公开(公告)号：US20120111038A1

公开(公告)日：2012-05-10

申请号：US12939563

申请日：2010-11-04

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F25B1/00 ,  F28F7/00 ,  F25B29/00 ,  F25D31/00 ,  F25B39/02

CPC分类号： H05K7/208 ,  F25B39/02 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/06 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49826

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便制冷剂流过蒸发器。 该装置还包括与制冷剂回路流体连通的压缩机，耦合到制冷剂蒸发器的空气冷却散热器，用于在备用空气冷却模式中向电子部件提供备用冷却，以及耦合到 散热器。 制冷剂加热器通过散热器与通过制冷剂蒸发器的制冷剂热连通，并且被控制在主要的冷冻冷却模式中，以对通过制冷剂蒸发器的制冷剂施加辅助热负荷，以确保制冷剂回路中的制冷剂 进入压缩机处于过热的热力学状态。

公开(公告)号：US20120026691A1

公开(公告)日：2012-02-02

申请号：US12845374

申请日：2010-07-28

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20781

摘要： Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.

摘要翻译： 提供了用于促进电子机架的一个或多个部件的冷却的装置和方法。 该装置包括与要冷却的电子部件相关联的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通地连接以从冷却剂接收冷却剂并供应冷却剂 到液冷结构。 热交换器设置在包含机架的数据中心的冷空气室内的电子机架的外部，并且气室与冷空气源耦合，从而向数据中心提供冷却的空气。 冷空气通风室的冷却空气穿过热交换器并冷却通过热交换器的冷却剂，冷却剂将通过其的冷却剂的热量散发到通过热交换器的冷空气中，以促进电子部件相关联的液体冷却 具有液冷结构。

公开(公告)号：US20120024501A1

公开(公告)日：2012-02-02

申请号：US12845355

申请日：2010-07-28

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： H05K7/2079 ,  H05K7/20836

摘要： Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop for receiving coolant from and supply coolant to the liquid-cooled structure. A thermoelectric array is disposed with first and second coolant loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the liquid-to-air heat exchanger for cooling thereof.

摘要翻译： 提供了热电增强型液体冷却装置和方法，以便于电子机架的一个或多个部件的冷却。 该装置包括与要冷却的部件热连通的液冷结构，以及液 - 空热交换器，其经由冷却剂回路与液冷结构流体连通，用于接收冷却剂和供应 冷却液流向液冷结构。 热电阵列设置有与阵列的第一和第二侧热接触的第一和第二冷却剂回路部分。 热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。 通过第一和第二环路部分的冷却剂通过液体 - 空气热交换器进行冷却。

公开(公告)号：US20110317367A1

公开(公告)日：2011-12-29

申请号：US12825781

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20809

摘要： Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

摘要翻译： 提供液冷电子机架，包括：浸入式冷却电子子系统; 蒸气冷凝热交换器，用于冷凝从浸没冷却的电子子系统排出的介质流体蒸气; 介电流体蒸汽返回联接器，其使浸没冷却的电子子系统的蒸汽出口和蒸汽冷凝热交换器流体连通; 用于保持介电流体的储存器; 重力排放管线，其耦合以将介电流体冷凝物从所述蒸汽冷凝热交换器排出到所述储存器; 设置在储存器内的浸没式次冷热交换器; 介质流体供应歧管联接以使浸没冷却的电子子系统的储存器和电介质流体入口流体连通; 以及用于将压力介质流体从储存器供应到介电流体供应歧管的泵，用于将浸没冷却的电子子系统内的介质流体保持在液态。

公开(公告)号：US20110315355A1

公开(公告)日：2011-12-29

申请号：US12825756

申请日：2010-06-29

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00 ,  F25B41/00

CPC分类号： H05K7/20809 ,  F28D15/02

摘要： Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment in an upper portion of the compartment. The condenser fins facilitate cooling of dielectric fluid vapor rising to the upper portion of the compartment. A filler material is disposed within the sealed compartment to reduce the amount of dielectric fluid required within the compartment to achieve immersion-cooling of the electronic subsystem, and the filler material includes a shaped surface to direct dielectric fluid vapor within the compartment towards the condenser fins.

