公开(公告)号：US5894165A

公开(公告)日：1999-04-13

申请号：US843283

申请日：1997-04-14

申请人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Daryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

发明人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Daryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

IPC分类号： H01L23/44 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L23/49541 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/30107

摘要： A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.

摘要翻译： 一种用于增加集成电路密度的装置和方法，包括至少一对叠加的骰子，其中所述叠加的骰子中的至少一个具有可变地定位在所述骰子的有效表面上的至少一个接合衬垫。 来自引线框架的多根引线指在芯片之间延伸。 引线框架包括至少一个引线，引线具有不均匀的长度和结构，以连接到多个裸片的不同定位的焊盘。 本发明的一个优点是，允许具有不同粘合垫布置的骰子以叠加配置使用以增加电路密度，同时消除在这种配置中使用接合线。

公开(公告)号：US5923672A

公开(公告)日：1999-07-13

申请号：US870085

申请日：1997-06-04

申请人： Gordon D. Roberts ,  Jeffrey D. Bruce ,  Kurt D. Beigel ,  Eric T. Stubbs

发明人： Gordon D. Roberts ,  Jeffrey D. Bruce ,  Kurt D. Beigel ,  Eric T. Stubbs

IPC分类号： G11C17/18 ,  G11C29/00 ,  G06F11/00

CPC分类号： G11C29/785 ,  G11C17/18

摘要： An address detection circuit includes for each bit to be detected, a plurality of antifuse legs connected in parallel. Each of the antifuse legs includes a separate isolation transistor, so that each of the antifuse legs can be separately disabled. For blowing, only one of the antifuse legs is enabled at a time. During conventional operation, all of the antifuse legs are enabled so that the overall resistance of the antifuse legs equals the parallel combination of the resistances of the blown antifuses. Because the parallel combination of the blown antifuses is always less than or equal to the lower of the resistances of the antifuses, only one of the antifuses need be blown properly for the parallel combination to operate properly.

摘要翻译： 地址检测电路包括用于待检测的每个位，并联连接的多个反熔丝脚。 每个反熔丝腿包括单独的隔离晶体管，使得每个反熔丝腿可以单独禁用。 为了吹风，一次只能使能一个反熔丝。 在常规操作期间，所有的反熔丝支腿都被启用，使得反熔丝支脚的整体电阻等于熔断反熔丝的电阻的并联组合。 因为熔断反熔丝的并联组合总是小于或等于反熔丝电阻的较低值，所以只有一个反熔丝需要适当地熔断才能并联组合才能正常工作。

公开(公告)号：US06232148B1

公开(公告)日：2001-05-15

申请号：US09290733

申请日：1999-04-13

申请人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Darryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

发明人： Manny Kin F. Ma ,  Jeffrey D. Bruce ,  Darryl L. Habersetzer ,  Gordon D. Roberts ,  James E. Miller

IPC分类号： H01L2344

CPC分类号： H01L23/49575 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.

摘要翻译： 一种用于增加集成电路密度的装置和方法，包括至少一对叠加的骰子，其中所述叠加的骰子中的至少一个具有可变地定位在所述骰子的有效表面上的至少一个接合衬垫。 来自引线框架的多根引线指在芯片之间延伸。 引线框架包括至少一个引线，引线具有不均匀的长度和结构，以连接到多个裸片的不同定位的焊盘。 本发明的一个优点是，允许具有不同粘合垫布置的骰子以叠加配置使用以增加电路密度，同时消除在这种配置中使用接合线。

公开(公告)号：US5976911A

公开(公告)日：1999-11-02

申请号：US163132

申请日：1998-09-29

申请人： Jeffrey D. Bruce ,  Gordon D. Roberts ,  Aaron M. Schoenfeld

发明人： Jeffrey D. Bruce ,  Gordon D. Roberts ,  Aaron M. Schoenfeld

IPC分类号： H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49531 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111

摘要： A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

公开(公告)号：US6008533A

公开(公告)日：1999-12-28

申请号：US987000

申请日：1997-12-08

申请人： Jeffrey D. Bruce ,  Gordon D. Roberts ,  Aaron M. Schoenfeld

发明人： Jeffrey D. Bruce ,  Gordon D. Roberts ,  Aaron M. Schoenfeld

IPC分类号： H01L23/495 ,  H01L23/52

CPC分类号： H01L23/49531 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111

摘要： A semiconductor assembly includes two leads, a primary die and a secondary support structure. Impedance networks of the secondary support structure establish an impedance between each lead and a different bond pad of the primary die. Although the distances between each bond pad and lead are substantially different, the impedances between each bond pad and lead are substantially the same.

