPC classification number: H01G13/00 ,  B23K2101/38 ,  H01G9/012 ,  H01G9/028 ,  H01G9/0425 ,  H01G9/06 ,  H01G9/08 ,  H01G9/15

Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.

Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。

公开(公告)号：US20130250486A1

公开(公告)日：2013-09-26

申请号：US13894679

申请日：2013-05-15

Applicant: Kemet Electronics Corporation

Inventor： Brandon Summey ,  Jeffrey Poltorak ,  Philip M. Lessner ,  Yongjian Qiu ,  Randolph S. Hahn ,  David Jacobs ,  Keith R. Brenneman ,  Albert K. Harrington ,  Chris Stolarski

IPC: H01G9/15 ,  H01G9/00

CPC classification number: H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  H01G9/048 ,  Y10T29/41 ,  Y10T29/417 ,  Y10T29/43

Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

Abstract translation: 描述了改进的固体电解电容器和形成固体电解电容器的方法。 该方法包括形成包括阀金属或阀金属的导电氧化物的阳极，其中阳极引线延伸部从阳极伸出。 在阳极上形成电介质，在电介质上形成阴极层。 阳极，电介质和阴极层被封装在非导电材料中，并且阳极引线延伸部暴露在外壳的外侧的侧表面处。 导电金属层粘附到阳极引线延伸部，其优选地通过将预制的固体金属端子，最优选地L形端子电连接到侧表面处的导电金属层来终止。

公开(公告)号：US12249463B2

公开(公告)日：2025-03-11

申请号：US17233796

申请日：2021-04-19

Applicant: KEMET Electronics Corporation

Inventor： Mark R. Laps ,  John Bultitude ,  Philip M. Lessner ,  Lonnie G. Jones ,  Allen Templeton ,  Nathan A. Reed

IPC: H01G4/258 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38

Abstract: Provided is a heat dissipating capacitor comprising internal electrodes of opposing polarity forming a capacitive couple between external terminations. A dielectric is between the internal electrodes. The heat dissipating capacitor comprises at least one thermal dissipation layer and at least one thermal conductive termination wherein the thermal dissipation layer is in thermally conductive contact with the thermal conductive termination.

公开(公告)号：US11152161B2

公开(公告)日：2021-10-19

申请号：US16558500

申请日：2019-09-03

Applicant: KEMET Electronics Corporation

Inventor： Victor Andoralov ,  Miguel Evaristo ,  Rui A. Monteiro ,  Philip M. Lessner

IPC: H01G11/56 ,  H01G11/48 ,  H01G11/04 ,  H01G11/74

Abstract: An improved capacitor is provided. The capacitor comprises a working element wherein the working element comprises an anode comprising a first dielectric on the anode, a cathode and a conductive separator between the first dielectric and cathode. The conductive separator comprises a separator and a first conductive polymer wherein the first conductive polymer at least partially encapsulates the separator. A second conductive polymer at least partially encapsulates the first conductive polymer and wherein the first conductive polymer has a higher conductivity than the second conductive polymer. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

公开(公告)号：US20210193400A1

公开(公告)日：2021-06-24

申请号：US17197225

申请日：2021-03-10

Applicant: KEMET Electronics Corporation

Inventor： Victor Andoralov ,  Miguel Evaristo ,  Rui A. Monteiro ,  Philip M. Lessner

IPC: H01G11/48 ,  H01G11/56 ,  H01G11/04 ,  H01G11/74

Abstract: An improved capacitor is provided. The capacitor comprises a working element wherein the working element comprises an anode comprising a first dielectric on the anode, a cathode and a conductive separator between the first dielectric and cathode. The conductive separator comprises a separator and a first conductive polymer wherein the first conductive polymer at least partially encapsulates the separator. A second conductive polymer at least partially encapsulates the first conductive polymer and wherein the first conductive polymer has a higher conductivity than the second conductive polymer. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

公开(公告)号：US10950688B2

公开(公告)日：2021-03-16

申请号：US16531255

申请日：2019-08-05

Applicant: KEMET Electronics Corporation

Inventor： John Bultitude ,  Lonnie G. Jones ,  Allen Templeton ,  Philip M. Lessner

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/48

Abstract: Provided herein is a module for packaging semiconductors comprising: at least one PDC comprising parallel internal electrodes of alternating polarity with a paraelectric dielectric between adjacent internal electrodes wherein the paraelectric dielectric has a permittivity above 10 to no more than 300; and wherein the PDC forms a capacitor couple with at least one semiconductor.

公开(公告)号：US20210065994A1

公开(公告)日：2021-03-04

申请号：US16558500

申请日：2019-09-03

Applicant: KEMET Electronics Corporation

Inventor： Victor Andoralov ,  Miguel Evaristo ,  Rui A. Monteiro ,  Philip M. Lessner

IPC: H01G11/48 ,  H01G11/74 ,  H01G11/04 ,  H01G11/56

Abstract: An improved capacitor is provided. The capacitor comprises a working element wherein the working element comprises an anode comprising a first dielectric on the anode, a cathode and a conductive separator between the first dielectric and cathode. The conductive separator comprises a separator and a first conductive polymer wherein the first conductive polymer at least partially encapsulates the separator. A second conductive polymer at least partially encapsulates the first conductive polymer and wherein the first conductive polymer has a higher conductivity than the second conductive polymer. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

公开(公告)号：US10658121B2

公开(公告)日：2020-05-19

申请号：US15787126

申请日：2017-10-18

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Qingping Chen ,  Yaru Shi ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D5/24 ,  C09D165/00 ,  C09D4/06 ,  C09D125/18 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025

Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.

公开(公告)号：US20190311857A1

公开(公告)日：2019-10-10

申请号：US16435762

申请日：2019-06-10

Applicant: KEMET Electronics Corporation

Inventor： Ajaykumar Bunha ,  Antony P. Chacko ,  Yaru Shi ,  Qingping Chen ,  Philip M. Lessner

IPC: H01G9/00 ,  H01G9/042 ,  C09D125/18 ,  C09D5/24 ,  C09D4/06 ,  C09D165/00 ,  C08F212/14 ,  C08F12/30 ,  C09D133/14 ,  C09D7/65 ,  H01G9/15 ,  H01G9/025

Abstract: An improved capacitor is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.