公开(公告)号：US06671051B1

公开(公告)日：2003-12-30

申请号：US09556238

申请日：2000-04-24

申请人： Mehrdad Nikoonahad ,  Anantha R. Sethuraman ,  Guoheng Zhao

发明人： Mehrdad Nikoonahad ,  Anantha R. Sethuraman ,  Guoheng Zhao

IPC分类号： G01N2155

CPC分类号： B24B49/12 ,  B24B37/005 ,  B24D7/12 ,  G01B11/00 ,  G01B11/0683 ,  G01N21/15 ,  G01N21/94

摘要： Disclosed is a system for detecting anomalies associated with a sample. The system includes an objective arranged proximate to a sample while the sample is undergoing chemical mechanical polishing and a beam source arranged to generate an incident beam and direct the incident beam through the objective and toward the sample while the sample is undergoing chemical mechanical polishing. The system also includes a sensor arranged to detect a scattered beam reflected from at least one anomaly associated with the sample while the sample is undergoing chemical mechanical polishing, the scattered beam being in response to the incident beam. The scattered beam indicates a characteristic of the anomaly, such as particle size.

摘要翻译： 公开了一种用于检测与样本相关联的异常的系统。 该系统包括在样品经历化学机械抛光时靠近样品布置的物镜，以及布置成在样品进行化学机械抛光时产生入射光束并将入射光束引导通过物镜并朝向样品的光束源。 该系统还包括传感器，该传感器布置成在样品进行化学机械抛光时检测从与样品相关联的至少一个异常反射的散射光束，散射光束响应入射光束。 散射光束表示异常的特征，如粒径。

公开(公告)号：US07349090B2

公开(公告)日：2008-03-25

申请号：US09956849

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01J4/00

CPC分类号： G03F7/70616 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to lithography. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，该系统可以被配置为确定样品的多个性质，包括但不限于在光刻之前，期间或之后的样品的性质。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07130029B2

公开(公告)日：2006-10-31

申请号：US09956850

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G01N21/88

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an adhesion characteristic and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US08179530B2

公开(公告)日：2012-05-15

申请号：US12830408

申请日：2010-07-05

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01B11/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/28

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US20100271621A1

公开(公告)日：2010-10-28

申请号：US12830408

申请日：2010-07-05

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01N21/00 ,  G01B11/14 ,  G01B11/00

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07006235B2

公开(公告)日：2006-02-28

申请号：US09956835

申请日：2001-09-20

申请人： Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Gary Bultman ,  Dan Wack ,  John Fielden

发明人： Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Gary Bultman ,  Dan Wack ,  John Fielden

IPC分类号： G01B11/30 ,  G01B11/24 ,  G01B11/00 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, overlay and flatness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US06917433B2

公开(公告)日：2005-07-12

申请号：US09956847

申请日：2001-09-20

申请人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  G01B11/28

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to an etch process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于在蚀刻工艺之前，之中或之后的样品的性质。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06829559B2

公开(公告)日：2004-12-07

申请号：US09957450

申请日：2001-09-20

申请人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01B1500

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US20130039460A1

公开(公告)日：2013-02-14

申请号：US13467042

申请日：2012-05-09

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01N21/47 ,  G01B11/02 ,  G01N23/201 ,  G01N23/223 ,  G01N23/20 ,  G01B11/06 ,  G01B11/24

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06891627B1

公开(公告)日：2005-05-10

申请号：US09956838

申请日：2001-09-20

申请人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01L21/66 ,  G01N21/88 ,  G01B11/04 ,  G01B11/14 ,  G01N21/00

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。