公开(公告)号：US11996393B2

公开(公告)日：2024-05-28

申请号：US17013201

申请日：2020-09-04

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu Shim ,  Hyunwoo Cho

IPC: H01L25/075 ,  H01L21/67 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L21/67253 ,  H01L33/005

Abstract: The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber 300, a roller unit 200 and assembly inspection unit 500. The fluid chamber 300 can accommodate semiconductor light emitting devices 150. Semiconductor light emitting devices 150 can be assembled on an assembly substrate 210. The assembly substrate 210 can be mounted on the roller unit 200. The roller unit 200 can rotate the assembly substrate 210. The assembly inspection unit 500 can inspect the semiconductor light emitting devices 150 assembled on the assembly substrate 210. The roller unit 200 can include a roller rotated part 220 where the assembly substrate 210 is mounted and rotated, a roller driving part 230 for rotating the roller rotated part 220, and a magnet head unit 400 for applying magnetic force to the semiconductor light emitting devices 150 to be assembled on the assembly substrate 210.

公开(公告)号：US10971654B2

公开(公告)日：2021-04-06

申请号：US16894262

申请日：2020-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Kim ,  Changseo Park ,  Bongchu Shim ,  Byoungkwon Cho ,  Hyunwoo Cho

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.

公开(公告)号：US09865572B2

公开(公告)日：2018-01-09

申请号：US15376888

申请日：2016-12-13

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae Wi ,  Byungjoon Rhee ,  Bongchu Shim

IPC: H01L25/075 ,  H01L27/15 ,  H01L23/00 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L33/56 ,  H05K3/32

CPC classification number: H01L25/0753 ,  G06F1/1652 ,  H01L24/29 ,  H01L24/32 ,  H01L24/95 ,  H01L27/156 ,  H01L33/38 ,  H01L33/385 ,  H01L33/504 ,  H01L33/507 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2933/0091 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/10106

Abstract: A display device including a substrate including a wiring electrode; a conductive adhesive layer including an anisotropic conductive medium, and disposed to cover the wiring electrode; and a plurality of semiconductor light emitting devices adhered to the conductive adhesive layer and electrically connected to the wiring electrode through the anisotropic conductive medium. Further, the conductive adhesive layer includes a first layer disposed on the substrate; a second layer deposited on the first layer and including the anisotropic conductive medium; and a third layer deposited on the second layer, to which the semiconductor light emitting devices are adhered. Further, at least one of the second layer and the third layer includes a white pigment configured to reflect light emitted by the semiconductor light emitting device.