摘要翻译： 提供冷却装置和方法用于电子机架的电子子系统的浸没冷却。 冷却装置包括至少部分围绕电子子系统和形成密封隔室的外壳，以及设置在密封室内的电介质流体，电子子系统浸没在电介质流体内。 提供了一种液体冷却的蒸汽冷凝器，其包括在隔室的上部中在密封隔室内延伸的多个导热冷凝器翅片。 冷凝器翅片有助于冷却上升到隔室上部的介质流体蒸气。 填充材料设置在密封隔室内以减少隔室内所需的介电流体的量以实现电子子系统的浸没冷却，并且填充材料包括成形表面，以将隔室内的介质流体蒸气导向冷凝器翅片 。

公开(公告)号：US20110290448A1

公开(公告)日：2011-12-01

申请号：US12787807

申请日：2010-05-26

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00 ,  F28F1/10

CPC分类号： H05K7/202 ,  F28D1/0471 ,  F28D1/0475 ,  F28D1/05366 ,  F28D2021/0038 ,  F28F1/126 ,  F28F1/32 ,  F28F17/005 ,  H05K7/20218 ,  H05K7/20318 ,  H05K7/20572 ,  H05K7/20609 ,  H05K7/20627 ,  H05K7/20645 ,  H05K7/20736 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

摘要： Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

摘要翻译： 为电子机架提供除湿冷却装置和方法。 该装置包括设置在机架的空气入口侧或出口侧的空气 - 液体热交换器，其中空气从进气口流过空气出口侧。 热交换器被定位成用于空气通过电子机架以通过热交换器，并且与冷却剂回路流体连通，以在低于通过热交换器的空气的露点温度的温度下使冷却剂通过其中，使得 通过热交换器的空气被除湿并冷却。 设置在热交换器下方的冷凝水收集器从通过电子机架的空气的除湿收集液体冷凝物，其中热交换器包括多个倾斜表面，其被构造成便于将液体冷凝物从热交换器排出到冷凝水收集器。

公开(公告)号：US20110103019A1

公开(公告)日：2011-05-05

申请号：US12985562

申请日：2011-01-06

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  H05K7/20236

摘要： A method and associated assembly are provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it through one or more ports or orifices placed on the sides or both side and bottom of the cold plate. The placement, size and number of port(s) or orifice(s) can be selectively adjusted to control amount of coolant flow. Effluent flow from the cold plate flows over the remaining immersion cooled components and then exits the liquid tight enclosure which houses the electronic components.

摘要翻译： 提供了一种用于冷却具有电子部件的计算实施例的方法和相关组件。 发热部件设置在提供直接液体冷却的至少一个冷板的附近。 将冷却剂提供给冷板，冷板最终将通过设置在冷板的侧面或两侧和底部的一个或多个端口或孔排出。 可以选择性地调整端口或孔口的布置，尺寸和数量，以控制冷却剂流量。 来自冷板的流出物流过剩余的浸没冷却部件，然后离开容纳电子部件的液体密封外壳。

公开(公告)号：US20110069453A1

公开(公告)日：2011-03-24

申请号：US12565175

申请日：2009-09-23

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20827

摘要： Apparatus and method are provided for two-phase dielectric cooling of an electronic device. The apparatus includes a coolant flow path, a vapor condenser and one or more vapor fans. The coolant flow path is in fluid communication with the electronic device, where liquid dielectric coolant within the flow path vaporizes upon contacting the electronic device, forming dielectric coolant vapor, and thereby facilitating cooling of the electronic device. The vapor condenser is also in fluid communication with the coolant flow path and facilitates condensate formation from the dielectric coolant vapor. The one or more vapor fans are disposed within the flow path to actively move dielectric coolant vapor into contact with the vapor condenser, and thereby enhance cooling of the electronic device by facilitating coolant condensate formation and thus recirculation of the coolant condensate as liquid dielectric coolant.

