公开(公告)号：US20110247670A1

公开(公告)日：2011-10-13

申请号：US13009361

申请日：2011-01-19

申请人： Mio OHMURA ,  Jun Karasawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Yasuhito Saito

发明人： Mio OHMURA ,  Jun Karasawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Yasuhito Saito

IPC分类号： H01L35/30 ,  H01L35/28

CPC分类号： H01L35/32

摘要： According to one embodiment, a thermoelectric module includes a housing and a power generation member. The housing has a first temperature layer and a second temperature layer, the first temperature layer and the second temperature layer being stacked, the housing further having a cylindrical through-hole provided so as to penetrate the first temperature layer and the second temperature layer. The power generation member has thermoelectric materials stacked such that current flows in one direction in the power generation member, the power generation member being provided in the through-hole so that opposite ends of each of the thermoelectric materials are positioned at the first temperature layer and the second temperature layer, respectively.

摘要翻译： 根据一个实施例，热电模块包括壳体和发电构件。 壳体具有第一温度层和第二温度层，第一温度层和第二温度层被层叠，壳体还具有设置成穿透第一温度层和第二温度层的圆柱形通孔。 发电部件具有堆叠的热电材料，使得电流在发电部件中沿一个方向流动，发电部件设置在通孔中，使得每个热电材料的相对端位于第一温度层， 第二温度层。

公开(公告)号：US07278199B2

公开(公告)日：2007-10-09

申请号：US11344118

申请日：2006-02-01

申请人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Akihiro Hara

发明人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Akihiro Hara

IPC分类号： H01S4/00

CPC分类号： H01L35/06 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34 ,  H05K1/0204 ,  H05K2201/10219 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144

摘要： In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

摘要翻译： 为了提供高度可靠的热电装置，在热电装置中，按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的 散热侧板。 多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。 吸热侧电极与这些热电元件的吸热侧端面滑动接触。

公开(公告)号：US20050132440A1

公开(公告)日：2005-06-16

申请号：US10992670

申请日：2004-11-22

申请人： Keisuke Kasaoka ,  Yasuhito Saito ,  Shigeru Kuwata

发明人： Keisuke Kasaoka ,  Yasuhito Saito ,  Shigeru Kuwata

IPC分类号： C12N15/82 ,  A01H1/00

CPC分类号： C12N15/8216 ,  C12N15/8218 ,  C12N15/8283

摘要： A gene silencing vector according to the present invention comprises a vector which includes a promoter, an enhancer sequence in the downstream of the promoter, and a gene encoding a potyvirus-origin coat protein in the downstream of the enhancer sequence, wherein in order to cause gene silencing of the specific target gene in a host plant, the vector is used with a specific target gene or a gene that is homologous to the target gene inserted in the vicinity of the gene encoding the coat protein.

摘要翻译： 根据本发明的基因沉默载体包含载体，其包含启动子，启动子下游的增强子序列和编码加强子序列下游的病毒源外壳蛋白的基因，其中为了引起 在宿主植物中特异性靶基因的基因沉默，该载体与特异性靶基因或与插入编码外壳蛋白的基因附近的靶基因同源的基因使用。

公开(公告)号：US06861675B2

公开(公告)日：2005-03-01

申请号：US10606762

申请日：2003-06-27

申请人： Taizo Tomioka ,  Ikuo Mori ,  Kenji Ito ,  Mutsumi Suematsu ,  Yasuhito Saito ,  Masayuki Arakawa

发明人： Taizo Tomioka ,  Ikuo Mori ,  Kenji Ito ,  Mutsumi Suematsu ,  Yasuhito Saito ,  Masayuki Arakawa

IPC分类号： H01L25/16 ,  H01L31/167 ,  H01L31/12

CPC分类号： H01L31/167 ,  H01L25/167 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2924/12041 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optically coupled semiconductor device according to the present invention comprises a mount electrode and a wire electrode which are formed on a top main face of the first wiring substrate, a light-emitting element is electrically connected to the mount electrode and the wire electrode, a first electrode pad and a second electrode pad which are provided on the top main face of the second wiring substrate in such a manner as to sandwich the opening formed in the second wiring substrate, a photo-receptor element which is arranged in such a manner as to block the opening formed in the second wiring substrate and which is connected to the first electrode pad so as to face the light-emitting element, and a switching element which is connected to the second electrode pad so as to face the wire.

