MOLD APPARATUS
    21.
    发明申请

    公开(公告)号:US20250153405A1

    公开(公告)日:2025-05-15

    申请号:US18839665

    申请日:2023-02-23

    Abstract: The mold apparatus enables the integration of a plurality of rim-shaped cores each corresponding to the shape of a case forming the exterior of a display device, and thus a plurality of cavities may be formed on a parting surface without having to increase the thickness or size of a mold.

    DISPLAY DEVICE
    22.
    发明申请

    公开(公告)号:US20240387492A1

    公开(公告)日:2024-11-21

    申请号:US18692576

    申请日:2021-09-17

    Abstract: The display device can include a substrate; a barrier rib disposed on the substrate and having an assembly hole; a semiconductor light emitting device in the assembly hole; and an adhesive part between the substrate and the semiconductor light emitting device within the assembly hole. The adhesive part can include adhesive particles in contact with each other.

    DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240387490A1

    公开(公告)日:2024-11-21

    申请号:US18443406

    申请日:2024-02-16

    Abstract: The present disclosure is applicable to a display device-related technology field, for example, relates to a display device using a micro light emitting diode (LED) and a method for manufacturing the same. The display device using the semiconductor light emitting device includes a wiring substrate with a first electrode disposed thereon, a light emitting device disposed on the wiring substrate to constitute a unit sub-pixel, a seating layer located between the wiring substrate and the light emitting device, wherein the seating layer includes a first portion in contact with the light emitting device and a second portion located under the first portion and having an area size greater than an area size of the first portion, a first connection electrode electrically connecting the first electrode to one side of the light emitting device corresponding to a shape of the seating layer, a planarization layer covering the light emitting device and the first connection electrode, and a second connection electrode located on the planarization layer and electrically connected to the other side of the light emitting device.

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND A DISPLAY DEVICE

    公开(公告)号:US20250015057A1

    公开(公告)日:2025-01-09

    申请号:US18588902

    申请日:2024-02-27

    Abstract: A semiconductor light emitting device includes a light emitting layer, a first electrode on a lower side of the light emitting layer, a second electrode on an upper side of the light emitting layer, an insulating layer on a side portion of the light emitting layer and overlapping at least a portion of the first electrode and overlapping at least a portion of the second electrode and a plurality of metal layers spaced apart from each other in the insulating layer, the plurality of metal layers including a first metal layer including a reflective layer and a second metal layer including a magnetic layer.

    SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND DISPLAY DEVICE

    公开(公告)号:US20240322084A1

    公开(公告)日:2024-09-26

    申请号:US18573895

    申请日:2021-07-05

    CPC classification number: H01L33/44 H01L25/167

    Abstract: A semiconductor light emitting device includes a light emitting structure having a first region and a second region along a major axis direction, an insulating layer surrounding a side surface of the first region, and a first electrode surrounding a side surface of the second region. The thickness of the insulating layer is the same as the thickness of the first electrode. Therefore, when implementing a display, lighting defects can be prevented and luminance deviation can be eliminated, thereby improving image quality.

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