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162 条记录 (耗时 0.036 秒)

    Substrate holding apparatus
    21.
    发明授权
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US07083507B2

    公开(公告)日：2006-08-01

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B7/22

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

    Substrate holding device and polishing device
    22.
    发明申请
    Substrate holding device and polishing device 有权
    基板保持装置和抛光装置

    公开(公告)号：US20050107015A1

    公开(公告)日：2005-05-19

    申请号：US10497151

    申请日：2002-12-06

    申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    IPC分类号： B24B41/06 ,  B24B5/00

    CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus according to the present invention comprises a top ring body (2) having a receiving space therein, and a vertically movable member (206) which is vertically movable within the receiving space in the top ring body. An abutment member (209) having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane (291) of the abutment member comprises an abutment portion (291b), having a flange (291a) projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion (291c) extending upwardly from a base portion (291d) of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than the abutment portion.

    摘要翻译： 本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体（2）和可在顶环体中的容纳空间内垂直移动的可垂直移动构件（206）。 具有弹性膜的抵接构件（209）附接到可升降构件的下表面。 邻接构件的弹性膜（291）包括邻接部分（291b），其具有向外突出的与基底直接或间接接触的凸缘（291a），以及从基底向上延伸的连接部分（291c） 邻接部分的凸缘的基部（291d）并且连接到可垂直移动的构件。 连接部分由具有高于邻接部分的柔性的材料制成。

    Polishing apparatus
    25.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5860847A

    公开(公告)日：1999-01-19

    申请号：US708948

    申请日：1996-09-06

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Toyomi Nishi ,  Seiji Katsuoka ,  Hiromi Yajima ,  Masako Kodera

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Toyomi Nishi ,  Seiji Katsuoka ,  Hiromi Yajima ,  Masako Kodera

    IPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/04 ,  B24B49/16 ,  H01L21/66 ,  B24B49/00

    CPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/04 ,  B24B49/16 ,  H01L22/26

    摘要： A polishing apparatus has a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring disposed above the turntable for supporting a workpiece to be polished against the abrasive cloth under predetermined pressure. The turntable is rotatable by a first motor through a timing pulley connected to the first motor, and the top ring is rotatable by a second motor through a timing pulley connected to the second motor. A torque detector incorporated in the timing pulley connected to at least one of the first motor and the second motor detects an output torque produced by the at least one of the first motor and the second motor.

    摘要翻译： 抛光装置具有安装在其上表面上的研磨布的转台和设置在转盘上方的顶环，用于在预定压力下将待抛光的工件支撑在磨料上。 转盘可以通过连接到第一马达的定时皮带由第一马达旋转，并且顶环可以通过连接到第二马达的定时皮带的第二马达转动。 并入到与第一电动机和第二电动机中的至少一个连接的正时轮中的转矩检测器检测由第一电动机和第二电动机中的至少一个产生的输出转矩。

    Polishing apparatus
    26.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5839947A

    公开(公告)日：1998-11-24

    申请号：US795511

    申请日：1997-02-05

    申请人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

    发明人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

    IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B53/017

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

    Substrate holding device and polishing device
    27.
    发明授权
    Substrate holding device and polishing device 有权
    基板保持装置和抛光装置

    公开(公告)号：US07033260B2

    公开(公告)日：2006-04-25

    申请号：US10497151

    申请日：2002-12-06

    申请人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    发明人： Tetsuji Togawa ,  Osamu Nabeya ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Teruhiko Ichimura

    IPC分类号： B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061 ,  B24B49/105

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.