摘要翻译： 提供了用于电子设备的两相电介质冷却的装置和方法。 该装置包括冷却剂流路，蒸汽冷凝器和一个或多个蒸气风扇。 冷却剂流动路径与电子设备流体连通，其中流动路径内的液体电介质冷却剂在接触电子设备时蒸发，形成电介质冷却剂蒸汽，从而便于电子设备的冷却。 蒸汽冷凝器还与冷却剂流动路径流体连通，并且有助于从电介质冷却剂蒸气形成冷凝物。 一个或多个蒸汽风扇设置在流动路径内以主动地移动介质冷却剂蒸汽与蒸汽冷凝器接触，从而通过促进冷却剂冷凝物的形成并因此使冷却剂冷凝物作为液体电介质冷却剂再循环来增强电子设备的冷却。

公开(公告)号：US20110060470A1

公开(公告)日：2011-03-10

申请号：US12556066

申请日：2009-09-09

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/32 ,  G05D7/06 ,  G05D23/19

CPC分类号： G06F1/206 ,  G05D23/1934 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

摘要： A cooling system and method are provided for facilitating cooling of a liquid-cooled electronics rack. The cooling system includes a coolant flow controller, a modular cooling unit and a pressure controller. The flow controller is associated with a respective electronics rack and controls flow of coolant through that electronics rack based on its changing cooling requirements. The cooling unit includes an adjustable coolant pump for facilitating supply of coolant to the rack. The pressure controller is associated with the cooling unit for controlling pressure of coolant at an output of the cooling unit via control of pump speed of the pump. Responsive to adjusting coolant flow through the electronics rack, the pressure controller automatically adjusts pump speed of the adjustable pump to maintain pressure about a constant coolant pressure set point at an output of the cooling unit, thereby conserving power while still cooling the liquid-cooled electronics rack.

摘要翻译： 提供了一种冷却系统和方法，用于促进液冷电子机架的冷却。 冷却系统包括冷却剂流量控制器，模块化冷却单元和压力控制器。 流量控制器与相应的电子机架相关联，并且基于其变化的冷却要求来控制冷却剂通过该电子机架的流动。 冷却单元包括可调节的冷却剂泵，以便于冷却剂供应到机架。 压力控制器与冷却单元相关联，用于通过控制泵的泵速来控制冷却单元的输出处的冷却剂的压力。 响应于调节通过电子机架的冷却剂流量，压力控制器自动调节可调节泵的泵速，以保持在冷却单元的输出端处的恒定的冷却剂压力设定点的压力，从而节省电力，同时仍然冷却液冷电子 架。

公开(公告)号：US20090223234A1

公开(公告)日：2009-09-10

申请号：US12031982

申请日：2008-02-15

申请人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F27/00 ,  F25B49/00 ,  G05D23/00 ,  G06F1/20

CPC分类号： F24F11/0001 ,  G06F1/20 ,  H05K7/20836

摘要： Monitoring method and system are provided for dynamically determining airflow rate through and heat removal rate of an air-conditioning unit, such as a computer room air-conditioning unit. The method includes: sensing inlet and outlet temperatures of fluid passing through a heat exchanger associated with the air-conditioning unit; sensing air temperature at an air inlet side of the heat exchanger; automatically determining at least one of airflow rate through or heat removal rate of the air-conditioning unit, the automatically determining employing the sensed inlet temperature and outlet temperature of fluid passing through the heat exchanger, and the sensed air temperature at the air inlet side of the heat exchanger; and outputting the determined airflow rate through or heat removal rate of the air-conditioning unit. In one embodiment, the heat exchanger is an auxiliary air-to-air heat exchanger, and in another embodiment, the heat exchanger is the air-to-liquid heat exchanger of the air-conditioner.

摘要翻译： 提供监测方法和系统，用于动态地确定诸如计算机室空调单元之类的空调单元的空气流量和排热率。 该方法包括：检测通过与空调单元相关联的热交换器的流体的入口和出口温度; 感测热交换器的空气入口侧的空气温度; 自动确定空气调节单元的气流速率或排热速率中的至少一个，使用感测到的通过热交换器的流体的入口温度和出口温度以及感测到的空气入口侧的空气温度的自动确定 热交换器; 并输出所确定的空气流量通过或所述空调单元的除热率。 在一个实施例中，热交换器是辅助空气 - 空气热交换器，在另一个实施例中，热交换器是空调器的空气 - 液体热交换器。