摘要翻译： 根据本发明的光耦合半导体器件包括安装电极和线电极，其形成在第一布线基板的顶部主面上，发光元件电连接到安装电极和线电极， 第一电极焊盘和第二电极焊盘，其以形成在第二布线基板中的开口的方式设置在第二布线基板的顶部主面上;光接收元件，其布置成 阻止形成在第二布线基板上并与第一电极焊盘相对的开口以面向发光元件;以及开关元件，其与第二电极焊盘相对以面对导线。

公开(公告)号：US06528870B2

公开(公告)日：2003-03-04

申请号：US09769394

申请日：2001-01-26

申请人： Kenta Fukatsu ,  Yasuhito Saito ,  Masayuki Arakawa ,  Tomohiro Iguchi ,  Naotake Watanabe ,  Yoshitoshi Fukuchi ,  Tetsuro Komatsu

发明人： Kenta Fukatsu ,  Yasuhito Saito ,  Masayuki Arakawa ,  Tomohiro Iguchi ,  Naotake Watanabe ,  Yoshitoshi Fukuchi ,  Tetsuro Komatsu

IPC分类号： H01L2302

CPC分类号： H05K3/363 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/144 ,  H05K3/3442 ,  H05K2201/0394 ,  H05K2201/09181 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10681

摘要： In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

摘要翻译： 在具有堆叠在包括基极的基板上的多个半导体器件的叠层型半导体单元中，每个半导体器件具有包括设置在其端部中的外部电极的布线板。 半导体器件堆叠在基板上，使得外部电极彼此对准。 然后，外部电极通过焊料与基板电连接。

公开(公告)号：US06472734B2

公开(公告)日：2002-10-29

申请号：US09799621

申请日：2001-03-07

申请人： Masayuki Arakawa ,  Yasuhito Saito ,  Naotake Watanabe

发明人： Masayuki Arakawa ,  Yasuhito Saito ,  Naotake Watanabe

IPC分类号： H01L2302

CPC分类号： H05K1/144 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586

摘要： A semiconductor device comprises a first wiring board and a second wiring board, wherein the first wiring board includes a first semiconductor element arranged on the underside of the first wiring board, and a second connecting section formed on the underside of the first wiring board, the second wiring board includes a second semiconductor element, and a third connecting section formed on the surface of the second wiring board, the second connecting section has a first external connecting land, the third connecting section is arranged opposite to the first external connecting land and has a second external connecting land which is smaller than the first external connecting land, and the second and third connecting sections are formed such that a combined thickness thereof provides a given space between the first semiconductor element and the second wiring board.

摘要翻译： 半导体器件包括第一布线板和第二布线板，其中第一布线板包括布置在第一布线板的下侧的第一半导体元件和形成在第一布线板的下侧上的第二连接部， 第二布线板包括第二半导体元件和形成在第二布线板的表面上的第三连接部，第二连接部具有第一外部连接台，第三连接部与第一外部连接台相对设置， 第二外部连接区域，其小于第一外部连接区域，第二和第三连接区域形成为使得其组合厚度在第一半导体元件和第二布线板之间提供给定的空间。

公开(公告)号：US5808878A

公开(公告)日：1998-09-15

申请号：US607875

申请日：1996-02-29

申请人： Yasuhito Saito ,  Youko Maekawa ,  Shimpei Yoshioka

发明人： Yasuhito Saito ,  Youko Maekawa ,  Shimpei Yoshioka

IPC分类号： H01L23/552 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K9/00

CPC分类号： H01L25/18 ,  H01L23/552 ,  H01L25/0657 ,  H05K1/0218 ,  H05K1/183 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025

摘要： A circuit substrate which is formed by fixing a wiring pattern on an insulated substrate has a shielding member for absorbing or reflecting radio waves formed on a first electronic component electrically connected. A shielding layer for absorbing or reflecting radio waves is formed on the circuit substrate. And, a second electronic component is disposed between the first electronic component and the shielding layer.

摘要翻译： 通过将布线图案固定在绝缘基板上而形成的电路基板具有用于吸收或反射形成在电连接的第一电子部件上的无线电波的屏蔽部件。 在电路基板上形成用于吸收或反射无线电波的屏蔽层。 并且，第二电子部件设置在第一电子部件和屏蔽层之间。