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公开(公告)号:US20250153405A1
公开(公告)日:2025-05-15
申请号:US18839665
申请日:2023-02-23
Applicant: LG ELECTRONICS INC.
Inventor: Wonseok CHOI , Mingoan JUNG , Soonho CHOI
Abstract: The mold apparatus enables the integration of a plurality of rim-shaped cores each corresponding to the shape of a case forming the exterior of a display device, and thus a plurality of cavities may be formed on a parting surface without having to increase the thickness or size of a mold.
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公开(公告)号:US20240387492A1
公开(公告)日:2024-11-21
申请号:US18692576
申请日:2021-09-17
Applicant: LG ELECTRONICS INC.
Inventor: Dohan KIM , Wonseok CHOI , Wonjae CHANG , Jinsung KIM
Abstract: The display device can include a substrate; a barrier rib disposed on the substrate and having an assembly hole; a semiconductor light emitting device in the assembly hole; and an adhesive part between the substrate and the semiconductor light emitting device within the assembly hole. The adhesive part can include adhesive particles in contact with each other.
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23.
公开(公告)号:US20240387490A1
公开(公告)日:2024-11-21
申请号:US18443406
申请日:2024-02-16
Applicant: LG ELECTRONICS INC.
Inventor: Byoungkwon CHO , Hongcheol LEE , Wonseok CHOI
Abstract: The present disclosure is applicable to a display device-related technology field, for example, relates to a display device using a micro light emitting diode (LED) and a method for manufacturing the same. The display device using the semiconductor light emitting device includes a wiring substrate with a first electrode disposed thereon, a light emitting device disposed on the wiring substrate to constitute a unit sub-pixel, a seating layer located between the wiring substrate and the light emitting device, wherein the seating layer includes a first portion in contact with the light emitting device and a second portion located under the first portion and having an area size greater than an area size of the first portion, a first connection electrode electrically connecting the first electrode to one side of the light emitting device corresponding to a shape of the seating layer, a planarization layer covering the light emitting device and the first connection electrode, and a second connection electrode located on the planarization layer and electrically connected to the other side of the light emitting device.
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公开(公告)号:US20240355788A1
公开(公告)日:2024-10-24
申请号:US18685475
申请日:2021-08-26
Applicant: LG ELECTRONICS INC.
Inventor: Sungmin PARK , Byoungkwon CHO , Wonseok CHOI
IPC: H01L25/075 , H01L33/22 , H01L33/44 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/22 , H01L33/44 , H01L33/62
Abstract: A semiconductor light emitting device includes a light emitting part, a first electrode including a bonding layer below the light emitting part, a barrier around the bonding layer, a second electrode on the light emitting part, and a passivation layer to surround the light emitting part and the second electrode.
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25.
公开(公告)号:US20230135290A1
公开(公告)日:2023-05-04
申请号:US17798798
申请日:2020-03-23
Applicant: LG ELECTRONICS INC.
Inventor: Wonseok CHOI , Soohyun KIM , Sungmin PARK
Abstract: Discussed is a display device that can include a base unit, a data wire and a gate wire arranged in columns and rows, respectively, and on the base unit to intersect each other, a power wire extending in a same direction as the data wire, thin film transistors connected to the data wire and the gate wire, and a semiconductor light-emitting diode electrically connected to the thin film transistors. A pair of residual assembly electrodes overlapping the semiconductor light-emitting diode are also provided.
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公开(公告)号:US20180309017A1
公开(公告)日:2018-10-25
申请号:US15959974
申请日:2018-04-23
Applicant: LG ELECTRONICS INC.