摘要翻译： 半导体组件包括两个引线，一个主晶片和二次支撑结构。 辅助支撑结构的阻抗网络在每个引线和主晶片的不同接合焊盘之间建立阻抗。 虽然每个接合焊盘和引线之间的距离基本上不同，但每个接合焊盘和引线之间的阻抗基本相同。

公开(公告)号：US08147003B2

公开(公告)日：2012-04-03

申请号：US12759036

申请日：2010-04-13

申请人： Jeffrey D. Bruce

发明人： Jeffrey D. Bruce

IPC分类号： B60B7/04

CPC分类号： B60B7/04 ,  B60B7/14

摘要： A wheel ornamentation that can fit vehicle wheels having different offset dimensions. According to one embodiment, the wheel ornamentation is a two-piece wheel cover that includes center and outer components and an adjustable overlapping junction therebetween, where the adjustable overlapping junction may be partially concealed by an annular flange on one of the components. An adhesive portion may be disposed between overlapping axial ends of the components and can be modified during assembly of the ornamentation to a vehicle wheel.

摘要翻译： 可以适应不同偏移尺寸的车轮的车轮装饰。 根据一个实施例，轮子装饰是两件式的轮盖，其包括中心和外部部件以及它们之间的可调节的重叠接合部，其中可调节的重叠连接部分可以被其中一个部件上的环形凸缘部分地隐藏。 粘合部分可以设置在部件的重叠的轴向端部之间，并且可以在将装饰件组装到车轮的过程中进行修改。

公开(公告)号：US06682954B1

公开(公告)日：2004-01-27

申请号：US08791177

申请日：1997-01-31

申请人： Manny Kin F. Ma ,  Jeffrey D. Bruce

发明人： Manny Kin F. Ma ,  Jeffrey D. Bruce

IPC分类号： H01L2144

CPC分类号： H01L24/91 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for upgrading or remediating semiconductor devices utilizing a remediation, adaptation, modification or upgrade chip in a piggyback configuration with a primary bare chip to achieve an upgrade, modification or adaptation of the primary chip or remedy a design or fabrication problem with the primary chip.

摘要翻译： 一种用于利用主裸芯片的搭载配置中的修复，适应，修改或升级芯片来升级或修复半导体器件的方法，以实现初级芯片的升级，修改或改编或补救主芯片的设计或制造问题 。

公开(公告)号：US20100283312A1

公开(公告)日：2010-11-11

申请号：US12759036

申请日：2010-04-13

申请人： Jeffrey D. Bruce

发明人： Jeffrey D. Bruce

IPC分类号： B60B7/04

CPC分类号： B60B7/04 ,  B60B7/14

摘要： A wheel ornamentation that can fit vehicle wheels having different offset dimensions. According to one embodiment, the wheel ornamentation is a two-piece wheel cover that includes center and outer components and an adjustable overlapping junction therebetween, where the adjustable overlapping junction may be partially concealed by an annular flange on one of the components. An adhesive portion may be disposed between overlapping axial ends of the components and can be modified during assembly of the ornamentation to a vehicle wheel.

摘要翻译： 可以适应不同偏移尺寸的车轮的车轮装饰。 根据一个实施例，轮子装饰是两件式的轮盖，其包括中心和外部部件以及它们之间的可调节的重叠接合部，其中可调节的重叠连接部分可以被其中一个部件上的环形凸缘部分地隐藏。 粘合部分可以设置在部件的重叠的轴向端部之间，并且可以在将装饰件组装到车轮的过程中进行修改。

公开(公告)号：US06208018B1

公开(公告)日：2001-03-27

申请号：US08978790

申请日：1997-11-26

申请人： Manny Kin F. Ma ,  Jeffrey D. Bruce

发明人： Manny Kin F. Ma ,  Jeffrey D. Bruce

IPC分类号： H01L2348

CPC分类号： H01L24/73 ,  H01L21/485 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An assembly for upgrading or remediating semiconductor devices utilizing a remediation, adaptation, modification or upgrade chip in a piggyback configuration with a primary bare chip to achieve an upgrade, modification or adaptation of the primary chip or remedy a design or fabrication problem with the primary chip.

摘要翻译： 一种用于利用主裸芯片的搭载配置中的修复，适应，修改或升级芯片来升级或修复半导体器件的组件，以实现主芯片的升级，修改或改编或者补救主芯片的设计或制造问题 。