    摘要翻译： 本发明涉及一种用于将基板（例如半导体晶片）保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。 根据本发明的基板保持装置包括其中具有容纳空间的顶环主体和可在顶环体中的容纳空间内垂直移动的可垂直移动的构件。 具有弹性膜的邻接构件附接到可垂直移动构件的下表面。 邻接构件的弹性膜包括邻接部分，其具有向外突出的凸缘，与基底直接或间接接触;以及连接部分，其从邻接部分的凸缘的基部向上延伸并连接到 垂直活动件。 连接部由具有高于邻接部的材料的柔软性的材料制成。

    Polishing method
    28.
    发明申请
    Polishing method 审中-公开
    抛光方法

    公开(公告)号：US20060079092A1

    公开(公告)日：2006-04-13

    申请号：US11272825

    申请日：2005-11-15

    申请人： Tetsuji Togawa ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Teruhiko Ichimura

    发明人： Tetsuji Togawa ,  Makoto Fukushima ,  Kunihiko Sakurai ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Teruhiko Ichimura

    IPC分类号： H01L21/461

    CPC分类号： B24B37/30 ,  B24B37/013 ,  B24B37/042 ,  H01L21/30625 ,  Y10S438/977

    摘要： The present invention is relates to a polishing method for polishing a semiconductor wafer (W) by pressing the semiconductor wafer (W) against a polishing surface (10) with use of a top ring (23) for holding the semiconductor wafer (W). A pressure chamber (70) is defined in the top ring (23) by attaching an elastic membrane (60) to a lower surface of a vertically movable member (62). The semiconductor wafer (W) is polished while a pressurized fluid is supplied to the pressure chamber (70) so that the semiconductor wafer (W) is pressed against the polishing surface (10) by a fluid pressure of the fluid. The semiconductor wafer (W) which has been polished is released from the top ring (23) by ejecting the pressurized fluid from an opening (62a) defined centrally in the vertically movable member (62).

    摘要翻译： 本发明涉及通过使用用于保持半导体晶片（W）的顶环（23）将半导体晶片（W）压靠在研磨面（10）上来研磨半导体晶片（W）的研磨方法。 通过将弹性膜（60）附接到可垂直移动的构件（62）的下表面，将压力室（70）限定在顶环（23）中。 抛光半导体晶片（W），同时向压力室（70）供应加压流体，使得半导体晶片（W）通过流体的流体压力被压靠在抛光表面（10）上。 已经被抛光的半导体晶片（W）通过从限定在可垂直移动部件（62）中心的开口（62a）喷射加压流体而从顶环（23）释放。

    Polishing apparatus
    29.
    发明申请
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US20050159082A1

    公开(公告)日：2005-07-21

    申请号：US11078495

    申请日：2005-03-14

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Nobuyuki Takada ,  Satoshi Wakabayashi ,  Kenichiro Saito ,  Masahiko Sekimoto ,  Takuji Hayama ,  Daisuke Koga

    IPC分类号： B24B37/04 ,  H01L21/306 ,  B24B49/00

    CPC分类号： B24B37/345 ,  B24B37/042 ,  H01L21/30625

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括具有抛光表面的转台，用于保持工件的顶环，并将工件压靠抛光表面抛光工件，用于清洁抛光工件的至少三个清洁装置和用于传送抛光工件的转印结构 在至少三个清洁装置之间。 抛光装置还包括旋转输送器，其设置在可由所述顶环接近的位置，并且具有从旋转运送器的旋转中心定位在预定圆周上的多个部分，用于保持工件。

    Substrate holding apparatus
    30.
    发明申请
    Substrate holding apparatus 有权
    基板保持装置

    公开(公告)号：US20050118935A1

    公开(公告)日：2005-06-02

    申请号：US11028629

    申请日：2005-01-05

    申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Keisuke Namiki ,  Hozumi Yasuda ,  Shunichiro Kojima ,  Kunihiko Sakurai ,  Nobuyuki Takada ,  Osamu Nabeya ,  Makoto Fukushima ,  Hideki Takayanagi

    IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B41/06 ,  H01L21/304 ,  B24B1/00

    CPC分类号： B24B37/30 ,  B24B41/061

    摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

    摘要翻译： 本发明涉及一种用于保持待抛光的基板并将基板压靠在抛光表面上的基板保持装置。 基板保持装置包括用于保持基板的顶环体，用于与基板接触的弹性垫，以及用于支撑弹性垫的支撑构件。 基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。 接触构件具有用于与弹性垫接触的弹性膜。 第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。 基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。