Inventor: Wonseok CHOI , Gunho KIM
IPC: H01L31/18 , H01L31/068 , H01L31/0735 , H01L31/0687 , H01L31/0304
CPC classification number: H01L31/1844 , H01L31/03042 , H01L31/03046 , H01L31/068 , H01L31/0687 , H01L31/0693 , H01L31/0725 , H01L31/0735 , Y02E10/544 , Y02P70/521
Abstract: Disclosed is a method of manufacturing a compound semiconductor solar cell according to an embodiment of the invention. The method of manufacturing the compound semiconductor solar cell according to the embodiment of the invention includes forming a plurality of compound semiconductor layers of at least two elements and including a base layer and an emitter layer, the base layer including a first conductivity type dopant to have a first conductivity type and the emitter layer including a second conductivity type dopant to have a second conductivity type. The forming of the plurality of compound semiconductor layers includes at least one of a process-temperature change period and a growth-rate change period.
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公开(公告)号:US20180248059A1
公开(公告)日:2018-08-30
申请号:US15904019
申请日:2018-02-23
Applicant: LG ELECTRONICS INC.
Inventor: Soohyun KIM , Gunho KIM , Hyun LEE , Wonseok CHOI , Younho HEO
IPC: H01L31/0352 , H01L31/0224 , H01L31/18 , H01L31/0735
CPC classification number: H01L31/035281 , H01L31/022425 , H01L31/0735 , H01L31/184 , H01L31/1844 , H01L31/186 , H01L31/1892 , Y02E10/544 , Y02P70/521
Abstract: A compound semiconductor solar cell and a method of manufacturing the same are disclosed. The compound semiconductor solar cell includes a compound semiconductor layer, a front electrode positioned on a front surface of the compound semiconductor layer, a back electrode positioned on a back surface of the compound semiconductor layer, a defect portion disposed within the compound semiconductor layer and physically and electrically connected to the back electrode, and an isolation portion surrounding the defect portion.
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公开(公告)号:US20250015057A1
公开(公告)日:2025-01-09
申请号:US18588902
申请日:2024-02-27
Applicant: LG ELECTRONICS INC.
Inventor: Byoungkwon CHO , Hyeyoung YANG , Wonseok CHOI
IPC: H01L25/075 , H01L33/46 , H01L33/62
Abstract: A semiconductor light emitting device includes a light emitting layer, a first electrode on a lower side of the light emitting layer, a second electrode on an upper side of the light emitting layer, an insulating layer on a side portion of the light emitting layer and overlapping at least a portion of the first electrode and overlapping at least a portion of the second electrode and a plurality of metal layers spaced apart from each other in the insulating layer, the plurality of metal layers including a first metal layer including a reflective layer and a second metal layer including a magnetic layer.
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公开(公告)号:US20240372041A1
公开(公告)日:2024-11-07
申请号:US18685024
申请日:2021-08-20
Applicant: LG ELECTRONICS INC.
Inventor: Byoungkwon CHO , Jaehyuk LEE , Wonseok CHOI , Chilkeun PARK
IPC: H01L33/42 , H01L25/075 , H01L33/54 , H01L33/62
Abstract: A lens driving device according to an embodiment includes a substrate, a first frame including a lens and disposed on the substrate, a second frame on which the first frame is placed and a third frame on which the second frame is disposed. The first frame may move in a Z-axis direction, the second frame may tilt in X-axis and Y-axis directions and rotate around the Z axis, and the third frame may include a stopper structure to limit tilting and rotation of the second frame.
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公开(公告)号:US20240322084A1
公开(公告)日:2024-09-26
申请号:US18573895
申请日:2021-07-05
Applicant: LG ELECTRONICS INC.
Inventor: Jinsung KIM , Wonjae CHANG , Wonseok CHOI
CPC classification number: H01L33/44 , H01L25/167
Abstract: A semiconductor light emitting device includes a light emitting structure having a first region and a second region along a major axis direction, an insulating layer surrounding a side surface of the first region, and a first electrode surrounding a side surface of the second region. The thickness of the insulating layer is the same as the thickness of the first electrode. Therefore, when implementing a display, lighting defects can be prevented and luminance deviation can be eliminated, thereby improving image quality.
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